JPH0187567U - - Google Patents

Info

Publication number
JPH0187567U
JPH0187567U JP1987184216U JP18421687U JPH0187567U JP H0187567 U JPH0187567 U JP H0187567U JP 1987184216 U JP1987184216 U JP 1987184216U JP 18421687 U JP18421687 U JP 18421687U JP H0187567 U JPH0187567 U JP H0187567U
Authority
JP
Japan
Prior art keywords
concave mirror
led lamp
led chip
led
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987184216U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987184216U priority Critical patent/JPH0187567U/ja
Publication of JPH0187567U publication Critical patent/JPH0187567U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP1987184216U 1987-12-02 1987-12-02 Pending JPH0187567U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987184216U JPH0187567U (enExample) 1987-12-02 1987-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987184216U JPH0187567U (enExample) 1987-12-02 1987-12-02

Publications (1)

Publication Number Publication Date
JPH0187567U true JPH0187567U (enExample) 1989-06-09

Family

ID=31475591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987184216U Pending JPH0187567U (enExample) 1987-12-02 1987-12-02

Country Status (1)

Country Link
JP (1) JPH0187567U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344710A (ja) * 2005-06-08 2006-12-21 Sony Corp 半導体発光素子及びその製造方法、並びに半導体発光装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006344710A (ja) * 2005-06-08 2006-12-21 Sony Corp 半導体発光素子及びその製造方法、並びに半導体発光装置及びその製造方法

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