JPH0191509U - - Google Patents
Info
- Publication number
- JPH0191509U JPH0191509U JP18828487U JP18828487U JPH0191509U JP H0191509 U JPH0191509 U JP H0191509U JP 18828487 U JP18828487 U JP 18828487U JP 18828487 U JP18828487 U JP 18828487U JP H0191509 U JPH0191509 U JP H0191509U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- dicing
- dicing apparatus
- main body
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Feeding Of Workpieces (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
第1図は本考案が適用されたダイシング装置の
一実施例を示す斜視図、第2図は第1図に示した
ダイシング装置の平面図、第3図A乃至Lはそれ
ぞれ搬送シーケンスを説明するために用いたダイ
シング装置の概略平面図、第4図乃至第6図は従
来のダイシング装置の概略平面図である。
10……切断部、20……洗浄部、31……エ
レベータ、33……ベルト搬送部、35,36…
…チヤツク部、37……回転アーム、P1〜P4
……位置、W,W1〜W3……ワーク(ウエハ)
。
Fig. 1 is a perspective view showing an embodiment of the dicing apparatus to which the present invention is applied, Fig. 2 is a plan view of the dicing apparatus shown in Fig. 1, and Figs. 3 A to L each explain the conveyance sequence. FIGS. 4 to 6 are schematic plan views of a conventional dicing apparatus. 10... Cutting section, 20... Washing section, 31... Elevator, 33... Belt transport section, 35, 36...
...Chuck part, 37...Rotating arm, P1 to P4
...Position, W, W1-W3...Work (wafer)
.
Claims (1)
る第1の位置、ワーク切断部へワークを供給する
ための第2の位置、及び切断されたワークを洗浄
する第3の位置を有し、前記第1の位置上の加工
前のワークを前記第2、第3の位置を経由して再
び第1の位置に戻すようにしたダイシング装置に
おいて、 前記第1の位置が装置本体の前面側に位置する
ように配置し、前記第1の位置に加工前のワーク
を供給しかつ第1の位置から加工後のワークを収
納するための1つのワーク供給収納部を、前記第
1の位置に対向する装置本体の前面に設けたこと
を特徴とするダイシング装置。[Claims for Utility Model Registration] At least a first position where the workpiece before and after processing is located, a second position for supplying the workpiece to the workpiece cutting section, and a third position for cleaning the cut workpiece. In the dicing apparatus, the dicing apparatus has a position and returns the unprocessed workpiece on the first position to the first position via the second and third positions, wherein the first position is the dicing apparatus. a work supply storage section disposed on the front side of the main body for supplying unprocessed workpieces to the first position and storing processed workpieces from the first position; 1. A dicing device characterized in that the dicing device is provided on the front side of the device main body opposite to position 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987188284U JPH0523291Y2 (en) | 1987-12-11 | 1987-12-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987188284U JPH0523291Y2 (en) | 1987-12-11 | 1987-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0191509U true JPH0191509U (en) | 1989-06-15 |
JPH0523291Y2 JPH0523291Y2 (en) | 1993-06-15 |
Family
ID=31479386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987188284U Expired - Lifetime JPH0523291Y2 (en) | 1987-12-11 | 1987-12-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0523291Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315444A (en) * | 1992-05-11 | 1993-11-26 | Disco Abrasive Syst Ltd | Dicing equipment |
JPH10270389A (en) * | 1997-03-21 | 1998-10-09 | Seiko Seiki Co Ltd | Dicing device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5534426A (en) * | 1978-08-31 | 1980-03-11 | Toshiba Corp | Wafer dicing device |
JPS60214911A (en) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | Dicing device |
-
1987
- 1987-12-11 JP JP1987188284U patent/JPH0523291Y2/ja not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5534426A (en) * | 1978-08-31 | 1980-03-11 | Toshiba Corp | Wafer dicing device |
JPS60214911A (en) * | 1985-03-11 | 1985-10-28 | 株式会社日立製作所 | Dicing device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05315444A (en) * | 1992-05-11 | 1993-11-26 | Disco Abrasive Syst Ltd | Dicing equipment |
JPH10270389A (en) * | 1997-03-21 | 1998-10-09 | Seiko Seiki Co Ltd | Dicing device |
Also Published As
Publication number | Publication date |
---|---|
JPH0523291Y2 (en) | 1993-06-15 |
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