JPH0173946U - - Google Patents
Info
- Publication number
- JPH0173946U JPH0173946U JP1987169493U JP16949387U JPH0173946U JP H0173946 U JPH0173946 U JP H0173946U JP 1987169493 U JP1987169493 U JP 1987169493U JP 16949387 U JP16949387 U JP 16949387U JP H0173946 U JPH0173946 U JP H0173946U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- resin
- injection side
- thicker
- resin injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169493U JPH0173946U (enFirst) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987169493U JPH0173946U (enFirst) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173946U true JPH0173946U (enFirst) | 1989-05-18 |
Family
ID=31459603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987169493U Pending JPH0173946U (enFirst) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173946U (enFirst) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829847B2 (ja) * | 1978-01-26 | 1983-06-25 | 松下電器産業株式会社 | 抵抗値↓−電圧変換回路 |
| JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
| JPS6442825A (en) * | 1987-08-10 | 1989-02-15 | Sanken Electric Co Ltd | Manufacture of resin sealed semiconductor device |
-
1987
- 1987-11-05 JP JP1987169493U patent/JPH0173946U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5829847B2 (ja) * | 1978-01-26 | 1983-06-25 | 松下電器産業株式会社 | 抵抗値↓−電圧変換回路 |
| JPS59135753A (ja) * | 1983-01-25 | 1984-08-04 | Toshiba Corp | 半導体装置とその製造方法 |
| JPS6442825A (en) * | 1987-08-10 | 1989-02-15 | Sanken Electric Co Ltd | Manufacture of resin sealed semiconductor device |