JPH0160559U - - Google Patents

Info

Publication number
JPH0160559U
JPH0160559U JP1987155339U JP15533987U JPH0160559U JP H0160559 U JPH0160559 U JP H0160559U JP 1987155339 U JP1987155339 U JP 1987155339U JP 15533987 U JP15533987 U JP 15533987U JP H0160559 U JPH0160559 U JP H0160559U
Authority
JP
Japan
Prior art keywords
side frame
resin sealing
tie bar
light emitting
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1987155339U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0639463Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987155339U priority Critical patent/JPH0639463Y2/ja
Publication of JPH0160559U publication Critical patent/JPH0160559U/ja
Application granted granted Critical
Publication of JPH0639463Y2 publication Critical patent/JPH0639463Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987155339U 1987-10-09 1987-10-09 発光ダイオード素子の樹脂封止用リードフレーム Expired - Lifetime JPH0639463Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987155339U JPH0639463Y2 (ja) 1987-10-09 1987-10-09 発光ダイオード素子の樹脂封止用リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987155339U JPH0639463Y2 (ja) 1987-10-09 1987-10-09 発光ダイオード素子の樹脂封止用リードフレーム

Publications (2)

Publication Number Publication Date
JPH0160559U true JPH0160559U (US08188275-20120529-C00054.png) 1989-04-17
JPH0639463Y2 JPH0639463Y2 (ja) 1994-10-12

Family

ID=31432879

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987155339U Expired - Lifetime JPH0639463Y2 (ja) 1987-10-09 1987-10-09 発光ダイオード素子の樹脂封止用リードフレーム

Country Status (1)

Country Link
JP (1) JPH0639463Y2 (US08188275-20120529-C00054.png)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63287045A (ja) * 1987-05-19 1988-11-24 Sharp Corp 光半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63287045A (ja) * 1987-05-19 1988-11-24 Sharp Corp 光半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0639463Y2 (ja) 1994-10-12

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