JPH0179888U - - Google Patents
Info
- Publication number
- JPH0179888U JPH0179888U JP1987176144U JP17614487U JPH0179888U JP H0179888 U JPH0179888 U JP H0179888U JP 1987176144 U JP1987176144 U JP 1987176144U JP 17614487 U JP17614487 U JP 17614487U JP H0179888 U JPH0179888 U JP H0179888U
- Authority
- JP
- Japan
- Prior art keywords
- side plates
- back plate
- housing
- electronic device
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176144U JPH0179888U (et) | 1987-11-18 | 1987-11-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987176144U JPH0179888U (et) | 1987-11-18 | 1987-11-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0179888U true JPH0179888U (et) | 1989-05-29 |
Family
ID=31467900
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987176144U Pending JPH0179888U (et) | 1987-11-18 | 1987-11-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0179888U (et) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319396A (ja) * | 1989-06-16 | 1991-01-28 | Hitachi Ltd | 伝送媒体をインサート成形した回路構造体 |
-
1987
- 1987-11-18 JP JP1987176144U patent/JPH0179888U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0319396A (ja) * | 1989-06-16 | 1991-01-28 | Hitachi Ltd | 伝送媒体をインサート成形した回路構造体 |