JPH0195744U - - Google Patents
Info
- Publication number
- JPH0195744U JPH0195744U JP19211687U JP19211687U JPH0195744U JP H0195744 U JPH0195744 U JP H0195744U JP 19211687 U JP19211687 U JP 19211687U JP 19211687 U JP19211687 U JP 19211687U JP H0195744 U JPH0195744 U JP H0195744U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- pin
- bonded
- semiconductor devices
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19211687U JPH0195744U (cs) | 1987-12-18 | 1987-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19211687U JPH0195744U (cs) | 1987-12-18 | 1987-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0195744U true JPH0195744U (cs) | 1989-06-26 |
Family
ID=31482989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19211687U Pending JPH0195744U (cs) | 1987-12-18 | 1987-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0195744U (cs) |
-
1987
- 1987-12-18 JP JP19211687U patent/JPH0195744U/ja active Pending
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