JPH0186512U - - Google Patents
Info
- Publication number
- JPH0186512U JPH0186512U JP18347587U JP18347587U JPH0186512U JP H0186512 U JPH0186512 U JP H0186512U JP 18347587 U JP18347587 U JP 18347587U JP 18347587 U JP18347587 U JP 18347587U JP H0186512 U JPH0186512 U JP H0186512U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- core
- coil
- molding device
- electromagnetic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18347587U JPH0518109Y2 (enrdf_load_stackoverflow) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18347587U JPH0518109Y2 (enrdf_load_stackoverflow) | 1987-11-30 | 1987-11-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0186512U true JPH0186512U (enrdf_load_stackoverflow) | 1989-06-08 |
| JPH0518109Y2 JPH0518109Y2 (enrdf_load_stackoverflow) | 1993-05-14 |
Family
ID=31474896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18347587U Expired - Lifetime JPH0518109Y2 (enrdf_load_stackoverflow) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0518109Y2 (enrdf_load_stackoverflow) |
-
1987
- 1987-11-30 JP JP18347587U patent/JPH0518109Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0518109Y2 (enrdf_load_stackoverflow) | 1993-05-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0186512U (enrdf_load_stackoverflow) | ||
| JPS60138721U (ja) | インジエクシヨン成形金型 | |
| JPH01104319U (enrdf_load_stackoverflow) | ||
| JPS5925601U (ja) | テ−プレコ−ダ等のシヤ−シ | |
| JPH0362810U (enrdf_load_stackoverflow) | ||
| JPS6059531U (ja) | 発光ダイオ−ドの樹脂封入成形用金型 | |
| JPS63112014U (enrdf_load_stackoverflow) | ||
| JPH0438410U (enrdf_load_stackoverflow) | ||
| JPS59124112U (ja) | ボス部ヒケ防止用金型 | |
| JPS6147612U (ja) | 射出成形金型 | |
| JPS58117919U (ja) | 簡易ケ−ス製造器 | |
| JPS6347114U (enrdf_load_stackoverflow) | ||
| JPS589484U (ja) | 鴨居 | |
| JPH0467022U (enrdf_load_stackoverflow) | ||
| JPS5876715U (ja) | 樹脂モ−ルド装置 | |
| JPH0415854U (enrdf_load_stackoverflow) | ||
| JPS59109142U (ja) | 半導体素子の樹脂封入成形用金型装置 | |
| JPH0185008U (enrdf_load_stackoverflow) | ||
| JPS58162635U (ja) | 半導体樹脂封入成形用金型装置 | |
| JPS5818716U (ja) | 射出成形用金型のゲ−ト構造 | |
| JPH0448625U (enrdf_load_stackoverflow) | ||
| JPH01119325U (enrdf_load_stackoverflow) | ||
| JPS62150117U (enrdf_load_stackoverflow) | ||
| JPS59160217U (ja) | プラスチック成形金型 | |
| JPS5877813U (ja) | 磁気ヘツド |