JPH0157910B2 - - Google Patents
Info
- Publication number
- JPH0157910B2 JPH0157910B2 JP12330882A JP12330882A JPH0157910B2 JP H0157910 B2 JPH0157910 B2 JP H0157910B2 JP 12330882 A JP12330882 A JP 12330882A JP 12330882 A JP12330882 A JP 12330882A JP H0157910 B2 JPH0157910 B2 JP H0157910B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- layer
- electrophotographic
- photoconductive layer
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 7
- 230000003746 surface roughness Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 20
- 238000000576 coating method Methods 0.000 description 20
- 238000007639 printing Methods 0.000 description 18
- 239000000203 mixture Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 12
- 229920001577 copolymer Polymers 0.000 description 10
- -1 polyethylene Polymers 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 239000004816 latex Substances 0.000 description 5
- 229920000126 latex Polymers 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920003048 styrene butadiene rubber Polymers 0.000 description 5
- 238000011282 treatment Methods 0.000 description 5
- 239000002174 Styrene-butadiene Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 238000003851 corona treatment Methods 0.000 description 4
- 239000002270 dispersing agent Substances 0.000 description 4
- 239000000839 emulsion Substances 0.000 description 4
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 229920002125 Sokalan® Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000004584 polyacrylic acid Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 229920002689 polyvinyl acetate Polymers 0.000 description 3
- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229920006242 ethylene acrylic acid copolymer Polymers 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 229920003145 methacrylic acid copolymer Polymers 0.000 description 2
- 238000007645 offset printing Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- PZWQOGNTADJZGH-SNAWJCMRSA-N (2e)-2-methylpenta-2,4-dienoic acid Chemical compound OC(=O)C(/C)=C/C=C PZWQOGNTADJZGH-SNAWJCMRSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- PYSRRFNXTXNWCD-UHFFFAOYSA-N 3-(2-phenylethenyl)furan-2,5-dione Chemical compound O=C1OC(=O)C(C=CC=2C=CC=CC=2)=C1 PYSRRFNXTXNWCD-UHFFFAOYSA-N 0.000 description 1
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229920000147 Styrene maleic anhydride Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000586 desensitisation Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920005648 ethylene methacrylic acid copolymer Polymers 0.000 description 1
- 229920006226 ethylene-acrylic acid Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- GNBHRKFJIUUOQI-UHFFFAOYSA-N fluorescein Chemical compound O1C(=O)C2=CC=CC=C2C21C1=CC=C(O)C=C1OC1=CC(O)=CC=C21 GNBHRKFJIUUOQI-UHFFFAOYSA-N 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229940100630 metacresol Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 229920003146 methacrylic ester copolymer Polymers 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 1
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- ZFDPAZDODACYOG-UHFFFAOYSA-M sodium;[(1,5-dimethyl-3-oxo-2-phenylpyrazol-4-yl)amino]methanesulfonate Chemical compound [Na+].CN1C(C)=C(NCS([O-])(=O)=O)C(=O)N1C1=CC=CC=C1 ZFDPAZDODACYOG-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G13/00—Electrographic processes using a charge pattern
- G03G13/26—Electrographic processes using a charge pattern for the production of printing plates for non-xerographic printing processes
- G03G13/28—Planographic printing plates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photoreceptors In Electrophotography (AREA)
Description
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The present invention relates to an electrophotographic plate making material capable of making planographic printing plates by electrophotography, and particularly relates to an electrophotographic plate material having improved pressure resistance and image quality. A method of producing a lithographic printing plate by electrophotography is well known, and generally involves uniformly charging a photoconductive layer of an electrophotographic plate material, imagewise exposing it, and then performing wet or dry development to obtain a toner image. After fixing this toner image, a desensitizing liquid (etching liquid) is applied.
