JPH0159039B2 - - Google Patents

Info

Publication number
JPH0159039B2
JPH0159039B2 JP57066113A JP6611382A JPH0159039B2 JP H0159039 B2 JPH0159039 B2 JP H0159039B2 JP 57066113 A JP57066113 A JP 57066113A JP 6611382 A JP6611382 A JP 6611382A JP H0159039 B2 JPH0159039 B2 JP H0159039B2
Authority
JP
Japan
Prior art keywords
scale
sulfur
sodium hydroxide
hydrazine
sodium metasilicate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57066113A
Other languages
Japanese (ja)
Other versions
JPS58183996A (en
Inventor
Keiichi Miwa
Masatada Yamashita
Yoshio Hamao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IHI Corp
Original Assignee
IHI Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IHI Corp filed Critical IHI Corp
Priority to JP6611382A priority Critical patent/JPS58183996A/en
Publication of JPS58183996A publication Critical patent/JPS58183996A/en
Publication of JPH0159039B2 publication Critical patent/JPH0159039B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/14Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Description

【発明の詳細な説明】[Detailed description of the invention]

本発明は壁面に付着した単体イオウおよびイオ
ウ化合物を主体とするイオウスケールの安全かつ
迅速に溶解剥離するイオウスケールの化学的除去
方法に関する。 地熱発電所の冷却水系統の機器、配管や温泉水
を輸送する配管などのように、硫化水素を含む水
で運転される機器やその配管(材質はいずれも炭
素鋼、不銹鋼、アルミニウム合金)の壁面に硫化
水素から生成した熱伝導率の悪い単体イオウやイ
オウ化合物が付着し、それによつて伝導阻外やそ
のスケールによる配管などの閉塞も考えられる。
従つて、この種のスケールが付着する機器の稼動
率を高めるためには、該スケールの除去が必要で
ある。 しかしながら、単体イオウは化学的に非常に安
定で、直接溶解するためには取扱いの危険な二硫
化炭素を使用するしかない。そのため、機械的な
手段で、除去する方法が一般的であるが、該スケ
ールが乾燥すると、強固なスケールとなり、機械
的な除去法ですら困難になる。 本発明は上記の従来方法の欠点を解決し、壁面
に付着した単体イオウおよびイオウ化合物を主体
とするイオウスケールを安全かつ迅速に溶解剥離
するイオウスケールの化学的除去方法を提供する
もので、その要旨とするところは、ヒドラジン5
%以上および水酸化ナトリウムまたはメタケイ酸
ナトリウム0.1〜1.0%を含む水溶液を壁面に付着
した単体イオウおよびイオウ化合物を主体とする
イオウスケールに接触させることを特徴とするイ
オウスケールの化学的除去方法、にある。 本発明で使用されるヒドラジン5%以上及び水
酸化ナトリウムまたはメタケイ酸ナトリウム0.1
〜1.0%を含む水溶液の単体イオウおよびイオウ
化合物を主体とするスケールを溶解剥離する反応
機構について述べると、次のごとくである。 (1) ヒドラジン(N2H4)の作用 ヒドラジンは次の式で示すように、アルカリ
溶液中で化学的に活性化が高くなるので、これ
をス 3N2H4+2S→(N2H42・H2S+N2+H2S ケールの主成分である単体イオウに反応させ、
イオウ粒子表面をヒドラジン硫化物に変える。
また、このとき発生するN2ガスやH2Sガスは
ルーズな構造に変つた該スケールの崩壊を促進
する。ヒドラジンの添加量5%未満ではこの効
果はほとんどない。 (2) 水酸化ナトリウム(NaOH)の作用 水酸化ナトリウムはヒドラジンの該スケール
中への浸透性と還元剥離効果を高め、水酸化ナ
トリウムで溶けた硫化物(Na2S)がさらにイ
オウを溶かし、Na2S2、Na2S5、Na2S9などの
多硫化物をつくる。 また系統内にアルミニウム合金で構成された
機器や配管がある場合、水酸化ナトリウム代り
に、メタケイ酸ナトリウム(Na2SiO3)を0.1
〜1.0%添加してもよい。 水酸化ナトリウム、メタケイ酸ナトリウムの
添加量が0.1未満では上記の効果がなく、1%
を越えると母材の腐食が大きくなる。 次に、本発明を実施例によつてさらに具体的に
説明する。 実施例 スケール付着量20mg/cm2の実械配管を温度20℃
で5%以上のヒドラジンおよび0.1〜1.0%の水酸
化ナトリウムを含む溶液に24時間浸漬静置処理す
ると、スケールは完全に除去できる。なお、ヒド
ラジン5%以上、水酸化ナトリウム0.1〜1.0%の
範囲内でのスケール除去率および母材の腐食率を
第1表に示す。
The present invention relates to a method for chemically removing sulfur scale, which safely and quickly dissolves and peels off sulfur scale mainly consisting of elemental sulfur and sulfur compounds attached to a wall surface. Equipment and piping (all made of carbon steel, stainless steel, and aluminum alloy) that are operated with water containing hydrogen sulfide, such as cooling water system equipment and piping in geothermal power plants and piping that transports hot spring water, etc. Elemental sulfur and sulfur compounds with poor thermal conductivity generated from hydrogen sulfide may adhere to the walls, which may lead to conduction failure or blockage of pipes due to the scale.
