JPH02101538U - - Google Patents

Info

Publication number
JPH02101538U
JPH02101538U JP1989009812U JP981289U JPH02101538U JP H02101538 U JPH02101538 U JP H02101538U JP 1989009812 U JP1989009812 U JP 1989009812U JP 981289 U JP981289 U JP 981289U JP H02101538 U JPH02101538 U JP H02101538U
Authority
JP
Japan
Prior art keywords
board
lead
connection part
horizontal
bent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989009812U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989009812U priority Critical patent/JPH02101538U/ja
Publication of JPH02101538U publication Critical patent/JPH02101538U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例に係るＩＣリードを
示す縦断面図、第２図は他の実施例のＩＣリード
を示す縦断面図、第３図と第４図は従来のＩＣリ
ードを示す縦断面図である。 １，１１……ＩＣリード、３，１３……ＩＣ接
続部、４，１４……屈曲部、５，１５……基板用
接続部。 FIG. 1 is a vertical cross-sectional view showing an IC lead according to one embodiment of the present invention, FIG. 2 is a vertical cross-sectional view showing an IC lead according to another embodiment, and FIGS. 3 and 4 are cross-sectional views of a conventional IC lead. FIG. 1, 11...IC lead, 3, 13...IC connection part, 4, 14...bending part, 5, 15...board connection part.

Claims (1)

【実用新案登録請求の範囲】 ＩＣに接続される水平なＩＣ接続部と、基板に
接続される水平な基板用接続部とを有するＩＣリ
ードであつて、 前記基板用接続部が、ＩＣ下面の斜め外側に配
され、 かつＩＣ接続部と基板用接続部間に、微小角で
屈曲する屈曲部が形成されていることを特徴とす
るＩＣリード。[Claims for Utility Model Registration] An IC lead having a horizontal IC connection part connected to an IC and a horizontal board connection part connected to a board, wherein the board connection part is located on the lower surface of the IC. An IC lead characterized in that the IC lead is arranged diagonally outward and has a bent part bent at a minute angle between the IC connecting part and the board connecting part.
JP1989009812U 1989-01-30 1989-01-30 Pending JPH02101538U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989009812U JPH02101538U (en) 1989-01-30 1989-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989009812U JPH02101538U (en) 1989-01-30 1989-01-30

Publications (1)

Publication Number Publication Date
JPH02101538U true JPH02101538U (en) 1990-08-13

Family

ID=31216886

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989009812U Pending JPH02101538U (en) 1989-01-30 1989-01-30

Country Status (1)

Country Link
JP (1) JPH02101538U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62165941A (en) * 1986-01-18 1987-07-22 Nec Corp Tape carrier system ic
JPS62171132A (en) * 1986-01-23 1987-07-28 Oki Electric Ind Co Ltd Method of mounting semiconductor chip
JPS63211730A (en) * 1987-02-27 1988-09-02 Nec Corp Mounting structure of electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62165941A (en) * 1986-01-18 1987-07-22 Nec Corp Tape carrier system ic
JPS62171132A (en) * 1986-01-23 1987-07-28 Oki Electric Ind Co Ltd Method of mounting semiconductor chip
JPS63211730A (en) * 1987-02-27 1988-09-02 Nec Corp Mounting structure of electronic part

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