JPH01129862U - - Google Patents
Info
- Publication number
- JPH01129862U JPH01129862U JP2450088U JP2450088U JPH01129862U JP H01129862 U JPH01129862 U JP H01129862U JP 2450088 U JP2450088 U JP 2450088U JP 2450088 U JP2450088 U JP 2450088U JP H01129862 U JPH01129862 U JP H01129862U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- copper foil
- foil pattern
- marking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 239000011889 copper foil Substances 0.000 claims description 10
- 239000011888 foil Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2450088U JPH01129862U (cs) | 1988-02-27 | 1988-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2450088U JPH01129862U (cs) | 1988-02-27 | 1988-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01129862U true JPH01129862U (cs) | 1989-09-04 |
Family
ID=31244398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2450088U Pending JPH01129862U (cs) | 1988-02-27 | 1988-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01129862U (cs) |
-
1988
- 1988-02-27 JP JP2450088U patent/JPH01129862U/ja active Pending
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