Therefore, in order to increase the operating rate of equipment to which this type of scale adheres, it is necessary to remove the scale. However, elemental sulfur is chemically very stable, and the only way to directly dissolve it is to use carbon disulfide, which is dangerous to handle. Therefore, it is common to remove the scale by mechanical means, but when the scale dries, it becomes a strong scale, making even mechanical removal difficult. The present invention solves the drawbacks of the above-mentioned conventional methods and provides a method for chemically removing sulfur scale, which safely and quickly dissolves and peels off sulfur scale mainly consisting of simple sulfur and sulfur compounds attached to walls. The gist is that hydrazine 5
% or more and 0.1 to 1.0% of sodium hydroxide or sodium metasilicate to a sulfur scale mainly composed of elemental sulfur and sulfur compounds attached to a wall surface. be. 5% or more of hydrazine and 0.1 sodium hydroxide or sodium metasilicate used in the present invention
The reaction mechanism for dissolving and peeling off scale mainly composed of elemental sulfur and sulfur compounds in an aqueous solution containing ~1.0% is as follows. (1) Effect of hydrazine (N 2 H 4 ) As shown in the following formula, hydrazine is chemically highly activated in an alkaline solution. ) 2・H 2 S + N 2 + H 2 S Reacts with elemental sulfur, which is the main component of kale,
Converts the surface of sulfur particles to hydrazine sulfide.
Further, the N 2 gas and H 2 S gas generated at this time promote the collapse of the scale, which has changed into a loose structure. This effect is almost absent when the amount of hydrazine added is less than 5%. (2) Effect of sodium hydroxide (NaOH) Sodium hydroxide increases the permeability of hydrazine into the scale and the reduction removal effect, and the sulfide (Na 2 S) dissolved in sodium hydroxide further dissolves sulfur. Creates polysulfides such as Na 2 S 2 , Na 2 S 5 and Na 2 S 9 . Also, if there are equipment or piping made of aluminum alloy in the system, use 0.1% sodium metasilicate (Na 2 SiO 3 ) instead of sodium hydroxide.
~1.0% may be added. If the amount of sodium hydroxide or sodium metasilicate added is less than 0.1, the above effect will not be achieved, and 1%
Exceeding this will result in greater corrosion of the base metal. Next, the present invention will be explained in more detail with reference to Examples. Example: Actual piping with a scale adhesion amount of 20 mg/cm 2 at a temperature of 20°C
Scale can be completely removed by immersing and standing in a solution containing 5% or more hydrazine and 0.1 to 1.0% sodium hydroxide for 24 hours. Table 1 shows the scale removal rate and base material corrosion rate within the range of 5% or more of hydrazine and 0.1 to 1.0% of sodium hydroxide.

