JPH0178059U - - Google Patents
Info
- Publication number
- JPH0178059U JPH0178059U JP1987173546U JP17354687U JPH0178059U JP H0178059 U JPH0178059 U JP H0178059U JP 1987173546 U JP1987173546 U JP 1987173546U JP 17354687 U JP17354687 U JP 17354687U JP H0178059 U JPH0178059 U JP H0178059U
- Authority
- JP
- Japan
- Prior art keywords
- exposed
- sealing
- mainly composed
- registration request
- external light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173546U JPH0534121Y2 (cs) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173546U JPH0534121Y2 (cs) | 1987-11-12 | 1987-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0178059U true JPH0178059U (cs) | 1989-05-25 |
| JPH0534121Y2 JPH0534121Y2 (cs) | 1993-08-30 |
Family
ID=31465450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173546U Expired - Lifetime JPH0534121Y2 (cs) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0534121Y2 (cs) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003197976A (ja) * | 2001-12-27 | 2003-07-11 | Okaya Electric Ind Co Ltd | 発光ダイオード |
| US7336653B2 (en) | 1999-04-09 | 2008-02-26 | At&T Labs, Inc. | Internet caller identification system and method |
| US7450701B2 (en) | 2002-02-19 | 2008-11-11 | At&T Intellectual Property I, L.P. | Method and system for presenting customized call alerts in a service for internet caller identification |
-
1987
- 1987-11-12 JP JP1987173546U patent/JPH0534121Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7336653B2 (en) | 1999-04-09 | 2008-02-26 | At&T Labs, Inc. | Internet caller identification system and method |
| JP2003197976A (ja) * | 2001-12-27 | 2003-07-11 | Okaya Electric Ind Co Ltd | 発光ダイオード |
| US7450701B2 (en) | 2002-02-19 | 2008-11-11 | At&T Intellectual Property I, L.P. | Method and system for presenting customized call alerts in a service for internet caller identification |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0534121Y2 (cs) | 1993-08-30 |
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