JPH0177935U - - Google Patents

Info

Publication number
JPH0177935U
JPH0177935U JP1987172025U JP17202587U JPH0177935U JP H0177935 U JPH0177935 U JP H0177935U JP 1987172025 U JP1987172025 U JP 1987172025U JP 17202587 U JP17202587 U JP 17202587U JP H0177935 U JPH0177935 U JP H0177935U
Authority
JP
Japan
Prior art keywords
recess
pedestal
groove
semiconductor
diaphragm element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987172025U
Other languages
Japanese (ja)
Other versions
JPH0547393Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987172025U priority Critical patent/JPH0547393Y2/ja
Publication of JPH0177935U publication Critical patent/JPH0177935U/ja
Application granted granted Critical
Publication of JPH0547393Y2 publication Critical patent/JPH0547393Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の側断面図、第2図
は第3図の―断面図、第3図は本考案の一実
施例の組立体の平面図、第4図は第3図の―
断面図、第5図は従来例の側断面図である。 21…半導体ダイヤフラム素子、22…台座部
、23…組立体、24…凹部、25…ダイヤフラ
ム部、26…肉厚部、27…固着部、28…空気
孔、29…溝部、30…底部。
Fig. 1 is a side sectional view of one embodiment of the present invention, Fig. 2 is a cross-sectional view of Fig. 3, Fig. 3 is a plan view of an assembly of one embodiment of the present invention, and Fig. 4 is a sectional view of the third embodiment of the present invention. Figure -
The sectional view, FIG. 5, is a side sectional view of a conventional example. DESCRIPTION OF SYMBOLS 21... Semiconductor diaphragm element, 22... Pedestal part, 23... Assembly, 24... Recessed part, 25... Diaphragm part, 26... Thick part, 27... Fixed part, 28... Air hole, 29... Groove part, 30... Bottom part.

Claims (1)

【実用新案登録請求の範囲】 半導体基板の一方の主面の側に凹部が形成され
、該凹部に近接してダイヤフラム部が形成された
半導体ダイヤフラム素子の前記一方の主面が前記
半導体ダイヤフラム素子と熱膨脹係数の略等しい
材質から成る台座部に固着された圧力センサにお
いて、 前記半導体ダイヤフラム素子の平面形状は略正
方形であり、前記ダイヤフラム部の平面形状は略
円形もしくは略正多角形であり、前記台座部は高
さ方向の所定位置に前記台座部の外周部を略環状
に走る溝部を有しており、前記主面の方向に透視
したとき、前記溝部の底部が前記凹部と略相似形
状を成すように設けられており、前記凹部の周縁
部と前記半導体ダイヤフラム素子の外縁部との最
短距離をlとしたとき、前記凹部の周縁部の直下
にあたる位置と前記溝部の底部との最短距離が(
2/5)l〜(3/5)lとなることを特徴とす
る圧力センサ。
[Claims for Utility Model Registration] A semiconductor diaphragm element has a recess formed on one main surface side of a semiconductor substrate, and a diaphragm portion is formed adjacent to the recess. In a pressure sensor fixed to a pedestal made of a material having substantially the same coefficient of thermal expansion, the semiconductor diaphragm element has a planar shape of a substantially square, the diaphragm has a planar shape of a substantially circular or regular polygon, and the pedestal The part has a groove running approximately annularly around the outer periphery of the pedestal at a predetermined position in the height direction, and when viewed through in the direction of the main surface, the bottom of the groove has a substantially similar shape to the recess. When the shortest distance between the peripheral edge of the recess and the outer edge of the semiconductor diaphragm element is l, the shortest distance between the position directly below the peripheral edge of the recess and the bottom of the groove is (
2/5)l to (3/5)l.
JP1987172025U 1987-11-12 1987-11-12 Expired - Lifetime JPH0547393Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987172025U JPH0547393Y2 (en) 1987-11-12 1987-11-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987172025U JPH0547393Y2 (en) 1987-11-12 1987-11-12

Publications (2)

Publication Number Publication Date
JPH0177935U true JPH0177935U (en) 1989-05-25
JPH0547393Y2 JPH0547393Y2 (en) 1993-12-14

Family

ID=31464021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987172025U Expired - Lifetime JPH0547393Y2 (en) 1987-11-12 1987-11-12

Country Status (1)

Country Link
JP (1) JPH0547393Y2 (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57161528A (en) * 1981-03-30 1982-10-05 Mitsubishi Electric Corp Pressure to electricity converter

Also Published As

Publication number Publication date
JPH0547393Y2 (en) 1993-12-14

Similar Documents

Publication Publication Date Title
JPS61170015U (en)
JPH0177935U (en)
JPS6262935U (en)
JPH0348742U (en)
JPH02133308U (en)
JPH0415844U (en)
JPS6156543U (en)
JPH0258350U (en)
JPS62163739U (en)
JPS61168151U (en)
JPH0298659U (en)
JPS63172769U (en)
JPS63105955U (en)
JPS6376552U (en)
JPS61126423U (en)
JPH01124754U (en)
JPS6376473U (en)
JPS61192460U (en)
JPH0254251U (en)
JPH0195766U (en)
JPS6269672U (en)
JPS6156544U (en)
JPS6186939U (en)
JPS6287459U (en)
JPS63156041U (en)