The non-image areas with no toner image are made hydrophilic by processing to form a lithographic printing plate. As such an electrophotographic printing material, one using a paper support is conventionally known, but with this material, toner sometimes adheres to areas subjected to pressure, resulting in printing stains. In other words, friction is reduced during the manufacturing process of the electrophotographic material, by friction with the pass rolls in the plate-making machine, or by friction with the back side of the material during the handling work before loading the sheet-shaped electrophotographic material into the plate-making machine. As a result of pressure deformation of the receiving area or change of electrophotographic characteristics, toner may also adhere to non-image areas, resulting in printing stains. Furthermore, if the smoothness of the photoconductive layer is increased in order to improve image quality, the above-mentioned pressure resistance may deteriorate, and there is a limit to the improvement of image quality. Therefore, an object of the present invention is, firstly, to provide an electrophotographic printing material that can obtain a lithographic printing plate with excellent pressure resistance, easy handling, and less staining, and secondly, to provide an electrophotographic printing plate that has excellent pressure resistance and is easy to handle. The purpose of the present invention is to provide excellent electrophotographic printing materials. As a result of various studies, the present inventors provided a pressure relief layer with a Young's modulus of 2Ã10 10 dynes/cm 2 or less at 25°C on at least one surface of the supporting substrate, and the volume resistivity of the supporting substrate was It has been found that the above objects can be achieved by using an electrophotographic printing material comprising a photoconductive layer provided on a support having a resistance of 10 10 Ω or less. The volume resistance here refers to the current value A (ampere) when a sample is sandwiched between two circular electrodes with a radius of 2.5 cm and a DC voltage V (volt) is applied between the electrodes.
It is the resistance value obtained by reading R v = V/A (Ω). The main components of the above pressure relief layer include polyethylene, polypropylene, natural rubber, SBR rubber,
ABS rubber, fluorinated resin, etc. are suitable, but there are no particular limitations as long as the Young's modulus of the obtained layer is 2Ã10 10 dynes/cm 2 or less at 25°C. For example, ethylene- Vinyl acetate copolymer, ethylene-acrylic ester copolymer, ethylene-methacrylic ester copolymer, polyacrylic acid, polyacrylic ester, polymethacrylic acid, polymethacrylic ester, ethylene-acrylic acid copolymer, Ethylene-acrylonitrile-
A methacrylic acid copolymer, an ethylene-acrylonitrile-methacrylic acid ester copolymer, etc. may also be used, or a mixture of these may be used. Such a pressure relief layer contains an electronically conductive substance so that the volume resistivity of the support finally obtained is 10 10 Ω or less. Particularly preferred electronically conductive materials include French patent No.
2277136 and U.S. Pat. No. 3,597,272, in particular oxides of metals selected from zinc, magnesium, tin, barium, indium, molybdenum, aluminum, titanium, silicon, preferably Fine particles of a crystalline oxide or its composite oxide, or carbon black are used. Among these, conductive carbon black is advantageous because it is inexpensive and easy to mix. Such an electronically conductive substance is contained so that the support has a volume resistivity of 10 10 Ω or less, more preferably 10 8 Ω or less. The specific amount used to achieve such a resistance value cannot be determined unconditionally because it varies depending on the type of supporting substrate, polymer, and electronically conductive material, but as a general guideline, it is The content ranges from 5 to 30% by weight. A layer as described above covers at least one side of the supporting substrate;
More preferably, both sides may be coated by a laminating method or by coating with an aqueous polymer latex or the like. The thickness of the pressure relief layer thus obtained was 5
A range of ~50Ό is appropriate. When it becomes thinner than 5Ό,
The pressure resistance becomes insufficient, and on the other hand, if the thickness is made thicker than 50 Όm, no further improvement in performance can be expected, and the cost will only increase. Therefore, the preferred thickness is 10-30Ό. When applying polyolefin by the melt lamination method, in order to improve the adhesive strength between the base paper and the polyolefin laminate layer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, or ethylene-methacrylic acid ester is applied on the base paper in advance. Polyethylene derivatives such as copolymers, ethylene-acrylic acid copolymers, ethylene-methacrylic acid copolymers, ethylene-acrylonitrile-acrylic acid copolymers, ethylene-acrylonitrile-methacrylic acid copolymers, etc. It is preferable that the surface of the substrate be subjected to corona discharge treatment. Alternatively,
JP-A-49-24126, JP-A No. 52-36176, JP-A No. 52-
The base paper can also be subjected to the surface treatments described in Japanese Patent Publications No. 121683, No. 53-2612, No. 54-111331, and Japanese Patent Publication No. 51-25337. On the other hand, the supporting substrate used in the present invention is
Any conductive base paper conventionally used in electrophotographic photosensitive materials can be used, such as ion conductive substances and inorganic metal compounds such as those described in the specifications of U.S. Pat. No. 3,597,272 and French Patent No. 2,277,136. , paper impregnated with electronically conductive substances such as carbon, or mixed during paper making, and those described in Japanese Patent Publications No. 52-4239, No. 53-19031, and No. 53-19654. Synthetic paper can be used. The photoconductive layer provided on the support as described above is composed of a photoconductive substance and a binder. Examples of the photoconductive substance include inorganic photoconductive substances such as zinc oxide, cadmium sulfide, and titanium oxide, and organic photoconductive substances such as phthalonanine dyes. A photoconductive material is used. As the binder, silicone resin, polystyrene, polyacrylic or methacrylic acid ester, polyvinyl acetate, polyvinyl chloride, polyvinyl butyral, and derivatives thereof are used. The ratio of photoconductive material to binder is suitably used in a weight ratio of 3:1 to 20:1. Further, a sensitizer, a coating aid used during coating, etc. can be added as necessary. Such a photoconductive layer is provided on the above-mentioned support, and the surface is prepared in advance by coating, for example, in US Pat. No. 3,411,908.
As described in the specification, surface treatment such as corona discharge treatment, glow discharge treatment, flame treatment, ultraviolet treatment, ozone treatment, plasma treatment, etc. improves the adhesive strength with the photoconductive layer. Therefore, it is preferable. The thickness of the photoconductive layer thus provided is suitably in the range of 5 to 30 microns. In a particularly preferred embodiment of the invention, an intermediate layer may be further provided between the support and the photoconductive layer. The resin used for the intermediate layer is not particularly limited, and examples thereof include polyethylene terephthalate, polyimide, polycarbonate, polyacrylate, polymethyl methacrylate, polyvinyl fluoride, polyvinyl chloride, polyvinyl acetate, polystyrene, styrene-butadiene copolymer, and polystyrene. Methacrylate, silicone resin, chlorinated rubber, epoxy resin, pure and modified alkyd resin, polyethyl methacrylate, poly-
n-Butyl methacrylate, cellulose acetate, ketone resin, polyethylene, polypropylene, polyacrylonitrile, rosin derivative, polyvinylidene chloride, nitrocellulose, phenol-formaldehyde resin, metacresol formaldehyde resin, styrene-maleic anhydride copolymer, polyacrylic acid - polyacrylic acid amide copolymer,
Ethylene glycol fumarate copolymer, methyl vinyl ether-maleic anhydride copolymer, acryloylglycine-vinyl acetate copolymer, polyvinylpyrrolidone, polyvinyl alcohol, polyamide, halogenated styrene, etc. are used. The coating amount of the intermediate layer is used in the range of 0.01 to 10 g/m 2 .
Further, if necessary, a conductive inorganic salt may be mixed into the intermediate layer polymer. A lithographic printing plate using the electrophotographic plate material of the present invention may be prepared by a conventionally known method. Specifically, the photoconductive layer is uniformly charged using a corona charging method or the like, and then imagewise exposed to form a charged image, and toner is deposited imagewise using a wet or dry method. It is fixed by means such as heating. Next, the non-image area to which toner is not attached is treated with a desensitizing liquid to make it hydrophilic. As the desensitizing liquid, for example, a ferrocyan compound or a composition containing a ferricyanide compound as described in US Pat. No. 4,116,698, or a metal complex salt as described in US Pat. No. 4,282,811 can be used. Compositions containing such compounds can be used. By performing offset printing in a conventional manner using the lithographic printing plate thus prepared, printed matter with excellent pressure resistance, easy handling, and less staining can be obtained. The electrophotographic printing material of the present invention has, as a support,
It is necessary that its volume resistance is 10 10 Ω or less,
If it is more than that, toner tends to adhere to non-image areas as well, causing stains. The first performance characteristic of the electrophotographic plate material of the present invention is that its pressure resistance is dramatically improved, and there is almost no occurrence of scratches or stains due to carelessness in handling or poor transportation in automatic plate making machines. . Second, in order to improve image quality, even if the surface smoothness of the photoconductive layer is increased, pressure resistance deterioration can be prevented, resulting in excellent image quality. For example, with wet development, 133 lines/
It is possible to reproduce inch halftone dot images. Hereinafter, the present invention will be explained in more detail with reference to Examples. Note that "%" and "parts" indicate weight % and parts by weight, respectively, unless otherwise specified. Example 1 A 5% aqueous solution of polyvinylbenzyltrimethylammonium chloride was applied to high-quality paper with a basis weight of 100 g/ m2.