【表】【table】

【表】 比較例 実施例1と同一配管を5%塩酸にインヒビター
を加えた溶液(ボイラーの蒸発管に付着したスケ
ールを除去するのに使用されているもの)で実施
例と同一条件で処理したところ、スケールの除去
率は37%程度で完全に除去することができなかつ
た。 なお、比較例の2例の結果を次の第2表に示
す。
[Table] Comparative Example The same piping as in Example 1 was treated with a solution of 5% hydrochloric acid and an inhibitor (used to remove scale attached to boiler evaporation tubes) under the same conditions as in Example. However, the scale removal rate was about 37%, and it was not possible to completely remove the scale. The results of two comparative examples are shown in Table 2 below.

【表】 上記の2例ではスケールが溶解しなかつた。 また、スケール除去時の母材腐食量について述
べる。 母材が炭素鋼、不銹鋼については腐食量は<
0.02mg/cm2・48Hrで無視できる程度であるが、
アルミニウム合金については図に示すように、水
酸化ナトリウム濃度を0.1%にすれば腐食量は0.1
mg/cm2・Hrとなる。この場合、水酸化ナトリウ
ムの代りに、メタケイ酸ナトリウムを使用する
と、腐食量をさらに小さくできる。 本発明の効果は次の通りである。 (1) 5%以上のヒドラジンおよび0.1〜1.0%の水
酸化ナトリウムを含む水溶液で、従来法では化
学的に除去することが困難であつたイオウスケ
ールを完全に付着面から溶解剥離して除去する
ことができる。 (2) 本発明の除去方法は常温で処理できかつ流速
も必要でない。 (3) 構成材料によつて、水酸化ナトリウムの代り
に、メタケイ酸ナトリウムを用いることができ
る。 (4) 洗浄時の構成材料の腐食量は無視できる程度
で問題ない。 (5) 引火性のつよい二硫化炭素を使用する必要が
ないので、イオウスケール除去作業上の危険が
少ない。
[Table] In the two examples above, the scale did not dissolve. We will also discuss the amount of base metal corrosion during scale removal. If the base material is carbon steel or stainless steel, the amount of corrosion is <
Although it is negligible at 0.02mg/cm 2・48Hr,
For aluminum alloys, as shown in the figure, if the sodium hydroxide concentration is 0.1%, the amount of corrosion will be 0.1%.
mg/cm 2・Hr. In this case, if sodium metasilicate is used instead of sodium hydroxide, the amount of corrosion can be further reduced. The effects of the present invention are as follows. (1) Using an aqueous solution containing 5% or more hydrazine and 0.1 to 1.0% sodium hydroxide, sulfur scale, which was difficult to chemically remove using conventional methods, is completely dissolved and peeled off from the adhering surface. be able to. (2) The removal method of the present invention can be processed at room temperature and does not require a flow rate. (3) Depending on the constituent materials, sodium metasilicate may be used instead of sodium hydroxide. (4) The amount of corrosion of the constituent materials during cleaning is negligible and is not a problem. (5) Since there is no need to use highly flammable carbon disulfide, there is less danger in the sulfur scale removal work.

【図面の簡単な説明】[Brief explanation of drawings]

添付図は0.1〜1.0%のNaOH(又は、メタケイ
酸ナトリウム)と5%N2H4を含む溶液中での
NaOH(又は、メタケイ酸ナトリウム)の濃度と
アルミニウム合金の腐食率の関係を示すグラフ
図、曲線はNaOHの場合、曲線はメタケイ
酸ナトリウムの場合である。
The attached figure shows the reaction in a solution containing 0.1-1.0% NaOH (or sodium metasilicate) and 5% N2H4 .
A graph showing the relationship between the concentration of NaOH (or sodium metasilicate) and the corrosion rate of aluminum alloy. The curve is for NaOH and the curve is for sodium metasilicate.

Claims (1)

【特許請求の範囲】[Claims] 1 ヒドラジン5%以上および水酸化ナトリウム
またはメタケイ酸ナトリウム0.1〜1.0%を含む水
溶液を壁面に付着した単体イオウおよびイオウ化
合物を主体とするイオウスケールに接触させるこ
とを特徴とするイオウスケールの化学的除去方
法。
1. Chemical removal of sulfur scale, characterized by bringing an aqueous solution containing 5% or more of hydrazine and 0.1 to 1.0% of sodium hydroxide or sodium metasilicate into contact with sulfur scale, which is mainly composed of elemental sulfur and sulfur compounds attached to a wall surface. Method.
JP6611382A 1982-04-20 1982-04-20 Chemical removal of sulfur scale Granted JPS58183996A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6611382A JPS58183996A (en) 1982-04-20 1982-04-20 Chemical removal of sulfur scale

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6611382A JPS58183996A (en) 1982-04-20 1982-04-20 Chemical removal of sulfur scale

Publications (2)

Publication Number Publication Date
JPS58183996A JPS58183996A (en) 1983-10-27
JPH0159039B2 true JPH0159039B2 (en) 1989-12-14

Family

ID=13306500

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6611382A Granted JPS58183996A (en) 1982-04-20 1982-04-20 Chemical removal of sulfur scale

Country Status (1)

Country Link
JP (1) JPS58183996A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03646U (en) * 1989-05-24 1991-01-08
JPH052065Y2 (en) * 1989-04-21 1993-01-19

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6872747B2 (en) * 2017-01-17 2021-05-19 株式会社片山化学工業研究所 Sulfur scale cleaning agent and sulfur scale cleaning method using it

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH052065Y2 (en) * 1989-04-21 1993-01-19
JPH03646U (en) * 1989-05-24 1991-01-08

Also Published As

Publication number Publication date
JPS58183996A (en) 1983-10-27

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