KR101184649B1

KR101184649B1 - Coil bobin terminal dipping device for ultra sonic soldering apparatus

Info

Publication number: KR101184649B1
Application number: KR1020100026562A
Authority: KR
Inventors: 김방희
Original assignee: 김방희
Priority date: 2010-03-25
Filing date: 2010-03-25
Publication date: 2012-09-20
Also published as: KR20110107459A

Abstract

The present invention relates to an ultrasonic soldering apparatus in which a jig supporting means is provided so that a jig is simply mounted on a rotating means rotated in one direction in using a jig supported by a plurality of bobbins in an ultrasonic soldering apparatus. A jig gripping portion 20; A first shaft feeder 30; A second shaft feeder 40; A third shaft transfer part 50; In the ultrasonic bobbin of the coil bobbin consisting of the ultrasonic dipping unit 60, the upper surface 71, the coupling groove 75 formed on the lower surface, the holding portion 74 formed on both sides, and the front of the holding portion 74 A jig 70 including a mounting portion 73 extending from the hooking portion 732 and the locking groove 731, and a plurality of protruding pins 72 formed at a front end portion between the mounting portion 73; And a distance between the first servo motor 12, the central rotary shaft 11 connected on the drive shaft of the motor, the bearing portion 17 rotatably supporting the rotary shaft 11 on both sides, and the rotary shaft 11; It consists of a vertical surface portion 13 which is installed vertically with the horizontal surface portion 14, which is installed in the rotational direction between the vertical surface portion 13, the horizontal surface portion 14, each forming a insertion hole into which the dipping jig 70 is inserted. A coil bobbin terminal dipping apparatus of an ultrasonic soldering apparatus including a rotating portion 10 which is step-rotated by the rotational force of the first servo motor 12, wherein the jig is rotated in one direction by simultaneously soldering a jig in which a plurality of coil bobbins are supported. Provides a dipping structure of the soldering device in which a jig support means is provided so that the clamp is simply mounted.

Description

Coil bobin terminal dipping device for ultra sonic soldering apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for soldering a terminal. In particular, a coil of an ultrasonic soldering apparatus capable of soldering without flux of various coil bobbins, such as a bobbin in which a coil is wound on a bobbin or a coil bobbin in which a cylindrical body is formed only of a coil without a bobbin. It relates to a bobbin terminal dipping device.

Conventionally, the soldering method of the coil is artificially soldered to the coil by using a soldering iron, so the soldering part is not uniform, and the appearance is not faint. Also, manual soldering of the bobbin made of small parts lengthens working time. Caused it. In addition, the coil wound around the small components must be made with sophisticated soldering, which is caused by inaccurate soldering, which causes a decrease in productivity.

In this regard, it is known that the registration utility model 20-0284890 has automated the soldering operation in consideration of this. However, even in this case, the working environment has been improved because of working by mechanical operation, but poor work is done by intricate soldering, and soldering two places on one bobbin. It was impossible to achieve this, and the structure was complicated.

On the other hand, in recent years, a soldering apparatus using supersonic waves has been known as shown in the accompanying drawings, Fig. 1A. It consists of a tool horn which abuts against a base material (lamp tube), and transmits a vibration, and a lead tank which stores a solder, and the example which variously modified from this is well known. For example, Japanese Unexamined Patent Application Publication No. 5-9757 has a pot connected to an ultrasonic vibrator and has a pot for accepting a brazing filler material on the outer periphery of the tip core that transmits ultrasonic vibration in the axial direction, and the tip portion of the tip core is provided. In a soldering apparatus in which a brazing material is classified by ultrasonic vibration from a contact surface of a color and a tip core placed, the color is placed on the tip core so that the tip surface of the tip core is directly exposed to the outside, and the exposed tip is exposed. Disclosed is an ultrasonic soldering apparatus which uses a classifying braze from a surface and gives ultrasonic vibration to an external soldering portion. This ultrasonic soldering device increases the flowability of solder (lead material), facilitates maintenance, and enhances the effect of cavitation.

On the other hand, as a method of soldering an electrical component, a method of ironing each soldering object directly or dipping the electrical component into molten lead (to a depth up to a portion where soldering is used) is used. Among them, the method of dipping in the molten lead is widely used due to the advantage of easy mass production. To this end, a number of molten lead dipping devices have been devised and used. However, the previously developed molten lead dipping device is still difficult to achieve automation of the process because of high dependency on manual work. In particular, when the object (to be dipped and soldered) is a relatively flexible material such as an electric wire, the manual dependence is higher.

For example, in order to dip a coil bobbin as shown in FIG. 1B into a molten bath in which molten lead is stored, a process of grasping and moving one side of the coil bobbin is inevitably performed in this process. Or manually transported, the technical limitations of such conventional devices could not guarantee the continuity of the work and also resulted in the negative consequences of impairing the feasibility of the automation of the process.