After applying 20 g/m 2 , it was dried to obtain a conductive base paper. After coating and drying an aqueous latex of ethylene-methyl acrylate-acrylic acid copolymer (weight ratio 65:30:5) to a dry coverage of 0.2 g/m 2 on both sides, polyethylene (density 0.92 , average molecular weight 22,000, softening point 112â) and 15% conductive carbon (melt index: 3) are laminated and supported on both sides with a thickness of 25ÎŒ on each side by extrusion method. I got body a. The volume resistance of this support was 10 8 Ω.
Further, the Young's modulus of the peeled and isolated polyolefin layer was approximately 8Ã10 9 dynes/cm 2 . Next, the surface of the polyethylene laminate layer on one side of the support was subjected to a corona discharge treatment under the conditions of 5 kVA sec/m 2 , and a coating solution having the following composition was applied thereon using a wire bar to give a dry coverage of 1 g/m 2 An intermediate layer was formed by coating and drying the mixture as described above. Colloidal alumina (15% aqueous solution) 50 parts Colloidal silica (20% aqueous solution) 20 parts Polyvinyl acetate emulsion (Sevian A manufactured by Daicel Corporation) 150 parts Surfactant (Kawaken Huain Chemical Co., Ltd.) Amizole DC) 0.1 part Water 100 parts On top of this intermediate layer, in order to improve the smoothness of the photoconductive layer, a coating solution with the following composition was dispersed in a ball mill for about 20 hours, which is longer than usual, until the dry coating amount was 20 g/m 2 A photoconductive layer was provided by coating and drying to obtain electrophotographic plate material A of the present invention. Photoconductive layer coating solution formulation Photoconductive zinc oxide (Sazex 2000 manufactured by Sakai Chemical Co., Ltd.) 100 parts Silicone resin (KR-211 manufactured by Shin-Etsu Chemical Co., Ltd.) 35 parts Rose Bengal 0.1 part Fluorescein 0.2 parts Methanol 10 parts Toluene 150 parts Electrophotographic plate material A obtained in this way
After leaving it in a dark place at 25°C and 50% RH for 24 hours, it was made into a plate using a PM355 plate making machine manufactured by Iwasaki Tsushinsha. This was desensitized using an etching solution manufactured by Addressograph Multigraph Co., Ltd., and then printed on the offset printing machine Hamadastar.
When printing was carried out at 700, a good printed matter was obtained that could reproduce a halftone image of 133 lines/inch. Furthermore, an example comparing the effect of pressure resistance with conventional electrophotographic printing materials is shown below. Comparative Example 1 A conventional waterproof layer having the composition shown below was applied to both sides of the above conductive base paper so that it would have a weight of about 25 g/m 2 after drying.
A support was obtained. Next, a photoconductive layer of about 20 g/m 2 was provided to improve the smoothness as described above to obtain a conventional electrophotographic printing material B. Conventional waterproof layer composition: Clay 7 parts Calcium carbonate 3 parts Starch 1.5 parts Conductive resin (ECR-34 manufactured by Dow Chemical Company)
1.5 parts Water 100 parts Comparative Example 2 On the support of Comparative Example 1 above, a photoconductive coating solution having the same composition as in Example 1 was normally dispersed (approximately 4 hours in a ball mill), and after drying, approximately 20 g /m 2 to obtain a conventional electrophotographic plate material C. After making scratches on the surface of three electrophotographic plate materials A, B, and C using a scratch tester manufactured by Shinto Kagakusha,
Plate making, desensitization treatment, and printing were performed using conventional methods, and scratches and stains were compared. In addition, the surface of each photoconductive layer was rubbed with the back surface of each layer, and the friction stains were compared using the same method as described above. Furthermore, the center line average roughness Ra of the photoconductive layer was compared using a stylus meter Surfcom 300B manufactured by Tokyo Seimitsu Co., Ltd. at a measurement speed of 0.3 mm/sec with a 5Ό diamond needle. These results are shown in Table 1 together with the Young's modulus of the pressure relief layer and the image quality of the printed matter.
