JPH0170383U - - Google Patents
Info
- Publication number
- JPH0170383U JPH0170383U JP1987166236U JP16623687U JPH0170383U JP H0170383 U JPH0170383 U JP H0170383U JP 1987166236 U JP1987166236 U JP 1987166236U JP 16623687 U JP16623687 U JP 16623687U JP H0170383 U JPH0170383 U JP H0170383U
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- row
- pads
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987166236U JPH0170383U (US07642317-20100105-C00010.png) | 1987-10-29 | 1987-10-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987166236U JPH0170383U (US07642317-20100105-C00010.png) | 1987-10-29 | 1987-10-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0170383U true JPH0170383U (US07642317-20100105-C00010.png) | 1989-05-10 |
Family
ID=31453444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987166236U Pending JPH0170383U (US07642317-20100105-C00010.png) | 1987-10-29 | 1987-10-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0170383U (US07642317-20100105-C00010.png) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0641724A (ja) * | 1992-07-28 | 1994-02-15 | Ulvac Japan Ltd | 透明導電膜の製造装置 |
JP2016162943A (ja) * | 2015-03-03 | 2016-09-05 | ファナック株式会社 | 板金と樹脂から作製された基板、該基板を備えたモータ、および半田付け方法 |
CN111194140A (zh) * | 2018-11-14 | 2020-05-22 | 丰田自动车株式会社 | 电路基板的制造方法以及电路基板 |
-
1987
- 1987-10-29 JP JP1987166236U patent/JPH0170383U/ja active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0641724A (ja) * | 1992-07-28 | 1994-02-15 | Ulvac Japan Ltd | 透明導電膜の製造装置 |
JP2016162943A (ja) * | 2015-03-03 | 2016-09-05 | ファナック株式会社 | 板金と樹脂から作製された基板、該基板を備えたモータ、および半田付け方法 |
US9979251B2 (en) | 2015-03-03 | 2018-05-22 | Fanuc Corporation | Substrate manufactured from sheet metal and resin, motor provided with substrate, and soldering method therefor |
DE102016103303B4 (de) | 2015-03-03 | 2019-09-05 | Fanuc Corporation | Aus blech und harz hergestelltes substrat, mit dem substrat versehener motor, und lötverfahren dafür |
CN111194140A (zh) * | 2018-11-14 | 2020-05-22 | 丰田自动车株式会社 | 电路基板的制造方法以及电路基板 |
JP2020087941A (ja) * | 2018-11-14 | 2020-06-04 | トヨタ自動車株式会社 | 回路基板の製造方法及び回路基板 |