JPH0180980U - - Google Patents
Info
- Publication number
- JPH0180980U JPH0180980U JP1987176434U JP17643487U JPH0180980U JP H0180980 U JPH0180980 U JP H0180980U JP 1987176434 U JP1987176434 U JP 1987176434U JP 17643487 U JP17643487 U JP 17643487U JP H0180980 U JPH0180980 U JP H0180980U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- land
- printed wiring
- flexible printed
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176434U JPH0180980U (fi) | 1987-11-20 | 1987-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176434U JPH0180980U (fi) | 1987-11-20 | 1987-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180980U true JPH0180980U (fi) | 1989-05-30 |
Family
ID=31468168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176434U Pending JPH0180980U (fi) | 1987-11-20 | 1987-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180980U (fi) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292968U (fi) * | 1989-01-11 | 1990-07-24 | ||
| JP4723431B2 (ja) * | 2006-07-28 | 2011-07-13 | シャープ株式会社 | 回路基板の製造方法 |
| JP2012146353A (ja) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | フレキシブル配線板、配線板の接続構造、およびこれらの製造方法 |
| JP2015133165A (ja) * | 2015-02-23 | 2015-07-23 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |
-
1987
- 1987-11-20 JP JP1987176434U patent/JPH0180980U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0292968U (fi) * | 1989-01-11 | 1990-07-24 | ||
| JP4723431B2 (ja) * | 2006-07-28 | 2011-07-13 | シャープ株式会社 | 回路基板の製造方法 |
| JP2012146353A (ja) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | フレキシブル配線板、配線板の接続構造、およびこれらの製造方法 |
| JP2015133165A (ja) * | 2015-02-23 | 2015-07-23 | 大日本印刷株式会社 | サスペンション用基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ |