JPH0156866B2 - - Google Patents

Info

Publication number
JPH0156866B2
JPH0156866B2 JP20866884A JP20866884A JPH0156866B2 JP H0156866 B2 JPH0156866 B2 JP H0156866B2 JP 20866884 A JP20866884 A JP 20866884A JP 20866884 A JP20866884 A JP 20866884A JP H0156866 B2 JPH0156866 B2 JP H0156866B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
shaft
soldering
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP20866884A
Other languages
Japanese (ja)
Other versions
JPS6186068A (en
Inventor
Teruyuki Shibata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20866884A priority Critical patent/JPS6186068A/en
Publication of JPS6186068A publication Critical patent/JPS6186068A/en
Publication of JPH0156866B2 publication Critical patent/JPH0156866B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] この発明はプリント基板把持具保持機構に関
し、プリント基板へ電子部品を挿入した後、半田
槽で半田付けするために、プリント基板を把持す
るための把持具保持機構の改良に関する。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed circuit board gripping mechanism, which is used to grip a printed circuit board in order to solder it in a solder tank after inserting an electronic component into the printed circuit board. This invention relates to an improvement of a gripping tool holding mechanism.

[従来の技術] 従来のプリント基板半田付け装置においては、
プリント基板プリント基板把持具に把持する方法
として、プリント基板の長手方向に把持するのが
一般的であり、希に短手方向に把持していた。そ
して、このいずれかの方法でプリント基板を把持
し、半田槽にてプリント基板の半田付けが行なわ
れていた。
[Prior art] In a conventional printed circuit board soldering device,
As a method of gripping a printed circuit board with a printed circuit board gripping tool, it is common to grip the printed circuit board in the longitudinal direction, and rarely in the lateral direction. Then, the printed circuit board is gripped using one of these methods, and the printed circuit board is soldered in a solder tank.

[発明が解決しようとする問題点] 上述の方法でプリント基板を半田付けする際
に、プリント基板に挿入されている電子部品の挿
入ピツチが最近益々狭くなつてきていることか
ら、半田付け方向によりICのリード線などがシ
ヨートしてしまうことがあつた。つまり、ICの
リード線間をまたがつて溶融半田が付着するとい
う不具合を生じる。
[Problems to be Solved by the Invention] When soldering printed circuit boards using the method described above, the insertion pitch for electronic components inserted into printed circuit boards has recently become narrower and narrower. There were cases where the IC lead wires were shot out. In other words, a problem arises in that molten solder adheres across the lead wires of the IC.

一方、作業者が人手によつて半田付け作業を行
なう場合は、プリント基板上に挿入されたICの
向きを勘案しながら慎重に時間をかけて作業して
いるのが実情であり、プリント基板半田付け作業
の作業性を著しく悪化させていた。
On the other hand, when workers perform soldering work manually, they must carefully take their time while considering the orientation of the IC inserted on the printed circuit board. The workability of the attachment work was significantly deteriorated.

それゆえに、この発明の主たる目的は、上述の
欠点を解消するために、プリント基板半田付け装
置で半田付けを行なつていたときに生じていた半
田付け不良、つまりシヨートを激減し、従来のよ
うな作業者のノウハウに頼らなくてもよく、安全
で高品質のプリント基板の半田付けを効率良く行
なえるようにし、プリント基板半田付け装置とし
てより汎用性の高いものにしたプリント基板把持
具保持機構を提供することである。
Therefore, the main purpose of the present invention is to eliminate the above-mentioned drawbacks by drastically reducing soldering defects, that is, shorts, which occur when soldering is performed using a printed circuit board soldering device, and A printed circuit board grip holding mechanism that enables safe and efficient soldering of high-quality printed circuit boards without relying on the know-how of skilled workers, making it a more versatile printed circuit board soldering device. The goal is to provide the following.

[問題点を解決するための手段] この発明は直線運動する駆動装置の可動端に軸
受を介して取付けられたシヤフトと、このシヤフ
トを支持して揺動運動を与えるT字板と、T字板
の下部両端近くの孔に嵌合されたピンを支点とし
て回動可能に円弧状の長円孔が形成されたカム板
と、シヤフトの先端に取付けられてプリント基板
を把持するためのプリント基板把持具とを備えた
プリント基板半田付け装置において、シヤフトの
軸芯を通り、半田付けするプリント基板の中心を
通る直線上に回動可能なねじを設け、プリント基
板把持具のシヤフトに対する取付センタが直線上
にくるように、シヤフトの先端部分にねじなどで
装着可能なセンタノブを設けるようにしたプリン
ト基板把持具保持機構である。
[Means for Solving the Problems] The present invention includes a shaft attached via a bearing to a movable end of a drive device that moves linearly, a T-shaped plate that supports this shaft and provides a swinging motion, and a T-shaped A cam plate with an arc-shaped oblong hole that can be rotated around pins fitted into holes near both ends of the bottom of the plate, and a printed circuit board that is attached to the tip of the shaft to grip the printed circuit board. In a printed circuit board soldering device equipped with a gripping tool, a screw is provided that can rotate on a straight line passing through the axis of the shaft and passing through the center of the printed circuit board to be soldered, and the mounting center of the printed circuit board gripping tool with respect to the shaft is This is a printed circuit board grip holding mechanism in which a center knob that can be attached to the tip of the shaft with a screw or the like is provided so that it is aligned in a straight line.

[作用] この発明では、プリント基板に挿入された電子
部品のリードの配置を調べ、半田付けにおいてシ
ヨート不良が発生しない半田付け方向を決定し、
センタノブのねじを緩めてプリント基板とシヤフ
トとの間が所定の角度となるようにプリント基板
をプリント基板把持具に取付けて、ねじを固定す
る。
[Operation] In this invention, the arrangement of the leads of the electronic component inserted into the printed circuit board is examined, and the soldering direction is determined so that short defects will not occur during soldering.
Loosen the screw on the center knob, attach the printed circuit board to the printed circuit board gripper so that a predetermined angle is formed between the printed circuit board and the shaft, and fix the screw.

[実施例] 第1図はこの発明の一実施例を示す正面図であ
り、第2図は同じく側面断面図であり、第3図は
同じく半田付け装置の動作とプリント基板の半田
付け過程を示す概略工程図であり、第4図はプリ
ント基板把持具保持機構をシヤフトと直角(90゜)
に取付けた状態を示す平面図であり、第5図はプ
リント基板把持保持具機構をシヤフトとθ(0<
θ<90゜)の状態に取付けた平面図である。
[Embodiment] Fig. 1 is a front view showing an embodiment of the present invention, Fig. 2 is a side sectional view, and Fig. 3 similarly shows the operation of the soldering device and the process of soldering a printed circuit board. FIG. 4 is a schematic process diagram showing the printed circuit board grip holding mechanism at a right angle (90°) to the shaft.
FIG. 5 is a plan view showing the printed circuit board gripping mechanism attached to the shaft and θ(0<
FIG. 3 is a plan view of the device installed in a state where θ<90°).

まず、第1図および第2図を参照して、プリン
ト基板半田付け装置の構成について説明する。プ
リント基板半田付け装置は垂直方向に延びるベー
ス11を含む。このベース11には、ガイド13
によつてガイドされかつシリンダ12によつて上
下方向に移動自在なように断面コの字形のスライ
ドベース14が取付けられる。このスライドベー
ス14の上部片端には、後述のT字板18を扇形
運動させるためのエアシリンダ15が取付けられ
る。このエアシリンダ15のシリンダロツド先端
には、軸受16がねじ結合される。そして、軸受
16には、その一端がシリンダ15と結合するシ
ヤフト17が軸支される。また、シヤフト17に
は、2枚のT字板18,18が所定の間隔を有す
るように取付けられる。このT字板18の下部の
両端近傍には支点用の孔が形成されている。2枚
のT字板18,18の間には、カム板19が挿入
されていて、このカム板19はスライドベース1
4にねじによつて結合される。また、カム板19
には、T字板18の支点用の孔のピツチに合わせ
かつそれぞれの支点用の孔のセンタを中心とし
て、他方の孔のセンタまでの長さを半径とした円
弧状の長孔が形成されている。そして、T字板1
8の下部に形成された1対の孔とカム板19の円
弧状長孔にはそれぞれ支点ピン20,20aが貫
通している。
First, the configuration of a printed circuit board soldering apparatus will be described with reference to FIGS. 1 and 2. The printed circuit board soldering apparatus includes a vertically extending base 11. This base 11 has a guide 13
A slide base 14 having a U-shaped cross section is mounted so as to be guided by the cylinder 12 and movable vertically by the cylinder 12. An air cylinder 15 is attached to one end of the upper portion of the slide base 14 for causing a T-shaped plate 18, which will be described later, to move in a fan shape. A bearing 16 is screwed to the tip of the cylinder rod of the air cylinder 15. A shaft 17 whose one end is connected to the cylinder 15 is supported by the bearing 16 . Furthermore, two T-shaped plates 18, 18 are attached to the shaft 17 with a predetermined interval therebetween. Holes for fulcrums are formed near both ends of the lower portion of this T-shaped plate 18. A cam plate 19 is inserted between the two T-shaped plates 18, 18, and this cam plate 19 is attached to the slide base 1.
4 by screws. In addition, the cam plate 19
A long arc-shaped hole is formed in the T-shaped plate 18 to match the pitch of the fulcrum hole, and whose radius is the length from the center of each fulcrum hole to the center of the other hole. ing. And T-shaped board 1
Support pins 20 and 20a pass through a pair of holes formed in the lower part of the cam plate 8 and an arcuate long hole of the cam plate 19, respectively.

シヤフト17の他端には、ハンガー1がねじな
どによつて固定される。そして、ハンガー1に
は、1本の固定ねじ2によつて、この固定ねじ2
を中心にして回動自在に保持板3が取付けられ
る。この保持板3には、センタノブ4がねじなど
によつて固定される。センタノブ4にはプリント
基板把持具5が取付けられる。すなわち、センタ
ノブ4がプリント基板把持具5の把手部5aの内
径に緩く嵌合し、しかもプリント基板把持具5に
よつて把持されるプリント基板の面の中心と固定
ねじ2のセンタとを貫く直線上に揃うように、プ
リント基板把持具5が取付けられる。また、ハン
ガー3には、プリント基板把持具5を支えるため
の2つの把持具受6,6が設けられ、これらの把
持具受6,6は蝶ボルト7によつてそれぞれの間
隔が調整された後固定される。プリント基板把持
具5にはプリント基板8が取付けられ、このプリ
ント基板8は溶融半田10が溜められた半田槽9
に浸されて半田付けが行なわれる。
The hanger 1 is fixed to the other end of the shaft 17 with a screw or the like. The hanger 1 is attached with one fixing screw 2.
A retaining plate 3 is attached so as to be rotatable around the center. A center knob 4 is fixed to this holding plate 3 with a screw or the like. A printed circuit board gripper 5 is attached to the center knob 4. That is, the center knob 4 loosely fits into the inner diameter of the handle portion 5a of the printed circuit board gripping tool 5, and a straight line passes through the center of the surface of the printed circuit board gripped by the printed circuit board gripping tool 5 and the center of the fixing screw 2. The printed circuit board gripper 5 is attached so as to be aligned on top. Furthermore, the hanger 3 is provided with two gripping tool holders 6, 6 for supporting the printed circuit board gripping tool 5, and the distance between these gripping tool holders 6, 6 is adjusted by butterfly bolts 7. Fixed afterwards. A printed circuit board 8 is attached to the printed circuit board gripper 5, and this printed circuit board 8 is attached to a solder tank 9 in which molten solder 10 is stored.
soldering.

上述のごとく構成されたプリント基板把持具保
持機構を備えたプリント基板半田付け装置を使用
して、プリント基板の半田付け作業を行なうに
は、まずプリント基板8に挿入された電子部品の
リードの配置を調べ、半田付けにおいてシヨート
不良を発生しない半田付け方向を決定する。
In order to solder a printed circuit board using the printed circuit board soldering device equipped with the printed circuit board gripper holding mechanism configured as described above, first, the arrangement of the leads of the electronic components inserted into the printed circuit board 8 is performed. Investigate the soldering direction and determine the soldering direction that will not cause shot defects.

次に、前述の半田付け方向に合わせて、プリン
ト基板把持機構の固定ねじ2を緩めて、保持板3
を回動させ、第5図に示すように、シヤフト17
とプリント基板8との間がθ1の角度を有するよう
に固定ねじ2を締付けて保持板3を固定する。こ
のように設定されたプリント基板把持機構に、プ
リント基板8をプリント基板把持具5に把持さ
せ、保持板3に取付けられているセンタノブ4に
プリント基板把持部5の把手部5aを嵌合させ、
かつ2本の把持具受6で支える。
Next, loosen the fixing screw 2 of the printed circuit board holding mechanism in accordance with the soldering direction mentioned above, and then
As shown in FIG. 5, rotate the shaft 17.
The holding plate 3 is fixed by tightening the fixing screw 2 so that there is an angle of θ 1 between the holding plate 3 and the printed circuit board 8. In the printed circuit board gripping mechanism set in this way, the printed circuit board 8 is gripped by the printed circuit board gripping tool 5, and the handle portion 5a of the printed circuit board gripping portion 5 is fitted into the center knob 4 attached to the holding plate 3.
And it is supported by two gripping tool receivers 6.

