JPH0167050U - - Google Patents
Info
- Publication number
- JPH0167050U JPH0167050U JP7570387U JP7570387U JPH0167050U JP H0167050 U JPH0167050 U JP H0167050U JP 7570387 U JP7570387 U JP 7570387U JP 7570387 U JP7570387 U JP 7570387U JP H0167050 U JPH0167050 U JP H0167050U
- Authority
- JP
- Japan
- Prior art keywords
- led
- substrate
- model registration
- utility
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 230000001154 acute effect Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
Description
第１図は、実施例にかかるＬＥＤヘツドの一部
断面斜視図であり、第２図は、該ＬＥＤヘツドを
搭載するＬＥＤプリンタの構成説明図である。ま
た、第３図は、折り曲げる前の基板及び該基板に
搭載されるＬＥＤ素子の断面模式図である。第４
図は従来のＬＥＤヘツドの部分斜視図である。第
５図は、他の実施例にかかるＬＥＤヘツドの一部
断面斜視図である。第６図は、ＬＥＤ素子の温度
と発光強度との関係を示すグラフであり、第６図
は、点灯時間と温度との関係を点灯率をパラメタ
として示すグラフである。
１，１′……ＬＥＤヘツド、２……ＬＥＤアレ
イチツプ、３……駆動ＩＣチツプ、４……基板、
６……熱伝導性セメント。
FIG. 1 is a partially sectional perspective view of an LED head according to an embodiment, and FIG. 2 is an explanatory diagram of the configuration of an LED printer equipped with the LED head. Further, FIG. 3 is a schematic cross-sectional view of the substrate before bending and the LED element mounted on the substrate. Fourth
The figure is a partial perspective view of a conventional LED head. FIG. 5 is a partially sectional perspective view of an LED head according to another embodiment. FIG. 6 is a graph showing the relationship between the temperature of the LED element and the emission intensity, and FIG. 6 is a graph showing the relationship between the lighting time and temperature using the lighting rate as a parameter. 1, 1'...LED head, 2...LED array chip, 3...driver IC chip, 4...substrate,
6...Thermal conductive cement.
補正 昭６３．１１．２９
図面の簡単な説明を次のように補正する。
明細書の１２ページの１２行目の「第６図」を
「第７図」に補正します。Amendment November 29, 1981 The brief description of the drawing is amended as follows. Correct "Figure 6" on line 12 of page 12 of the specification to "Figure 7."
Claims (1)
板上に、前記長尺方向に配列されたＬＥＤ素子群
と、を有するＬＥＤヘツドであつて、 前記基板は、前記配列されたＬＥＤ素子群の側
部近傍にて、該ＬＥＤ素子群の配列面が外表面と
なるようにして立体的に変形され、 該変形された基板で囲まれる空間部に、放熱部
材が配置されているＬＥＤヘツド。 (2) 前記実用新案登録請求の範囲第１項に於い
て、 前記基板は、フレキシブルな材料で形成される
ＬＥＤヘツド。 (3) 前記実用新案登録請求の範囲第１項に於い
て、 前記放熱部材は、熱伝導性セメントであるＬＥ
Ｄヘツド。 (4) 前記実用新案登録請求の範囲第１項に於い
て、 前記放熱部材は、ＬＥＤ素子群と平行に配置さ
れ、内部に冷却材料を循環させるヒートパイプで
あるＬＥＤヘツド。 (5) 前記実用新案登録請求の範囲第１項に於い
て、 前記変形は、前記側部近傍の位置に形成された
切り込み線を利用して鋭角的に行なわれるＬＥＤ
ヘツド。[Claims for Utility Model Registration] (1) An LED head comprising a long substrate for mounting a semiconductor chip, and a group of LED elements arranged in the longitudinal direction on the substrate, the substrate is three-dimensionally deformed near the side of the arranged LED element group so that the arrangement surface of the LED element group becomes the outer surface, and heat radiation is provided in a space surrounded by the deformed substrate. LED head where the parts are arranged. (2) The LED head according to claim 1 of the utility model registration, wherein the substrate is formed of a flexible material. (3) In claim 1 of the utility model registration claim, the heat radiating member is made of LE which is a thermally conductive cement.
D head. (4) The LED head according to claim 1 of the above-mentioned utility model registration, wherein the heat dissipation member is a heat pipe arranged in parallel with a group of LED elements and circulates a cooling material therein. (5) In claim 1 of the utility model registration, the deformation is performed at an acute angle using a cut line formed near the side part of the LED.
Head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7570387U JPH0167050U (en) | 1987-05-20 | 1987-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7570387U JPH0167050U (en) | 1987-05-20 | 1987-05-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167050U true JPH0167050U (en) | 1989-04-28 |
Family
ID=31300760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7570387U Pending JPH0167050U (en) | 1987-05-20 | 1987-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167050U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184384A (en) * | 1989-12-13 | 1991-08-12 | Nec Corp | Optical module submount and manufacture thereof |
| JP2002029084A (en) * | 2000-07-13 | 2002-01-29 | Nippon Sheet Glass Co Ltd | Optical writing head and its assembling method |
-
1987
- 1987-05-20 JP JP7570387U patent/JPH0167050U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03184384A (en) * | 1989-12-13 | 1991-08-12 | Nec Corp | Optical module submount and manufacture thereof |
| JP2002029084A (en) * | 2000-07-13 | 2002-01-29 | Nippon Sheet Glass Co Ltd | Optical writing head and its assembling method |