JPH0186250U - - Google Patents
Info
- Publication number
- JPH0186250U JPH0186250U JP18237687U JP18237687U JPH0186250U JP H0186250 U JPH0186250 U JP H0186250U JP 18237687 U JP18237687 U JP 18237687U JP 18237687 U JP18237687 U JP 18237687U JP H0186250 U JPH0186250 U JP H0186250U
- Authority
- JP
- Japan
- Prior art keywords
- presser
- heatsink
- circuit board
- printed circuit
- fixing parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003321 amplification Effects 0.000 claims 1
- 238000003199 nucleic acid amplification method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す図、第２図は
要部の側面図で、第３図は要部の上面図である。
１…放熱器、２…ＩＣ、３，６…ねじ、４…基
板、５…ＩＣ押えである。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a side view of the main part, and FIG. 3 is a top view of the main part. 1... Heatsink, 2... IC, 3, 6... Screw, 4... Board, 5... IC holder.
補正 昭６３．３．２
図面の簡単な説明を次のように補正する。
明細書の第４頁第５行目の「上面図である。」
を「上面図で、第４図は従来例を示す図である。
」と訂正する。Amendment 1986.3.2 The brief description of the drawing is amended as follows. "This is a top view" on page 4, line 5 of the specification.
FIG. 4 is a top view showing a conventional example.
” he corrected.
Claims (1)
於て、電力増幅用のＩＣと、プリント基板の孔に
係合する組付部とＩＣの側壁を弾性的に保持する
保持部とＩＣ押えの両側に保持したＩＣを放熱器
に押し付ける固着部を有するＩＣ押えと、ＩＣ押
えの固着部を放熱器にねじ止めして放熱する放熱
器とを具備しＩＣ押えでＩＣを所定の位置に保持
して半田付して放熱器に取付けて成ることを特徴
とするＩＣの取付け構造。 A printed circuit board on which electronic components are mounted and wired includes an IC for power amplification, an assembly section that engages with a hole in the printed circuit board, a holding section that elastically holds the side wall of the IC, and an IC holder. The IC presser is equipped with an IC presser having fixing parts for pressing the IC held on both sides against the heat sink, and a heatsink for screwing the fixing parts of the IC presser to the heatsink to radiate heat, and the IC presser holds the IC in a predetermined position. An IC mounting structure characterized in that the IC is mounted on a heatsink by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18237687U JPH0186250U (en) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18237687U JPH0186250U (en) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186250U true JPH0186250U (en) | 1989-06-07 |
Family
ID=31473824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18237687U Pending JPH0186250U (en) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186250U (en) |
-
1987
- 1987-11-30 JP JP18237687U patent/JPH0186250U/ja active Pending
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