この準備段階から半田付けの本作業に移行す
る。以下、第3図を中心に半田付け作業の過程に
ついて説明する。第3図aは半田付け装置の待機
位置を示すものであり、第3図bは半田付けの始
動時期を示している。作業者が半田付け装置の起
動スイツチ(図示せず)を投入することにより、
エアシリンダ12に通電され、シリンダロツドが
延びる。それに伴なつて、スライドベース14が
下降し、スライドベース14に装着されている一
連の機構部品とともにプリント基板8も下降す
る。そして、プリント基板8の左端が半田槽9内
の溶融半田10の表面に浸される。
From this preparatory stage, we move on to the main soldering work. The process of soldering work will be explained below with reference to FIG. FIG. 3a shows the standby position of the soldering device, and FIG. 3b shows the timing of starting soldering. When the operator turns on the start switch (not shown) of the soldering equipment,
Air cylinder 12 is energized and the cylinder rod extends. Along with this, the slide base 14 is lowered, and the printed circuit board 8 is also lowered together with a series of mechanical parts mounted on the slide base 14. Then, the left end of the printed circuit board 8 is immersed in the surface of the molten solder 10 in the solder bath 9.

次に、エアシリンダ15のシリンダロツドが
除々に延び、シリンダロツドの先端にねじ止めさ
れている軸受16を介してシヤフト17が右方向
に押されることになる。このとき、シヤフト17
に固定されているT字板18は、2本の支点ピン
20,20aにより、カム板19と回動自在に取
付けられているので、シヤフト17は支点ピン2
0を支点として、支点ピン20とシヤフト17の
両方のセンタを結ぶ直線を半径とした円弧を描き
ながら右方向へ移動する。
Next, the cylinder rod of the air cylinder 15 is gradually extended, and the shaft 17 is pushed to the right via the bearing 16 screwed to the tip of the cylinder rod. At this time, shaft 17
The T-shaped plate 18 fixed to the cam plate 19 is rotatably attached to the cam plate 19 by two fulcrum pins 20, 20a, so the shaft 17
0 as a fulcrum, it moves to the right while drawing an arc whose radius is a straight line connecting the centers of both the fulcrum pin 20 and the shaft 17.

したがつて、シヤフト17に固定されているハ
ンガー1は、シヤフト17のセンタを中心にして
揺動しながら右方向へ移動する。その結果、ハン
ガー1に角度θ1を有して固定ねじ2により取付け
られている保持板3と、センタノブ4と把持具受
6とによつて支えられているプリント基板把持具
5と、それに把持されているプリント基板8は支
点ピン20と同一平面上に把持されているので、
その左端を支点として溶融半田10の表面と同一
平面もしくは平行になる位置関係のとき、プリン
ト基板8はその下面が全面溶融半田10の表面に
浸されることになる。つまり、第3図cに示す状
態になる。
Therefore, the hanger 1 fixed to the shaft 17 moves to the right while swinging about the center of the shaft 17. As a result, a holding plate 3 is attached to the hanger 1 with an angle θ 1 by a fixing screw 2, a printed circuit board gripper 5 supported by a center knob 4 and a gripper receiver 6, and a Since the printed circuit board 8 is held on the same plane as the fulcrum pin 20,
When the printed circuit board 8 is positioned flush with or parallel to the surface of the molten solder 10 with its left end as a fulcrum, the entire lower surface of the printed circuit board 8 is immersed in the surface of the molten solder 10 . In other words, the state shown in FIG. 3c is reached.

さらに、エアシリンダ15ののシリンダロツド
が延びるに従つて、第3図cに示す状態を境にし
て、支点ピン20を支点として円弧運動をしてい
たシヤフト17は、支点ピン20aを支点として
円弧運動を始める。その結果、第3図dに示す状
態となり、プリント基板8が半田付けされたこと
になる。
Furthermore, as the cylinder rod of the air cylinder 15 extends, the shaft 17, which had been moving in an arc with the fulcrum pin 20 as a fulcrum, will now move in an arc with the fulcrum pin 20a as a fulcrum, starting from the state shown in FIG. 3c. Start. As a result, the state shown in FIG. 3d is reached, and the printed circuit board 8 is soldered.

