JPH0171456U - - Google Patents
Info
- Publication number
- JPH0171456U JPH0171456U JP1987167504U JP16750487U JPH0171456U JP H0171456 U JPH0171456 U JP H0171456U JP 1987167504 U JP1987167504 U JP 1987167504U JP 16750487 U JP16750487 U JP 16750487U JP H0171456 U JPH0171456 U JP H0171456U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- connecting portion
- lead frame
- component support
- component installation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987167504U JPH0171456U (xx) | 1987-10-30 | 1987-10-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987167504U JPH0171456U (xx) | 1987-10-30 | 1987-10-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0171456U true JPH0171456U (xx) | 1989-05-12 |
Family
ID=31455861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987167504U Pending JPH0171456U (xx) | 1987-10-30 | 1987-10-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0171456U (xx) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS595984U (ja) * | 1982-07-02 | 1984-01-14 | 余語 良三 | パチンコ機における玉制御装置 |
JPS59159577A (ja) * | 1983-03-03 | 1984-09-10 | Toshiba Corp | 半導体発光表示装置用電極部材およびその製造方法 |
JPS63161685A (ja) * | 1986-12-25 | 1988-07-05 | Toshiba Corp | 発光素子用リ−ドフレ−ムの製造方法 |
-
1987
- 1987-10-30 JP JP1987167504U patent/JPH0171456U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS595984U (ja) * | 1982-07-02 | 1984-01-14 | 余語 良三 | パチンコ機における玉制御装置 |
JPS59159577A (ja) * | 1983-03-03 | 1984-09-10 | Toshiba Corp | 半導体発光表示装置用電極部材およびその製造方法 |
JPS63161685A (ja) * | 1986-12-25 | 1988-07-05 | Toshiba Corp | 発光素子用リ−ドフレ−ムの製造方法 |