JPH0167075U - - Google Patents

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Publication number
JPH0167075U
JPH0167075U JP1987161421U JP16142187U JPH0167075U JP H0167075 U JPH0167075 U JP H0167075U JP 1987161421 U JP1987161421 U JP 1987161421U JP 16142187 U JP16142187 U JP 16142187U JP H0167075 U JPH0167075 U JP H0167075U
Authority
JP
Japan
Prior art keywords
cover sheet
paper
utility
model registration
surface coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987161421U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0547665Y2 (en)van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987161421U priority Critical patent/JPH0547665Y2/ja
Publication of JPH0167075U publication Critical patent/JPH0167075U/ja
Application granted granted Critical
Publication of JPH0547665Y2 publication Critical patent/JPH0547665Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

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  • Credit Cards Or The Like (AREA)
  • Paper (AREA)
JP1987161421U 1987-10-23 1987-10-23 Expired - Lifetime JPH0547665Y2 (en)van)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987161421U JPH0547665Y2 (en)van) 1987-10-23 1987-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987161421U JPH0547665Y2 (en)van) 1987-10-23 1987-10-23

Publications (2)

Publication Number Publication Date
JPH0167075U true JPH0167075U (en)van) 1989-04-28
JPH0547665Y2 JPH0547665Y2 (en)van) 1993-12-15

Family

ID=31444340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987161421U Expired - Lifetime JPH0547665Y2 (en)van) 1987-10-23 1987-10-23

Country Status (1)

Country Link
JP (1) JPH0547665Y2 (en)van)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148371U (en)van) * 1989-04-06 1990-12-17
JPH0320179U (en)van) * 1989-07-10 1991-02-27
JPH0366772U (en)van) * 1989-05-24 1991-06-28
JPH0445996A (ja) * 1990-06-14 1992-02-14 Sanyo Kokusaku Pulp Co Ltd 感熱積層シート及びそれを用いた記録体
JPH0494679U (en)van) * 1990-12-31 1992-08-17
JP2008265129A (ja) * 2007-04-19 2008-11-06 Nippon Plate Kk 通信シート及び通信シート用プリンター用紙

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7211508B2 (en) 2003-06-18 2007-05-01 Applied Materials, Inc. Atomic layer deposition of tantalum based barrier materials

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351772U (en)van) * 1986-09-24 1988-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6351772U (en)van) * 1986-09-24 1988-04-07

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02148371U (en)van) * 1989-04-06 1990-12-17
JPH0366772U (en)van) * 1989-05-24 1991-06-28
JPH0320179U (en)van) * 1989-07-10 1991-02-27
JPH0445996A (ja) * 1990-06-14 1992-02-14 Sanyo Kokusaku Pulp Co Ltd 感熱積層シート及びそれを用いた記録体
JPH0494679U (en)van) * 1990-12-31 1992-08-17
JP2008265129A (ja) * 2007-04-19 2008-11-06 Nippon Plate Kk 通信シート及び通信シート用プリンター用紙

Also Published As

Publication number Publication date
JPH0547665Y2 (en)van) 1993-12-15

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