JPH0187540U - - Google Patents
Info
- Publication number
- JPH0187540U JPH0187540U JP18367287U JP18367287U JPH0187540U JP H0187540 U JPH0187540 U JP H0187540U JP 18367287 U JP18367287 U JP 18367287U JP 18367287 U JP18367287 U JP 18367287U JP H0187540 U JPH0187540 U JP H0187540U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- fixing claw
- heat plate
- wafer fixing
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18367287U JPH0187540U (es) | 1987-12-01 | 1987-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18367287U JPH0187540U (es) | 1987-12-01 | 1987-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187540U true JPH0187540U (es) | 1989-06-09 |
Family
ID=31475085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18367287U Pending JPH0187540U (es) | 1987-12-01 | 1987-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187540U (es) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11312727A (ja) * | 1998-02-25 | 1999-11-09 | Anelva Corp | マルチチャンバ―基板処理装置 |
| KR100558774B1 (ko) * | 1997-07-15 | 2007-04-25 | 동경 엘렉트론 주식회사 | 위치결정장치및위치결정방법 |
-
1987
- 1987-12-01 JP JP18367287U patent/JPH0187540U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100558774B1 (ko) * | 1997-07-15 | 2007-04-25 | 동경 엘렉트론 주식회사 | 위치결정장치및위치결정방법 |
| JPH11312727A (ja) * | 1998-02-25 | 1999-11-09 | Anelva Corp | マルチチャンバ―基板処理装置 |