Ultrasonic soldering allows many components to be soldered without flux. However, if the bobbin wound on the bobbin is dipped in a solder bath as a soldering device before such work is performed, the precision is poor, and the winding coil outside the terminal Lead was applied to bobbins, resulting in bobbin defects.

In particular, there has been a demand for an improved soldering operation for the coil bobbin which has already been wound or the terminal of the bobbin wound on the bobbin, which is more automated, stable, and reduces the defective rate.

Therefore, the problem that the conventional soldering device of various base materials, that is, foreign matter is introduced into the bending phenomenon of the dipping using the flux (FLUX), the height of the lead during dipping does not have a constant height of lead lead to the coil burnt coil This phenomenon, foreign matters caused by the flux, dipping height is not controlled to cause a broken wire due to the lead going to the coil, and the long time to soak in the lead bath, pin missing and deformation of the bobbin is improved. It has been needed.

The present invention has a problem with the conventional soldering apparatus of various base materials, that is, foreign matter is introduced into the bending phenomenon of dipping (DUXING) using the flux (FLUX), the lead height is not constant at the time of dipping, lead is carried over to the coil By improving the tendency of coil disconnection, it is possible to completely block foreign substances caused by flux and adjust the dipping height by not using flux, so it is possible to control the lead to the coil to improve the disconnection defect and to soak in the bath This short aims to improve the pin dropout and the deformation of the bobbin.

An object of the present invention is to improve the problems caused by the method of contacting the molten lead surface of the lead bath by holding each of the wound bobbin tongs when soldering the terminal of the conventional wound bobbin.

The present invention aims to improve these problems and to provide a jig for simultaneously supporting a plurality of wound coils and bobbins.

An object of the present invention is to provide a jig rotation means in which a jig support means is provided so that the jig is simply mounted on a rotation means rotated in one direction in using a jig supported by a plurality of bobbins in an ultrasonic soldering apparatus.

Coil bobbin terminal dipping apparatus of the present invention ultrasonic soldering apparatus for achieving the above object,

A dipping jig for supporting the coil bobbin; A first servo motor, a central rotational shaft connected to the drive shaft of the motor, a bearing portion rotatably supporting the rotational shaft on both sides, a vertical surface portion vertically installed on both sides of the rotational shaft, and installed between the vertical surface portion, A rotating portion formed of a horizontal surface portion forming an insertion hole into which the dipping jig is inserted; A vertical plate portion, an adsorption member installed on the inner central portion of the vertical plate portion so as to be movable up and down, a pneumatic cylinder for controlling the suction member, guide bars, and an insertion groove in the lower left and right bottoms of the vertical plate portion. A jig gripping portion which forms a mounting portion having a fork shape so as to support both gripping portions of the dipping jig, one end of which is inserted into the rotating portion, into the insertion groove of the mounting portion and the adsorption member adsorbs the jig; Two rows of slide bars and a screw bar are formed on each of the base surfaces of the plate, and the first slider 33 is formed so as to be slid through the slide bar and the screw bar. It is connected, the screw bar is connected to the second servo motor above the first axis transfer portion for up and down the holding part as a predetermined electrical control; A coil bobbin terminal dipping device of an ultrasonic soldering device comprising an ultrasonic vibrator, a booster and a lead bath, and an ultrasonic dipping unit for soldering by ultrasonic vibration only to a terminal of a coil bobbin when a jig adsorbed and held at a gripping portion reaches a predetermined position. Is achieved.

The rotating part of the coil bobbin terminal dipping apparatus of the present invention ultrasonic soldering apparatus for achieving the above object,

A coil bobbin is formed between the main body, a bullet insertion slot coupled to the main body, and a bullet insertion section elastically coupled with an elastic member and a plunger so as to be compressed and released from the coupling groove of the jig with a pressure pressure between the bullet insertion insert and the main body. It is a coil bobbin terminal dipping apparatus of an ultrasonic soldering apparatus having the feature that these multiple supported jigs are impacted and released.

The second slide bar and the second slider bar is formed by the second slider, which is connected to the upper and high feed parts, the second screw bar is connected to the coaxial pulley, and the pulley is driven by the third servo motor and belt. It is preferable to further include a second axis feeder for forward and backward conveying so that the jig holding unit equipped with the jig is moved forward and backward in the second axis direction.

The jig of the coil bobbin terminal dipping apparatus of the present invention ultrasonic soldering apparatus for achieving the above object,

The coupling grooves formed on the upper and lower surfaces, the holding portions formed on both sides, the mounting portion extending forward from the holding portion to form a locking jaw and the locking groove, and a plurality of protruding pins formed at the front end portion between the mounting portions Do.

