JPH02101206U - - Google Patents
Info
- Publication number
- JPH02101206U JPH02101206U JP1044789U JP1044789U JPH02101206U JP H02101206 U JPH02101206 U JP H02101206U JP 1044789 U JP1044789 U JP 1044789U JP 1044789 U JP1044789 U JP 1044789U JP H02101206 U JPH02101206 U JP H02101206U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- displacement meter
- laser displacement
- setting jig
- vertical laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 claims description 7
- 238000001514 detection method Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Description
第1図は本考案の第1の実施例に係るリード曲
がり検出装置の構成を示す図、第2図は本考案の
第2の実施例に係るリード曲がり検出装置の構成
を示す図、第3図は従来のV型レーザ変位計を使
用したリード曲がり検出装置の構成を示す図、第
4図は垂直型レーザ変位計を使用した従来のリー
ド曲がり検出装置の構成を示す図である。
1;セツト治具、2;半導体装置、3;リード
、4;V型レーザ変位計、5;レーザ光、6;垂
直型レーザ変位計、7;凹部、8;段部。
1 is a diagram showing the configuration of a lead bend detection device according to a first embodiment of the present invention, FIG. 2 is a diagram showing the configuration of a lead bend detection device according to a second embodiment of the present invention, and FIG. This figure shows the configuration of a conventional lead bending detection device using a V-type laser displacement meter, and FIG. 4 shows the configuration of a conventional lead bending detection device using a vertical laser displacement meter. 1: Setting jig, 2: Semiconductor device, 3: Lead, 4: V-type laser displacement meter, 5: Laser light, 6: Vertical laser displacement meter, 7: Concave portion, 8: Step portion.
Claims (1)
セツトするセツト治具と、このセツト治具にセツ
トされた半導体装置のリード直上からレーザ光を
照射してその反射光に基づいてリード曲がりを検
出する垂直型レーザ変位計とを備えた半導体装置
のリード曲がり検出装置において、前記セツト治
具は、前記レーザ光が照射される領域の面を前記
垂直型レーザ変位計の有効動作範囲を超える位置
まで前記垂直型レーザ変位計から離間させたもの
であることを特徴とする半導体装置のリード曲が
り検出装置。 A setting jig for setting a semiconductor device to be inspected at a predetermined inspection position, and a laser beam irradiated from directly above the leads of the semiconductor device set in this setting jig to detect lead bending based on the reflected light. In the semiconductor device lead bend detection device including a vertical laser displacement meter, the setting jig moves the surface of the region irradiated with the laser beam to a position beyond the effective operating range of the vertical laser displacement meter. A lead bend detection device for a semiconductor device, characterized in that the device is separated from a vertical laser displacement meter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1044789U JPH02101206U (en) | 1989-01-31 | 1989-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1044789U JPH02101206U (en) | 1989-01-31 | 1989-01-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02101206U true JPH02101206U (en) | 1990-08-13 |
Family
ID=31218118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1044789U Pending JPH02101206U (en) | 1989-01-31 | 1989-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02101206U (en) |
-
1989
- 1989-01-31 JP JP1044789U patent/JPH02101206U/ja active Pending
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