JPH0165144U - - Google Patents
Info
- Publication number
- JPH0165144U JPH0165144U JP1987161873U JP16187387U JPH0165144U JP H0165144 U JPH0165144 U JP H0165144U JP 1987161873 U JP1987161873 U JP 1987161873U JP 16187387 U JP16187387 U JP 16187387U JP H0165144 U JPH0165144 U JP H0165144U
- Authority
- JP
- Japan
- Prior art keywords
- land
- land portion
- lead frame
- air vent
- gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161873U JPH0165144U (cg-RX-API-DMAC7.html) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161873U JPH0165144U (cg-RX-API-DMAC7.html) | 1987-10-21 | 1987-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165144U true JPH0165144U (cg-RX-API-DMAC7.html) | 1989-04-26 |
Family
ID=31445194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161873U Pending JPH0165144U (cg-RX-API-DMAC7.html) | 1987-10-21 | 1987-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165144U (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014053461A (ja) * | 2012-09-07 | 2014-03-20 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6123351A (ja) * | 1984-07-11 | 1986-01-31 | Nec Corp | リ−ドフレ−ム |
-
1987
- 1987-10-21 JP JP1987161873U patent/JPH0165144U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6123351A (ja) * | 1984-07-11 | 1986-01-31 | Nec Corp | リ−ドフレ−ム |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014053461A (ja) * | 2012-09-07 | 2014-03-20 | Renesas Electronics Corp | 半導体装置の製造方法および半導体装置 |
| US9385071B2 (en) | 2012-09-07 | 2016-07-05 | Renesas Electronics Corporation | Manufacturing method of semiconductor device and semiconductor device |