JPH0160547U - - Google Patents
Info
- Publication number
- JPH0160547U JPH0160547U JP15640187U JP15640187U JPH0160547U JP H0160547 U JPH0160547 U JP H0160547U JP 15640187 U JP15640187 U JP 15640187U JP 15640187 U JP15640187 U JP 15640187U JP H0160547 U JPH0160547 U JP H0160547U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- lead frame
- lead
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15640187U JPH0160547U (zh) | 1987-10-12 | 1987-10-12 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15640187U JPH0160547U (zh) | 1987-10-12 | 1987-10-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0160547U true JPH0160547U (zh) | 1989-04-17 |
Family
ID=31434907
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15640187U Pending JPH0160547U (zh) | 1987-10-12 | 1987-10-12 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0160547U (zh) |
-
1987
- 1987-10-12 JP JP15640187U patent/JPH0160547U/ja active Pending