JPH0167742U - - Google Patents
Info
- Publication number
- JPH0167742U JPH0167742U JP1987163342U JP16334287U JPH0167742U JP H0167742 U JPH0167742 U JP H0167742U JP 1987163342 U JP1987163342 U JP 1987163342U JP 16334287 U JP16334287 U JP 16334287U JP H0167742 U JPH0167742 U JP H0167742U
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- mold
- semiconductor device
- sealed space
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 3
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163342U JPH0167742U (pt) | 1987-10-26 | 1987-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987163342U JPH0167742U (pt) | 1987-10-26 | 1987-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167742U true JPH0167742U (pt) | 1989-05-01 |
Family
ID=31447982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987163342U Pending JPH0167742U (pt) | 1987-10-26 | 1987-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167742U (pt) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482236A (ja) * | 1990-07-25 | 1992-03-16 | Toowa Kk | 電子部品の樹脂封止成形方法及び装置 |
| JP2003048237A (ja) * | 2001-08-08 | 2003-02-18 | Jsr Corp | 導光板の成形方法および環状オレフィン系樹脂の成形方法 |
| JP2015093398A (ja) * | 2013-11-11 | 2015-05-18 | アピックヤマダ株式会社 | 樹脂モールド金型および樹脂モールド成形方法 |
-
1987
- 1987-10-26 JP JP1987163342U patent/JPH0167742U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0482236A (ja) * | 1990-07-25 | 1992-03-16 | Toowa Kk | 電子部品の樹脂封止成形方法及び装置 |
| JP2003048237A (ja) * | 2001-08-08 | 2003-02-18 | Jsr Corp | 導光板の成形方法および環状オレフィン系樹脂の成形方法 |
| JP2015093398A (ja) * | 2013-11-11 | 2015-05-18 | アピックヤマダ株式会社 | 樹脂モールド金型および樹脂モールド成形方法 |