JPH0180930U - - Google Patents

Info

Publication number
JPH0180930U
JPH0180930U JP1987176774U JP17677487U JPH0180930U JP H0180930 U JPH0180930 U JP H0180930U JP 1987176774 U JP1987176774 U JP 1987176774U JP 17677487 U JP17677487 U JP 17677487U JP H0180930 U JPH0180930 U JP H0180930U
Authority
JP
Japan
Prior art keywords
mold
resin
recess
injection port
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987176774U
Other languages
English (en)
Japanese (ja)
Other versions
JPH087632Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987176774U priority Critical patent/JPH087632Y2/ja
Publication of JPH0180930U publication Critical patent/JPH0180930U/ja
Application granted granted Critical
Publication of JPH087632Y2 publication Critical patent/JPH087632Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1987176774U 1987-11-19 1987-11-19 半導体装置用樹脂封止金型 Expired - Lifetime JPH087632Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987176774U JPH087632Y2 (ja) 1987-11-19 1987-11-19 半導体装置用樹脂封止金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987176774U JPH087632Y2 (ja) 1987-11-19 1987-11-19 半導体装置用樹脂封止金型

Publications (2)

Publication Number Publication Date
JPH0180930U true JPH0180930U (US06724976-20040420-M00002.png) 1989-05-30
JPH087632Y2 JPH087632Y2 (ja) 1996-03-04

Family

ID=31468477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987176774U Expired - Lifetime JPH087632Y2 (ja) 1987-11-19 1987-11-19 半導体装置用樹脂封止金型

Country Status (1)

Country Link
JP (1) JPH087632Y2 (US06724976-20040420-M00002.png)

Also Published As

Publication number Publication date
JPH087632Y2 (ja) 1996-03-04

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