次に、エアシリンダ12が吸引すると、スライ
ドベース14が上昇する。一方、エアシリンダ1
5がやや遅れて吸引し、その結果シヤフト17は
左端に移動して、第3図aに示す状態に戻つて、
プリント基板8の半田付けが完了する。
Next, when the air cylinder 12 suctions, the slide base 14 rises. On the other hand, air cylinder 1
5 is suctioned with a slight delay, and as a result, the shaft 17 moves to the left end and returns to the state shown in FIG. 3a.
Soldering of the printed circuit board 8 is completed.

すなわち、従来であればプリント基板8の半田
付け方向を一方向、もしくは把持方向90゜変えて
2方向しか備えていなかつたプリント基板半田付
け装置に、プリント基板8の電子部品の配列によ
る半田付け特性を合わせて、プリント基板8の半
田付け方向を自由自在に変えることができるこの
発明のプリント基板把持具保持機構を装着するこ
とにより、電子部品のリード間のシヨートによる
不良が非常に少ない半田付け作業を行なわせるこ
とができる。
In other words, the printed circuit board soldering device, which conventionally had only one direction for soldering the printed circuit board 8 or two directions by changing the gripping direction by 90 degrees, now has soldering characteristics based on the arrangement of the electronic components of the printed circuit board 8. By installing the printed circuit board gripper holding mechanism of the present invention, which can freely change the soldering direction of the printed circuit board 8, soldering work can be performed with very few defects caused by shorts between the leads of electronic components. can be made to do so.

また、従来であれば、半田付け作業の後工程に
必要とされていた修正作業工程の工数を大幅に削
減することができ、いかなるプリント基板8の半
田付け作業も効率良く行なうことができる。
Moreover, the number of man-hours for correction work, which was conventionally required as a post-soldering process, can be significantly reduced, and the soldering work for any printed circuit board 8 can be performed efficiently.

なお、固定ねじ2は位置決めピンとして、ハン
ガー1と保持板3の接触面のいずれかをマグネツ
トにする方式でもよく、センタノブ4と保持板3
とを一体的に構成してもよい。
The fixing screw 2 may be used as a positioning pin by using a magnet on either of the contact surfaces of the hanger 1 and the retaining plate 3, and the center knob 4 and the retaining plate 3 may be magnetized.
may be configured integrally.

[発明の効果] 以上のように、この発明によれば、シヤフトの
軸芯を通り、半田付けするプリント基板の中心を
通る直線上に回動可能なねじを設け、プリント基
板把持具のシヤフトに対する取付センタが直線上
にくるようにシヤフトの先端部分にねじなどで装
着可能なセンタノブを設けてプリント基板把持具
の保持方向を任意に変えるようにしたので、半田
付けされたプリント基板の品質を均一化すること
ができ、作業者のノウハウに頼ることなく、プリ
ント基板に挿入された電子部品のリードの並びに
対応した半田付け作業が効率良くできる。さら
に、後工程の修正作業工数を大幅に減少すること
ができる。したがつて、プリント基板半田付け装
置による半田付けにおいて、シヨートなどの不良
を低減することができ、プリント基板の半田付け
を高品質でしかも効率良く行なわせることができ
る。
[Effects of the Invention] As described above, according to the present invention, a screw is provided that can rotate on a straight line passing through the axis of the shaft and the center of the printed circuit board to be soldered, and A center knob that can be attached to the tip of the shaft with a screw etc. is provided so that the mounting center is on a straight line, and the holding direction of the printed circuit board gripping tool can be changed arbitrarily, ensuring uniform quality of soldered printed circuit boards. This allows for efficient soldering work that corresponds to the arrangement of the leads of electronic components inserted into a printed circuit board, without relying on the know-how of the operator. Furthermore, the number of man-hours required for post-process correction work can be significantly reduced. Therefore, defects such as shorts can be reduced in soldering by the printed circuit board soldering device, and printed circuit boards can be soldered with high quality and efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例をプリント基板半
田付け装置に装着した状態を示す正面図である。
第2図は同じく側面断面図である。第3図は半田
付け装置の動作とプリント基板の半田付け過程を
示す概略工程図である。第4図はこの発明の一実
施例を半田付け装置のシヤフトと直角(90゜)に
取付けた状態を示す平面図である。第5図は同じ
く角度θに取付けた状態を示す平面図である。 図において、1はハンガー、2は固定ねじ、3
は保持板、4はセンタノブ、5はプリント基板把
持具、6は把持具受、7は蝶ボルト、8はプリン
ト基板、9は半田槽、10は溶融半田、11はベ
ース、12,15はエアシリンダ、13はガイ
ド、14はスライドベース、16は軸受、17は
シヤフト、18はT字板、19はカム板、20は
支点ピンを示す。
FIG. 1 is a front view showing an embodiment of the present invention mounted on a printed circuit board soldering device.
FIG. 2 is also a side sectional view. FIG. 3 is a schematic process diagram showing the operation of the soldering device and the process of soldering a printed circuit board. FIG. 4 is a plan view showing an embodiment of the present invention mounted at right angles (90 degrees) to the shaft of a soldering device. FIG. 5 is a plan view showing the state in which it is attached at an angle θ. In the figure, 1 is a hanger, 2 is a fixing screw, and 3 is a hanger.
is a holding plate, 4 is a center knob, 5 is a printed circuit board gripping tool, 6 is a gripping tool holder, 7 is a butterfly bolt, 8 is a printed circuit board, 9 is a solder tank, 10 is molten solder, 11 is a base, 12 and 15 are air 13 is a guide, 14 is a slide base, 16 is a bearing, 17 is a shaft, 18 is a T-shaped plate, 19 is a cam plate, and 20 is a fulcrum pin.

