JPH0167043U - - Google Patents
Info
- Publication number
- JPH0167043U JPH0167043U JP1987162370U JP16237087U JPH0167043U JP H0167043 U JPH0167043 U JP H0167043U JP 1987162370 U JP1987162370 U JP 1987162370U JP 16237087 U JP16237087 U JP 16237087U JP H0167043 U JPH0167043 U JP H0167043U
- Authority
- JP
- Japan
- Prior art keywords
- current
- recording
- heat
- sheet
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は一実施例を示す断面図、第２図Ａは従
来の記録ヘツドにおける記録電極先端部分を示す
平面図、同図Ｂは同図ＡのＡ−Ａ線位置での断面
図、第３図は記録ヘツドとインクシートを示す概
略断面図、第４図は従来の記録ヘツドの印字機構
を示す正面図、第５図は本実施例の印字機構を示
す正面図である。
６……インクシート、２２……記録紙、２４…
…シリコンチツプ、３０……出力パツド、３４…
…バンプ。
FIG. 1 is a cross-sectional view showing one embodiment, FIG. 2A is a plan view showing the tip of a recording electrode in a conventional recording head, FIG. 3 is a schematic sectional view showing a recording head and an ink sheet, FIG. 4 is a front view showing a printing mechanism of a conventional recording head, and FIG. 5 is a front view showing a printing mechanism of this embodiment. 6... Ink sheet, 22... Recording paper, 24...
...Silicon chip, 30...Output pad, 34...
…bump.
Claims (1)
インクシートに接触して電流を流し、前記抵抗層
を発熱させて前記インク層を記録媒体に転写させ
て記録を得る通電記録に用いられる記録ヘツドに
おいて、通電駆動用ＩＣチツプ上に出力パツドに
つながるバンプを隆起させて等間隔で列状に形成
し、それらのバンプを通電発熱インクシートに接
触する記録電極としたことを特徴とする記録ヘツ
ド。 In a recording head used for current-carrying recording, a current is applied to a current-carrying heat-generating ink sheet having at least a resistance layer and an ink layer, and a current is passed through the sheet, causing the resistance layer to generate heat and transferring the ink layer to a recording medium to obtain a record. A recording head characterized in that bumps connected to output pads are raised and formed in rows on a driving IC chip at equal intervals, and the bumps are used as recording electrodes that contact an energized and heat-generating ink sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162370U JPH0167043U (en) | 1987-10-22 | 1987-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162370U JPH0167043U (en) | 1987-10-22 | 1987-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167043U true JPH0167043U (en) | 1989-04-28 |
Family
ID=31446132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162370U Pending JPH0167043U (en) | 1987-10-22 | 1987-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167043U (en) |
-
1987
- 1987-10-22 JP JP1987162370U patent/JPH0167043U/ja active Pending
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