The present invention improves the deflection phenomenon of the dipping (DIPPING) using the flux (FLUX) of the conventional soldering device, improves the point that the height of the lead is not constant during dipping, do not use the flux, the dipping height can be adjusted, disconnection defect Improved, short time to soak in the tank, and improved deformation of the bobbin.

The present invention has been improved by a method of holding a wound bobbin with a forceps and contacting the molten lead surface of a solder bath to provide a dipping structure of a soldering apparatus capable of simultaneously dipping a plurality of wound coil bobbins.

The present invention provides a dipping structure of a soldering apparatus in which a jig supporting means is provided so that the jig is simply mounted on a rotating means rotated in one direction in simultaneously soldering a jig supported by multiple bobbins in an ultrasonic soldering apparatus.

Figure 1a is a schematic diagram showing an example of a conventional ultrasonic soldering device, Figure 1b shows an example of a coil bobbin,
2 is a view showing a jig applied to the improved ultrasonic soldering apparatus of the present invention,
3 is a view schematically illustrating a dipping process of the improved ultrasonic soldering apparatus of the present invention;
4a to 4c are views showing the plane, side, front of the improved ultrasonic soldering apparatus of the present invention,
5a and 5b are views for explaining the bonding process of the jig in the improved ultrasonic soldering apparatus of the present invention,
6a to 6c are views illustrating the dipping process of the coil bobbin in the improved ultrasonic soldering apparatus of the present invention.
7A and 7B are schematic views illustrating a process of transferring and dipping coil bobbins in the ultrasonic soldering apparatus of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Figure 1b of the accompanying drawings shows an example of a coil bobbin known or conventionally known through the present invention, Figure 2 is a view showing an example of a jig to be applied to the ultrasonic dipping method of the coil bobbin of the present invention, Figure 3 is an improved ultrasound of the present invention 4A to 4C are schematic views illustrating a planar, side, and front surfaces of an ultrasonic soldering apparatus according to the present invention.

The improved ultrasonic soldering apparatus of the present invention according to the drawings is largely the rotating part 10, the jig holding part 20, the first axis transfer portion 30, the second axis transfer portion 40, the third It consists of an axis transfer part 50 and the ultrasonic solder part 60.

In particular, the rotating part 10 and the jig 70 applied thereto, the rotating part 10,

The distance between the first servo motor 12, the central rotary shaft 11 connected on the drive shaft of the motor, the bearing portion 17 rotatably supporting the rotary shaft 11 on both sides, and the rotary shaft 11 The horizontal surface portion 14 is provided between the vertical surface portion 13 which is vertically installed and the vertical surface portion 13 along the rotational direction, and each of which forms an insertion hole 15 into which the dipping jig 70 is inserted. Is made of.

At this time, the bullet insertion portion 16 is formed in a right angle to correspond to the insertion groove (15).

The bullet insert 16 has a main pressure 162 between the main body 162, the bullet insertion guide 161 coupled to the main body 162, and the bullet insertion guide 161 and the main body 162. 70 is elastically coupled to the elastic member 163 and the plunger 164 to be crimped, released in the coupling groove (75).

The jig 70 has an upper surface 71, a coupling groove 75 formed on the lower surface thereof, a gripping portion 74 formed on both sides thereof, and extending from the gripping portion 74 to the front to be engaged with the locking jaw 732. It consists of a mounting portion 73 formed with a groove 731, and a plurality of protruding pins 72 formed in the front end portion between the mounting portion 73.

The jig gripping portion 20,

A vertical plate portion 22, an adsorption member 23 provided at an inner central portion of the vertical plate portion 22 so as to be movable up and down, a pneumatic cylinder 24 controlling the adsorption member 23, and a guide bar ( 25 and a jig having one end inserted into the rotating part 10 by forming a mounting part 21 having a fork shape having an insertion groove 21a formed at the bottom left and right bottoms of the vertical plate part 22. Both ends of the holding portion 74 of the 70 is put into the insertion groove 21a of the mounting portion 21 to be supported.

The first shaft transfer unit 30,

Two rows of slide bars 35 and screw bars 34 are formed between the base plates 31, and the slide bar 35 and the screw bars 34 are slidably movable in the first direction. A slider 33 is formed, and the first slider 33 is connected to the vertical plate part 22 of the jig holding part 20, and the screw bar 34 is connected to the second servo motor 32 thereon. As a result of the predetermined electrical control, the jig holding part 20 is moved up and down.

The second shaft transfer part 40 forms a second slider 43 which is moved by the second slide bar 45 and the second screw bar 44, and is connected to the upper and high transfer parts 30. The two screw bars 44 are connected to the coaxial pulley 46, and the pulley 46 is electrically driven as the third servo motor 42 and the belt 47 so as to be moved forward and backward.

