JPH0199229A - Belt conveyor for semiconductor wafer - Google Patents
Belt conveyor for semiconductor waferInfo
- Publication number
- JPH0199229A JPH0199229A JP62258104A JP25810487A JPH0199229A JP H0199229 A JPH0199229 A JP H0199229A JP 62258104 A JP62258104 A JP 62258104A JP 25810487 A JP25810487 A JP 25810487A JP H0199229 A JPH0199229 A JP H0199229A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- wafer
- belt
- conveyor belt
- predetermined position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 51
- 235000012431 wafers Nutrition 0.000 claims description 48
- 238000001514 detection method Methods 0.000 claims description 9
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000007723 transport mechanism Effects 0.000 claims description 5
- 230000032258 transport Effects 0.000 claims 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Delivering By Means Of Belts And Rollers (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造装置において、製造装置内部
或いは製造装置相互間で半導体ウェハーを移動させるベ
ルト式半導体ウェハー搬送機構に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a belt-type semiconductor wafer transport mechanism for moving semiconductor wafers within or between manufacturing apparatuses in a semiconductor device manufacturing apparatus.
従来、この種のベルト式半導体ウェハー搬送機構は第3
図に示すように半導体ウェハー7を支持し移動させる搬
送ベルト1と、ベルト1を支持するプーリ2と、搬送ベ
ルト1に動力を与えるモータ3と、半導体ウェハーの検
出を行うセンサ10と。Conventionally, this type of belt-type semiconductor wafer transport mechanism
As shown in the figure, a conveyor belt 1 that supports and moves a semiconductor wafer 7, a pulley 2 that supports the belt 1, a motor 3 that provides power to the conveyor belt 1, and a sensor 10 that detects the semiconductor wafer.
半導体ウェハーを所定の位置に停止させるために搬送経
路上に設置されたストッパ11と、センサ10の出力に
よりモータ3の運、転を制御する制御回路6′と、支持
架5とから構成されており、半導体ウェハー7を所定の
位置で停止させる場合、ストッパ11により半導体ウェ
ハーを停止させた後、搬送ベルト1を停止させることに
より行われていた。It is composed of a stopper 11 installed on the transport path to stop the semiconductor wafer at a predetermined position, a control circuit 6' that controls the operation of the motor 3 based on the output of the sensor 10, and a support rack 5. In order to stop the semiconductor wafer 7 at a predetermined position, the semiconductor wafer is stopped by the stopper 11, and then the conveyor belt 1 is stopped.
上述した従来の半導体ウェハーの停止方法は、搬送ベル
ト1の停止をストッパ11の手前に配されたセンサ10
が半導体ウェハー7を検出した後、半導体ウェハー7が
センサlOよりストッパ11まで移動するのに要する時
間に搬送ベルトの張力、表面状態の変化により発生する
搬送ベルト速度の変化に対する余裕時間を加えた遅延時
間をもって行うため、半導体ウェハー7がストッパ11
により停止した後も搬送ベルト1は搬送ベルト速度変化
に対する余裕時間分動きつづける。そのため、半導体ウ
ェハー7の裏面と搬送ベル1〜1とが擦れあい、ゴミが
発生し半導体ウェハー7に付着するという問題点があっ
た。The conventional semiconductor wafer stopping method described above uses a sensor 10 disposed in front of a stopper 11 to stop the conveyor belt 1.
After detecting the semiconductor wafer 7, the delay is the time required for the semiconductor wafer 7 to move from the sensor IO to the stopper 11, plus the margin time for changes in the conveyor belt speed caused by changes in conveyor belt tension and surface condition. In order to take time, the semiconductor wafer 7 is placed at the stopper 11.
Even after the conveyor belt 1 is stopped, the conveyor belt 1 continues to move for an allowance time for a change in the conveyor belt speed. Therefore, there was a problem in that the back surface of the semiconductor wafer 7 and the transport bells 1 to 1 rubbed against each other, and dust was generated and adhered to the semiconductor wafer 7.
本発明の目的は前記問題点を解消した半導体ウェハーの
ベルト式搬送装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a belt-type conveyance device for semiconductor wafers that eliminates the above-mentioned problems.
上述した従来のベルト式搬送装置に対し、本発明はスト
ッパを用いず、半導体ウェハーを所定の位置に停止させ
るという相違点を有する。The present invention differs from the above-described conventional belt-type conveying device in that it does not use a stopper and stops the semiconductor wafer at a predetermined position.
