JPH0195532A - Semiconductor container - Google Patents

Abstract

PURPOSE:To prevent pins of semiconductor package from being adversely affected in transit by providing a pair of protrusions on the upper surface of a semiconductor package and a pair of slits on a lid corresponding to the protrusions to prevent the package from moving within a semiconductor container. CONSTITUTION:A slit 3a and a protrusion 3b are formed in a semiconductor package 3 in pairs. Since the slit 3a is set on a protrusion 2, a semiconductor package 3 keeps a pin 3c out of contact with an inner wall 5 thus avoiding horizontal movement. Furthermore, since the protrusion 3b is set in a slit 4a of the lid 4, supporting efficiency is further assured making it possible to hold the package even in perpendicular movement. The semiconductor package 3 is thus fixed, always keeping the pin 3c out of contact with the inner wall. A semiconductor package can be thereby transported in safe.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor storage device that protects pins of a semiconductor package from vibrations generated during transportation of the semiconductor package.

[Conventional technology]

FIG. 5 is a perspective view of a conventional flat package type semiconductor storage device, and FIG. 6 is an enlarged front view showing a state in which semiconductor packages are actually stored.

1. A conventional semiconductor storage device hides a semiconductor package (3) in a space (5) partitioned by a wall (6) made of resin, reduces the movement space for the semiconductor package (3), and stores the semiconductor The broken and bent pins (3C) of the package (3) were captured.

[Problems that the invention attempts to solve]

In the conventional semiconductor storage device partitioned by resin walls (6), the pins of the semiconductor package and the semiconductor storage device are in contact with each other, and the problem is that the pins of the semiconductor package will bend if subjected to a large vertical shock. there were.

This invention was made to solve the above-mentioned problems, and it is designed to prevent the pins of semiconductor packages from being adversely affected during transportation, and also to ensure that the same effect can be achieved even when multiple semiconductor packages are stacked on top of each other. My goal is to get what I want.

[Means for solving problems]

The semiconductor storage device according to the present invention has a pair of claws arranged on the top surface of the semiconductor package, a slit in the lid to pair with the claws, and a control means to prevent the semiconductor package from moving within the semiconductor storage device. 0 [Function] In the present invention, the pair of claws arranged as described above bring the semiconductor package bottle into a non-contact state, and the semiconductor package is fixed by the slit in the lid.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) is the semiconductor storage device main body, (2) is a claw protruding into the semiconductor storage device main body (1), and (3) is a semiconductor package to be stored.
The pins of the semiconductor package, which are fixed between the lid (4) and the lid (4), are fixed in the space,
Aim with stones that allow you to maintain a non-contact state.

Next, the operation of the above embodiment will be explained with reference to FIG. As shown in FIG. 2, grooves (3a) and protrusions (3b) are made in advance in the semiconductor package (3) in the process of manufacturing the semiconductor package (3). Here, the groove (3a) and the protrusion (3b) have shapes that form a pair with each other.

Since the groove (3a) is placed on the claw (2) of the main mounting, the semiconductor package (3) can maintain the bottle (3c) in a non-contact state with respect to the inner wall (5), and the semiconductor package (3) can be placed in a horizontal direction. You can eliminate the movement of the screws. In addition, the protrusion (3b) and the groove of the lid (4) (
By engaging 4a) in the same way, the holding function is further strengthened, and movement in the vertical direction can also be held.

Due to the above action, the semiconductor package (3) is fixed and the pins (3c) are always in a non-contact state.

Incidentally, in the above embodiment, the claws were placed on the bottom and the grooves were placed on the top for fixing the semiconductor, but as shown in Fig. ).

In addition, although the embodiment E has been described with reference to the case where the semiconductor packages (3) are arranged in -stages, for example, even if the semiconductor packages (3) are stacked in several stages as shown in FIG. It has a similar effect.

(Effects of the Invention) As described below, according to the present invention, since the storage box and the lid have a holding function in which claws and grooves are arranged at equal intervals, the device can be made at low cost and the transportation of semiconductor packages can be made safely. It has the effect of

[Brief explanation of the drawing]

FIG. 1 is a partially exploded perspective view of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a partially enlarged sectional side view of the fX1 diagram, and FIG.
Figure 3 and Figure 4 are partially enlarged side views and enlarged perspective views showing other embodiments of the present invention, Figure 5 is a perspective view of a conventional semiconductor storage device, and Figure 6 is a diagram showing a semiconductor package stored in Figure 5. FIG. In the figure, (1) is a semiconductor storage device, (2) is a nail, (
3) shows a semiconductor package, and (4) shows a lid. In addition, in the figures, the same symbols indicate the same or equivalent parts〇

Claims (2)

[Claims] (1) A semiconductor storage device characterized by having a holding function for storing pins of semiconductor packages in a non-contact state. (2) The semiconductor storage device according to claim 1, wherein the holding function includes a groove and a protrusion that engage with each other.