JPH0174572U - - Google Patents
Info
- Publication number
- JPH0174572U JPH0174572U JP1987169963U JP16996387U JPH0174572U JP H0174572 U JPH0174572 U JP H0174572U JP 1987169963 U JP1987169963 U JP 1987169963U JP 16996387 U JP16996387 U JP 16996387U JP H0174572 U JPH0174572 U JP H0174572U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- terminals
- semiconductor device
- socket body
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
Description
第１図は本考案の第１の実施例を示す半導体装
置用ソケツトの斜視図、第２図は従来の半導体装
置用ソケツトの斜視図、第３図はＰＧＡ形半導体
装置の斜視図、第４図は第２図の半導体装置用ソ
ケツトの接続方法を示す側面図、第５図は第２図
の半導体装置用ソケツトの使用方法を示す側面図
、第６図は第１図の平面図、第７図は第１図の一
部破断側面図、第８図は本考案の第２の実施例を
示す半導体装置用ソケツトの一部破断側面図、第
９図は第８図の部分正面図、第１０図は本考案の
第３の実施例を示す半導体装置用ソケツトの一部
破断側面図である。
２１……ソケツト本体、２２……接続端子、２
３……出力端子、２４……ソケツトピン、２６…
…穴あきピン、２７……半球状端子。
1 is a perspective view of a socket for a semiconductor device showing a first embodiment of the present invention, FIG. 2 is a perspective view of a conventional socket for a semiconductor device, FIG. 3 is a perspective view of a PGA type semiconductor device, and FIG. The figure is a side view showing how to connect the semiconductor device socket shown in FIG. 2, FIG. 5 is a side view showing how to use the semiconductor device socket shown in FIG. 2, and FIG. 6 is a plan view of FIG. 7 is a partially cutaway side view of FIG. 1, FIG. 8 is a partially cutaway side view of a socket for a semiconductor device showing a second embodiment of the present invention, and FIG. 9 is a partially cutaway side view of FIG. FIG. 10 is a partially cutaway side view of a socket for a semiconductor device showing a third embodiment of the present invention. 21...Socket body, 22...Connection terminal, 2
3...Output terminal, 24...Socket pin, 26...
...Perforated pin, 27...Semispherical terminal.
Claims (1)
装置の複数の外部導出端子がそれぞれ嵌入、接続
される接続端子と、前記ソケツト本体の下面側に
突設され前記接続端子のそれぞれに接続されたソ
ケツトピンとを備えた半導体装置用ソケツトにお
いて、 前記ソケツト本体の前記接続端子の周囲におけ
る該接続端子のそれぞれに対応した位置に配設さ
れ、前記接続端子のそれぞれに接続された出力端
子を設けたことを特徴とする半導体装置用ソケツ
ト。[Claims for Utility Model Registration] Connecting terminals provided on the upper surface of a plate-shaped socket body into which a plurality of external lead-out terminals of a semiconductor device are respectively inserted and connected, and connecting terminals protruding from the lower surface of the socket body. A socket for a semiconductor device including socket pins connected to each of the terminals, the socket pin being disposed around the connection terminal of the socket body at a position corresponding to each of the connection terminals, and connected to each of the connection terminals. A socket for a semiconductor device, characterized in that it is provided with an output terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169963U JPH0174572U (en) | 1987-11-06 | 1987-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169963U JPH0174572U (en) | 1987-11-06 | 1987-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0174572U true JPH0174572U (en) | 1989-05-19 |
Family
ID=31460490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169963U Pending JPH0174572U (en) | 1987-11-06 | 1987-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0174572U (en) |
-
1987
- 1987-11-06 JP JP1987169963U patent/JPH0174572U/ja active Pending