本発明は半導体ウェハーを搬送する搬送機構と、半導体
ウェハーの進行方向に平行に配された複数の半導体ウェ
ハー検出機構と、前記半導体ウェハー検出機構相互間の
半導体ウェハー検出時間差により半導体ウェハーの所定
停止位置到達時間を算出し前記搬送機構の駆動停止指令
を発する制御回路とを有することを特徴とする半導体ウ
ェハーのベルト式搬送装置である。The present invention includes a transport mechanism for transporting a semiconductor wafer, a plurality of semiconductor wafer detection mechanisms disposed in parallel to the direction in which the semiconductor wafer travels, and a semiconductor wafer detection time difference between the semiconductor wafer detection mechanisms to a predetermined stop position of the semiconductor wafer. The present invention is a belt-type conveyance device for semiconductor wafers, characterized in that it has a control circuit that calculates the arrival time and issues a command to stop driving the conveyance mechanism.
以下1本発明の実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
(実施例1) 第1図は本発明の第1の実施例を示す構成図である。(Example 1) FIG. 1 is a block diagram showing a first embodiment of the present invention.
第1図において、支持架5の前後端に取付けた2個のプ
ーリ2,2間に搬送ベルト1を懸は渡し、該ベルト1の
一部をプーリ2’、2’により方向転換してモータ3に
懸は渡す。In FIG. 1, a conveyor belt 1 is suspended between two pulleys 2, 2 attached to the front and rear ends of a support rack 5, and a part of the belt 1 is changed direction by pulleys 2', 2' to drive a motor. Pass the stake to 3.
本発明は搬送ベルト1による搬送経路に沿って、半導体
ウェハー7を検出する2個の反射式赤外線センサ4a、
4bを前後方向に一定距離を保って設置し、さらに、
2個の反射式赤外線センサ4a、 4b相相互間の半導
体ウェハー検出時間差により半導体ウェハーの所定停止
位置到達時間を算出しベルト1の駆動停止指令を発する
制御回路6を装備したものである。The present invention includes two reflective infrared sensors 4a for detecting the semiconductor wafer 7 along the conveyance path by the conveyor belt 1;
4b is installed keeping a certain distance in the front and back direction, and further,
It is equipped with a control circuit 6 which calculates the time required for the semiconductor wafer to reach a predetermined stop position based on the semiconductor wafer detection time difference between the two reflective infrared sensors 4a and 4b, and issues a command to stop driving the belt 1.
実施例において、制御回路6は進行方向手前側の反射式
赤外線センサ4aが半導体ウェハー7を検出してから進
行方向後方にある反射式赤外線センサ4bが半導体ウェ
ハー7を検出するまでの時間t1を求め反射式赤外線セ
ンサ4a、 4b相互間の距離Q。In the embodiment, the control circuit 6 determines the time t1 from when the reflective infrared sensor 4a on the front side in the traveling direction detects the semiconductor wafer 7 until the reflective infrared sensor 4b on the rear side in the traveling direction detects the semiconductor wafer 7. Distance Q between reflective infrared sensors 4a and 4b.
と進行方向後方にある反射式赤外線センサ4bと所定の
半導体ウェハー停止位置間の距離2□との比Q2/Qx
により、進行方向後方にある反射式赤外線センサ4bが
半導体ウェハーを検出した後、半導体ウェハー7が所定
の位置に達するまでの時間1.=11・Qz / o、
1を求め、ベルト1の駆動を停止させることにより半導
体ウェハー7を所定の位置で停止させる。and the distance 2□ between the reflective infrared sensor 4b located at the rear in the direction of travel and the predetermined semiconductor wafer stopping position Q2/Qx
Therefore, the time required for the semiconductor wafer 7 to reach a predetermined position after the reflective infrared sensor 4b located at the rear in the traveling direction detects the semiconductor wafer is 1. =11・Qz/o,
1 is determined, and by stopping the driving of the belt 1, the semiconductor wafer 7 is stopped at a predetermined position.
