JPH0195736U - - Google Patents

Info

Publication number
JPH0195736U
JPH0195736U JP19235387U JP19235387U JPH0195736U JP H0195736 U JPH0195736 U JP H0195736U JP 19235387 U JP19235387 U JP 19235387U JP 19235387 U JP19235387 U JP 19235387U JP H0195736 U JPH0195736 U JP H0195736U
Authority
JP
Japan
Prior art keywords
semiconductor device
resin
mold gate
molding
upper mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19235387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0610682Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19235387U priority Critical patent/JPH0610682Y2/ja
Publication of JPH0195736U publication Critical patent/JPH0195736U/ja
Application granted granted Critical
Publication of JPH0610682Y2 publication Critical patent/JPH0610682Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP19235387U 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型 Expired - Lifetime JPH0610682Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19235387U JPH0610682Y2 (ja) 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19235387U JPH0610682Y2 (ja) 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型

Publications (2)

Publication Number Publication Date
JPH0195736U true JPH0195736U (US06346242-20020212-C00066.png) 1989-06-26
JPH0610682Y2 JPH0610682Y2 (ja) 1994-03-16

Family

ID=31483215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19235387U Expired - Lifetime JPH0610682Y2 (ja) 1987-12-17 1987-12-17 樹脂封止形半導体装置成形用モールド金型

Country Status (1)

Country Link
JP (1) JPH0610682Y2 (US06346242-20020212-C00066.png)

Also Published As

Publication number Publication date
JPH0610682Y2 (ja) 1994-03-16

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