JPH0189723U - - Google Patents
Info
- Publication number
- JPH0189723U JPH0189723U JP18664187U JP18664187U JPH0189723U JP H0189723 U JPH0189723 U JP H0189723U JP 18664187 U JP18664187 U JP 18664187U JP 18664187 U JP18664187 U JP 18664187U JP H0189723 U JPH0189723 U JP H0189723U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- electronic component
- coated
- hole
- type electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18664187U JPH0189723U (US20030220297A1-20031127-C00009.png) | 1987-12-07 | 1987-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18664187U JPH0189723U (US20030220297A1-20031127-C00009.png) | 1987-12-07 | 1987-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0189723U true JPH0189723U (US20030220297A1-20031127-C00009.png) | 1989-06-13 |
Family
ID=31477857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18664187U Pending JPH0189723U (US20030220297A1-20031127-C00009.png) | 1987-12-07 | 1987-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0189723U (US20030220297A1-20031127-C00009.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006057274A1 (ja) * | 2004-11-25 | 2006-06-01 | Matsushita Electric Industrial Co., Ltd. | コイン型電気化学素子の製造方法及びコイン型電気化学素子 |
| JP2006179840A (ja) * | 2004-11-25 | 2006-07-06 | Matsushita Electric Ind Co Ltd | コイン型電気化学素子及びその製造方法 |
| WO2023074376A1 (ja) * | 2021-10-28 | 2023-05-04 | パナソニックＩｐマネジメント株式会社 | 固体電解コンデンサ |
-
1987
- 1987-12-07 JP JP18664187U patent/JPH0189723U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006057274A1 (ja) * | 2004-11-25 | 2006-06-01 | Matsushita Electric Industrial Co., Ltd. | コイン型電気化学素子の製造方法及びコイン型電気化学素子 |
| JP2006179840A (ja) * | 2004-11-25 | 2006-07-06 | Matsushita Electric Ind Co Ltd | コイン型電気化学素子及びその製造方法 |
| JP4665513B2 (ja) * | 2004-11-25 | 2011-04-06 | パナソニック株式会社 | コイン型電気化学素子の製造方法 |
| WO2023074376A1 (ja) * | 2021-10-28 | 2023-05-04 | パナソニックＩｐマネジメント株式会社 | 固体電解コンデンサ |
