JPH0189771U - - Google Patents
Info
- Publication number
- JPH0189771U JPH0189771U JP18511687U JP18511687U JPH0189771U JP H0189771 U JPH0189771 U JP H0189771U JP 18511687 U JP18511687 U JP 18511687U JP 18511687 U JP18511687 U JP 18511687U JP H0189771 U JPH0189771 U JP H0189771U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- utility
- model registration
- barcode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18511687U JPH0189771U (cs) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18511687U JPH0189771U (cs) | 1987-12-04 | 1987-12-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189771U true JPH0189771U (cs) | 1989-06-13 |
Family
ID=31476444
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18511687U Pending JPH0189771U (cs) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189771U (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (ja) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | プリント配線板用部品位置決めマークの形成法 |
| JP2004501518A (ja) * | 2000-06-21 | 2004-01-15 | ラウノ サルミ | 基盤を個別にマーキングするための方法 |
-
1987
- 1987-12-04 JP JP18511687U patent/JPH0189771U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (ja) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | プリント配線板用部品位置決めマークの形成法 |
| JP2004501518A (ja) * | 2000-06-21 | 2004-01-15 | ラウノ サルミ | 基盤を個別にマーキングするための方法 |