JPH0167045U - - Google Patents
Info
- Publication number
- JPH0167045U JPH0167045U JP1987161532U JP16153287U JPH0167045U JP H0167045 U JPH0167045 U JP H0167045U JP 1987161532 U JP1987161532 U JP 1987161532U JP 16153287 U JP16153287 U JP 16153287U JP H0167045 U JPH0167045 U JP H0167045U
- Authority
- JP
- Japan
- Prior art keywords
- conduction layer
- heat conduction
- insulating substrate
- low heat
- provided under
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987161532U JPH0167045U (en, 2012) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987161532U JPH0167045U (en, 2012) | 1987-10-21 | 1987-10-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0167045U true JPH0167045U (en, 2012) | 1989-04-28 |
Family
ID=31444550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987161532U Pending JPH0167045U (en, 2012) | 1987-10-21 | 1987-10-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0167045U (en, 2012) |
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1987
- 1987-10-21 JP JP1987161532U patent/JPH0167045U/ja active Pending