(実施例2)
第2図は本発明の実施例2の概略図であり、本発明をス
ピンナーチャック上への半導体ウェハー搬送に利用した
実施例を示すものである。この場合、スピンナーチャッ
ク12の中心とウェハー7の中心をできるだけ一致させ
る必要があり、1組の半導体ウェハーの検出機構では検
出位置に半導体ウェハーのOFがきた場合に位置のズレ
が生じるため、半導体ウェハー進行方向手前側、後方側
とも2ケの透過式赤外線センサ8a 、 8b 、 8
c 、 8dを半導体ウェハーのOF長より大きい距離
で設置してあり、手前側2ケの透過式赤外線センサ8a
、8bの出力はOR論理回路9aを通して、また同様に
後方側2ケの透過式赤外線センサ8c、 8dの出力は
OR論理回路9bを通して制御回路6へ送られるもので
ある。このOR論理回路により透過式赤外線センサの出
力を合成することによりOFの影響を取り除きスピンナ
ーチャック上で正確に半導体ウェハーを停止させるもの
である。(Embodiment 2) FIG. 2 is a schematic diagram of Embodiment 2 of the present invention, and shows an embodiment in which the present invention is utilized for transporting a semiconductor wafer onto a spinner chuck. In this case, it is necessary to match the center of the spinner chuck 12 and the center of the wafer 7 as much as possible, and in a set of semiconductor wafer detection mechanisms, a positional shift occurs when the OF of the semiconductor wafer reaches the detection position. Two transmission-type infrared sensors 8a, 8b, 8 on both the front side and the rear side in the direction of travel
c, 8d are installed at a distance greater than the OF length of the semiconductor wafer, and the two transmissive infrared sensors 8a on the near side
, 8b are sent to the control circuit 6 through an OR logic circuit 9a, and outputs from the two rear transmissive infrared sensors 8c and 8d are sent to the control circuit 6 through an OR logic circuit 9b. By combining the outputs of the transmission type infrared sensors using this OR logic circuit, the influence of OF is removed and the semiconductor wafer is accurately stopped on the spinner chuck.
以上説明したように本発明はストッパを用いず、搬送ベ
ルトの駆動制御のみにより半導体ウェハーを所定の位置
に停止させるため、搬送ベルトと半導゛体つェハー裏面
とが擦れあう現象を低減でき、ゴミの発生を低減できる
効果がある。As explained above, the present invention does not use a stopper and stops the semiconductor wafer at a predetermined position only by controlling the drive of the conveyor belt, so it is possible to reduce the phenomenon in which the conveyor belt and the back surface of the semiconductor wafer rub against each other. It has the effect of reducing waste generation.
第1図、第2図は本発明の実施例の概略図、第3図は従
来のベルト式搬送装置の概略図である。
1・・・搬送ベルト 2・・・プーリ3・・・モ
ータ 4a 、 4b・・・反射式赤外線セン
サ5・・・支持架 6・・・制御回路7・・
・半導体ウェハーFIGS. 1 and 2 are schematic diagrams of an embodiment of the present invention, and FIG. 3 is a schematic diagram of a conventional belt-type conveying device. 1... Conveyor belt 2... Pulley 3... Motor 4a, 4b... Reflective infrared sensor 5... Support frame 6... Control circuit 7...
・Semiconductor wafer
Claims (1)
ェハーの進行方向に平行に配された複数の半導体ウェハ
ー検出機構と、前記半導体ウェハー検出機構相互間の半
導体ウェハー検出時間差により半導体ウェハーの所定停
止位置到達時間を算出し前記搬送機構の駆動停止指令を
発する制御回路とを有することを特徴とする半導体ウェ
ハーのベルト式搬送装置。(1) A transport mechanism that transports the semiconductor wafer, a plurality of semiconductor wafer detection mechanisms arranged in parallel to the direction of travel of the semiconductor wafer, and a predetermined stop position of the semiconductor wafer based on the semiconductor wafer detection time difference between the semiconductor wafer detection mechanisms. 1. A belt-type transport device for semiconductor wafers, comprising a control circuit that calculates arrival time and issues a command to stop driving the transport mechanism.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62258104A JPH0199229A (en) | 1987-10-13 | 1987-10-13 | Belt conveyor for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62258104A JPH0199229A (en) | 1987-10-13 | 1987-10-13 | Belt conveyor for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0199229A true JPH0199229A (en) | 1989-04-18 |
Family
ID=17315554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62258104A Pending JPH0199229A (en) | 1987-10-13 | 1987-10-13 | Belt conveyor for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0199229A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006294987A (en) * | 2005-04-13 | 2006-10-26 | Hitachi High-Technologies Corp | Sample processing device |
KR100975428B1 (en) * | 2008-05-16 | 2010-08-11 | 주식회사 디엠에스 | Apparatus for treating substrate |
US20200180103A1 (en) * | 2018-12-05 | 2020-06-11 | Samsung Display Co., Ltd. | Apparatus and method for monitoring chemical mechanical polishing |
-
1987
- 1987-10-13 JP JP62258104A patent/JPH0199229A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006294987A (en) * | 2005-04-13 | 2006-10-26 | Hitachi High-Technologies Corp | Sample processing device |
KR100975428B1 (en) * | 2008-05-16 | 2010-08-11 | 주식회사 디엠에스 | Apparatus for treating substrate |
US20200180103A1 (en) * | 2018-12-05 | 2020-06-11 | Samsung Display Co., Ltd. | Apparatus and method for monitoring chemical mechanical polishing |
CN111267000A (en) * | 2018-12-05 | 2020-06-12 | 三星显示有限公司 | Apparatus and method for monitoring polishing |
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