Claims (1)

【特許請求の範囲】 1 直線運動する駆動装置の可動端に軸受を介し
て取付けられたシヤフトと、前記シヤフトを支持
しかつ該シヤフトに揺動運動を与えるT字板と、
前記T字板の下部両端近くの孔に嵌合されたピン
をそれぞれ支点として回動可能に円弧状の長円孔
が形成されたカム板と、前記シヤフトの先端に取
付けられてプリント基板を把持するためのプリン
ト基板把持具とを備えたプリント基板半田付け装
置において、 前記シヤフトの軸芯を通り、半田付けするプリ
ント基板の中心を通る直線上に回動可能なねじを
設け、前記プリント基板把持具の前記シヤフトに
対する取付センタが前記直線上にくるように前記
シヤフトの先端部分にねじなどで装着可能なセン
タノブを設けるようにしたことを特徴とする、プ
リント基板把持具保持機構。
[Scope of Claims] 1. A shaft attached via a bearing to a movable end of a drive device that moves linearly; a T-shaped plate that supports the shaft and provides a swinging motion to the shaft;
A cam plate in which an arc-shaped oblong hole is formed so as to be rotatable about pins fitted in holes near both ends of the lower part of the T-shaped plate as a fulcrum, and a cam plate attached to the tip of the shaft to grip a printed circuit board. In the printed circuit board soldering apparatus, the printed circuit board gripping tool is provided with a screw rotatable on a straight line passing through the axis of the shaft and passing through the center of the printed circuit board to be soldered; A printed circuit board holding tool holding mechanism, characterized in that a center knob that can be attached to the tip of the shaft with a screw or the like is provided so that the center of attachment of the tool to the shaft is on the straight line.
JP20866884A 1984-10-04 1984-10-04 Mechanism for gripping and holding printed circuit board Granted JPS6186068A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20866884A JPS6186068A (en) 1984-10-04 1984-10-04 Mechanism for gripping and holding printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20866884A JPS6186068A (en) 1984-10-04 1984-10-04 Mechanism for gripping and holding printed circuit board

Publications (2)

Publication Number Publication Date
JPS6186068A JPS6186068A (en) 1986-05-01
JPH0156866B2 true JPH0156866B2 (en) 1989-12-01

Family

ID=16560072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20866884A Granted JPS6186068A (en) 1984-10-04 1984-10-04 Mechanism for gripping and holding printed circuit board

Country Status (1)

Country Link
JP (1) JPS6186068A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103200781B (en) * 2013-04-16 2015-12-09 中国电子科技集团公司第二十研究所 A kind of print welding paste device of SMD device
CN106385773B (en) * 2016-10-27 2023-06-23 江门市众能电控科技有限公司 Automatic tin dipping equipment and method for circuit board

Also Published As

Publication number Publication date
JPS6186068A (en) 1986-05-01

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