JPH0187596U - - Google Patents
Info
- Publication number
- JPH0187596U JPH0187596U JP1987184203U JP18420387U JPH0187596U JP H0187596 U JPH0187596 U JP H0187596U JP 1987184203 U JP1987184203 U JP 1987184203U JP 18420387 U JP18420387 U JP 18420387U JP H0187596 U JPH0187596 U JP H0187596U
- Authority
- JP
- Japan
- Prior art keywords
- housing
- inert gas
- cooling module
- holes
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987184203U JPH0187596U (zh) | 1987-12-02 | 1987-12-02 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987184203U JPH0187596U (zh) | 1987-12-02 | 1987-12-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0187596U true JPH0187596U (zh) | 1989-06-09 |
Family
ID=31475580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987184203U Pending JPH0187596U (zh) | 1987-12-02 | 1987-12-02 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0187596U (zh) |
-
1987
- 1987-12-02 JP JP1987184203U patent/JPH0187596U/ja active Pending