JPH0178058U - - Google Patents

Info

Publication number
JPH0178058U
JPH0178058U JP17207187U JP17207187U JPH0178058U JP H0178058 U JPH0178058 U JP H0178058U JP 17207187 U JP17207187 U JP 17207187U JP 17207187 U JP17207187 U JP 17207187U JP H0178058 U JPH0178058 U JP H0178058U
Authority
JP
Japan
Prior art keywords
lead
reflecting mirror
pellet
optical semiconductor
die island
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17207187U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17207187U priority Critical patent/JPH0178058U/ja
Publication of JPH0178058U publication Critical patent/JPH0178058U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP17207187U 1987-11-12 1987-11-12 Pending JPH0178058U (id)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17207187U JPH0178058U (id) 1987-11-12 1987-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17207187U JPH0178058U (id) 1987-11-12 1987-11-12

Publications (1)

Publication Number Publication Date
JPH0178058U true JPH0178058U (id) 1989-05-25

Family

ID=31464062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17207187U Pending JPH0178058U (id) 1987-11-12 1987-11-12

Country Status (1)

Country Link
JP (1) JPH0178058U (id)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04165673A (ja) * 1990-10-30 1992-06-11 Nec Corp 固体撮像装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5546573A (en) * 1978-09-30 1980-04-01 Toshiba Corp Electrode member for light emission device, method of fabricating the same and punch therefor
JPS58220480A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 光半導体装置
JPS59224185A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体発光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5546573A (en) * 1978-09-30 1980-04-01 Toshiba Corp Electrode member for light emission device, method of fabricating the same and punch therefor
JPS58220480A (ja) * 1982-06-16 1983-12-22 Toshiba Corp 光半導体装置
JPS59224185A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04165673A (ja) * 1990-10-30 1992-06-11 Nec Corp 固体撮像装置

Similar Documents

Publication Publication Date Title
JPH0178058U (id)
JPH024263U (id)
JPH024258U (id)
JPH0220352U (id)
JPH0226261U (id)
JPS6359325U (id)
JPH0456335U (id)
JPH0474455U (id)
JPH0476037U (id)
JPS6382949U (id)
JPH01123340U (id)
JPS62163966U (id)
JPH0252452U (id)
JPH0328754U (id)
JPH03113850U (id)
JPH0245646U (id)
JPH02146439U (id)
JPS622249U (id)
JPH0178036U (id)
JPH0245651U (id)
JPH0217855U (id)
JPH0463130U (id)
JPS6315697U (id)
JPH0381641U (id)
JPS6426851U (id)