JPH0178024U - - Google Patents
Info
- Publication number
- JPH0178024U JPH0178024U JP1987173574U JP17357487U JPH0178024U JP H0178024 U JPH0178024 U JP H0178024U JP 1987173574 U JP1987173574 U JP 1987173574U JP 17357487 U JP17357487 U JP 17357487U JP H0178024 U JPH0178024 U JP H0178024U
- Authority
- JP
- Japan
- Prior art keywords
- heating plate
- substrate
- lid
- heat
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims 1
Description
第１図は本考案の一実施例に係る基板加熱装置
の構成の概略を示した断面図、第２図は前記実施
例における筒体を取り出して示した斜視図、第３
図〜第５図は本考案における筒体の別実施例をそ
れぞれ示した斜視図、第６図は別の実施例に係る
基板加熱装置の構成の概略を示した断面図、第７
図は従来例の構成の概略を示した断面図である。
１……基板、２……加熱プレート、４……蓋体
、５……加熱処理室、６……ガス供給管、７……
排気用ダクト、８……吸気スリツト、１４〜１７
……筒体。
FIG. 1 is a sectional view showing the outline of the structure of a substrate heating device according to an embodiment of the present invention, FIG. 2 is a perspective view showing the cylindrical body of the embodiment, and FIG.
5 to 5 are perspective views showing other embodiments of the cylindrical body of the present invention, FIG. 6 is a sectional view schematically showing the structure of a substrate heating device according to another embodiment, and FIG.
The figure is a sectional view schematically showing the configuration of a conventional example. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Heating plate, 4... Lid, 5... Heat treatment chamber, 6... Gas supply pipe, 7...
Exhaust duct, 8...Intake slit, 14-17
...Cylinder.
Claims (1)
プレートとの間で加熱処理室を形成する蓋体と、
前記加熱処理室内にガスを供給するガス供給手段
と、前記加熱プレートの外側に設けられ、前記加
熱プレートと蓋体との間の隙間から漏れ出たガス
を吸気スリツトを介して吸引する排気ダクトとを
備えた基板加熱装置において、 前記蓋体内に基板を取り囲む筒体を設け、前記
筒体の上端は基板上面よりも高く、その下端は前
記加熱プレートに当接していることを特徴とする
基板加熱装置。[Claims for Utility Model Registration] A heating plate that heat-processes a substrate; a lid that forms a heat-processing chamber between the heating plate;
a gas supply means for supplying gas into the heat treatment chamber; and an exhaust duct provided outside the heating plate and sucking gas leaking from the gap between the heating plate and the lid through an intake slit. A substrate heating device comprising: a cylindrical body surrounding the substrate is provided in the lid, the upper end of the cylindrical body is higher than the upper surface of the substrate, and the lower end thereof is in contact with the heating plate. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173574U JPH0178024U (en) | 1987-11-12 | 1987-11-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987173574U JPH0178024U (en) | 1987-11-12 | 1987-11-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0178024U true JPH0178024U (en) | 1989-05-25 |
Family
ID=31465478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987173574U Pending JPH0178024U (en) | 1987-11-12 | 1987-11-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0178024U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000100807A (en) * | 1998-09-21 | 2000-04-07 | Dainippon Screen Mfg Co Ltd | Substrate thermal treatment equipment |
-
1987
- 1987-11-12 JP JP1987173574U patent/JPH0178024U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000100807A (en) * | 1998-09-21 | 2000-04-07 | Dainippon Screen Mfg Co Ltd | Substrate thermal treatment equipment |