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瀺ããã[Table] According to the present invention, an electrophotographic plate material having excellent pressure resistance and excellent image quality was obtained. Example 2 Four coating solutions d, e, f, and g having the composition shown below were applied at 25 g/m 2 on both sides of the conductive base paper used in Example 1.
The coating was applied and dried to obtain four supports. Note that all composition ratios are solid content ratios. Coating liquid d composition SBR latex (Nippon Zeon, Nipol4850)
80 parts Conductive carbon 20 parts Naphthalene sulfonic acid (dispersant) 2 parts Coating liquid composition SBR latex (Nippon Zeon, Nipol4850)
55 parts Acrylic ester copolymer 35 parts Emulsion (Nippon Pure Chemical Industries, Ltd., Dulymer SEK103) Conductive carbon 20 parts Naphthalene sulfonic acid (dispersant) 2 parts Coating liquid f composition SBR latex (Nippon Zeon, Nipol4850)
35 parts Acrylic acid ester copolymer 55 parts Emulsion (Nippon Pure Chemical Industries, Ltd., Dulymer SEK103) Conductive carbon 20 parts Naphthalene sulfonic acid (dispersant) 2 parts Coating liquid g composition Acrylic acid ester copolymer 80 parts Emulsion (Nippon Pure Chemical Industries, Ltd.) Drug Dyurimer SEK103) Conductive carbon 20 parts Naphthalene sulfonic acid (dispersant) 2 parts All of these supports exhibited a volume resistivity of approximately 10 8 Ω·. One side of these supports was subjected to corona discharge treatment under the conditions of 5 KVA sec/cm 2 , and a photoconductive layer of 20 g/m 2 was formed thereon using the same coating solution with a long dispersion time as in Example 1, and electrophotography was performed. Plate-making materials D, E, F, and G were obtained. As in Example 1, the results of performance comparison are shown in Table 2.
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2.0Ã1010以äžã§èå§åæ§ãç»è³ªãšãã«ãããã
é»ååç補çææãåŸãããã[Table] Young's modulus of the pressure relief layer (at 25â-)
An electrophotographic plate material having a particle size of 2.0Ã10 10 or less and excellent in both pressure resistance and image quality was obtained.
Claims (1)
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以äžã§ããããšãç¹åŸŽãšããé»ååç補çææã ïŒ è©²å å°é»å±€ã®è¡šé¢ç²ããå¹³å0.7Ό以äžã§ãã
ããšãç¹åŸŽãšããç¹èš±è«æ±ã®ç¯å²ç¬¬ïŒé èšèŒã®é»
ååç補çææã[Scope of Claims] 1 A photoconductive layer is provided on a support, and the support has a support substrate and at least one surface thereof a photoconductive layer having a Young's modulus of 2Ã10 10 dynes/cm 2 or less at 25°C. It has a pressure relief layer, and the volume resistance of the support is 10 10 Ω.
An electrophotographic material characterized by the following: 2. The electrophotographic plate material according to claim 1, wherein the photoconductive layer has an average surface roughness of 0.7 ÎŒm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12330882A JPS5913244A (en) | 1982-07-15 | 1982-07-15 | Electrophotographic plate making material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12330882A JPS5913244A (en) | 1982-07-15 | 1982-07-15 | Electrophotographic plate making material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5913244A JPS5913244A (en) | 1984-01-24 |
JPH0157910B2 true JPH0157910B2 (en) | 1989-12-07 |
Family
ID=14857320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12330882A Granted JPS5913244A (en) | 1982-07-15 | 1982-07-15 | Electrophotographic plate making material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5913244A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63110186A (en) * | 1986-10-24 | 1988-05-14 | 倧æ¥æ¬å°å·æ ªåŒäŒç€Ÿ | Freshness holding film for vegetable and fruit |
JPH03137904A (en) * | 1989-10-24 | 1991-06-12 | Makino Milling Mach Co Ltd | Adsorption filter |
JP2818693B2 (en) * | 1992-11-18 | 1998-10-30 | ããã¹ãã»ã»ã©ããŒãºã»ã³ãŒãã¬ãŒã·ã§ã³ | Fibrous structure containing immobilized particulate matter and method for producing the same |
-
1982
- 1982-07-15 JP JP12330882A patent/JPS5913244A/en active Granted
Also Published As
Publication number | Publication date |
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JPS5913244A (en) | 1984-01-24 |
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