JPH0179847U - - Google Patents
Info
- Publication number
- JPH0179847U JPH0179847U JP1987174694U JP17469487U JPH0179847U JP H0179847 U JPH0179847 U JP H0179847U JP 1987174694 U JP1987174694 U JP 1987174694U JP 17469487 U JP17469487 U JP 17469487U JP H0179847 U JPH0179847 U JP H0179847U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- hybrid integrated
- ultrasonic vibration
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987174694U JPH0179847U (pt) | 1987-11-16 | 1987-11-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987174694U JPH0179847U (pt) | 1987-11-16 | 1987-11-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0179847U true JPH0179847U (pt) | 1989-05-29 |
Family
ID=31466535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987174694U Pending JPH0179847U (pt) | 1987-11-16 | 1987-11-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0179847U (pt) |
-
1987
- 1987-11-16 JP JP1987174694U patent/JPH0179847U/ja active Pending