JPH0186247U - - Google Patents

Info

Publication number

JPH0186247U

JPH0186247U JP18165287U JP18165287U JPH0186247U JP H0186247 U JPH0186247 U JP H0186247U JP 18165287 U JP18165287 U JP 18165287U JP 18165287 U JP18165287 U JP 18165287U JP H0186247 U JPH0186247 U JP H0186247U

Authority

JP

Japan

Prior art keywords

semiconductor element

semiconductor package

substrate

protrusion

sealing lid

Prior art date

1987-11-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000004065 semiconductor Substances 0.000 claims description 10
• 238000007789 sealing Methods 0.000 claims description 5
• 239000000758 substrate Substances 0.000 claims description 4
• 230000037431 insertion Effects 0.000 claims 1
• 238000003780 insertion Methods 0.000 claims 1
• 239000004020 conductor Substances 0.000 description 2
• 239000012212 insulator Substances 0.000 description 1

Cited By (1)