The third shaft transfer part 50 is provided so that the conveyor belt 51 can be circulated between the bearing parts 53 at both ends, and the first bearing 52 at the end thereof is driven by the driving pulley of the third servo motor 52. From the second belt (57) by installing the rotatable pulley (56) to be carried out through the conveyor belt 51, the jig completed to be pulled out.

The ultrasonic dipping unit 60 is composed of an ultrasonic vibrator 61, a booster 62, and a lead bath 63. The ultrasonic dipping unit 60 is soldered by ultrasonic vibration to the coil bobbin of the jig 70 held by the jig holding unit 20. You lose.

5A and 5B are views illustrating a bonding process of a jig in the improved ultrasonic soldering apparatus of the present invention, and FIGS. 6A to 6C illustrate a dipping process of a coil bobbin in the improved ultrasonic soldering apparatus of the present invention. 7A and 7B are schematic views illustrating a process of transferring and dipping coil bobbins in the ultrasonic soldering apparatus of the present invention.

Jig transfer and dipping of the improved ultrasonic soldering apparatus of the present invention according to the drawings are as follows.

First, a plurality of coil bobbins 80 wound by coils are manually inserted into the protruding pins 72 of the jig 70 through separate equipment. In this case, the coil bobbin includes various forms.

The jig 70 into which the plurality of coil bobbins 80 are inserted is inserted into the insertion groove 15 of the rotating part 10 to be impressed.

As illustrated in FIGS. 5A and 5B, the jig 70 is attached to the main body 162 and the impacting portion 16 to which the bullet insertion slot 161 coupled to the main body 162 is coupled. That is, a pair of elastic insertion member 163 and a pair of plungers 164 are elastically coupled between the elastic insertion member 161 and the main body 162 so as to be secured to the coupling groove 75 of the jig 70. Therefore, the bullet insert 16 is opened at a right angle to the horizontal plane 14 to be coupled to each other, and communicates with the insertion groove 15 so that the moment when the jig 70 is inserted, the bullet insert 16 of the bullet insert 16 is inserted. Is inserted into the coupling groove 75 is elastically supported to prevent the departure of the jig (70).

Thereafter, as shown in FIGS. 6A to 6C, the rotary part 10 is rotated so that the jig 70 is positioned at a horizontal position in a right angle direction, and then the grip part 74 of the jig 70 is jig jig part 20. ) Mounting portion 21 is advanced to be inserted into the insertion groove (21a).

At this time, the third servo motor 42 of the second shaft feeder 40 is driven to advance the second slider 43 integrally connected to the jig gripper 20 so that both grip parts 74 of the jig 70 are moved. ). Then, the suction member 23 sucks and holds the upper surface 71 of the jig 70 by driving the pneumatic cylinder 24. As described above, the second servo motor 32 of the first shaft transfer unit 30 is driven while the jig 70 is adsorbed and held to lower the jig grip unit 20 by a predetermined electrical control so as to lower the jig 70. The terminal 82 of the front bobbin 80 comes into contact with the lead surface of the ultrasonic brazing tank 63. Of course, the lead surface of the lead tank 63 is scratched during this time to remove impurities from the lead surface. (Structure and operation of the scratching are omitted.)

The dipping depth of the terminal 82 of the bobbin 80 to be dipped achieves the desired ultrasonic soldering with precise control of the second servo motor 32.

Thereafter, the jig 70 is moved upward by the lifting operation of the first shaft transfer part 30, and then the jig 70 is placed on the conveyor belt 51. The jig 70 placed on the conveyor belt 51 is pulled forward by the operation of the third shaft transfer part 50 and waits for the worker to separate the soldered bobbin 80.

As such, the present invention improves the problem that the conventional soldering device has a soldering device by hanging a plurality of bobbin suspending devices of the soldering device through the forceps to solder one coil bobbin one by one, and improving the problem of the soldering device. It is to provide an automated dipping device that improves the problems of bobbin breakage during gripping.

10: rotating part, 11; rotating shaft, 12; first servo motor, 13; vertical surface part, 14; horizontal surface part,
20; jig gripping portion, 21; mounting portion, 22: vertical plate portion, 23; adsorption member, 24; pneumatic cylinder,
25; guide bar, 30; 1st axis feed part, 31: expectation, 32: 2nd servo motor, 33: 1st slider,
34: screw bar, 35; slide bar, 40; second axis feed portion, 42: second servo motor,
43: second slider, 44: second screw bar, 45: second slide bar, 46: pulley, 47: belt,
50; 3rd axis feed part, 51: conveyor belt, 52: 3rd servo motor, 53: bearing part,
56: pulley, 57: second belt, 60; ultrasonic dipping portion, 61; ultrasonic oscillator, 62: booster,
63: solder tank, 70; jig, 71: upper surface, 72: protrusion pin, 73: mounting portion, 731: locking groove,
732: engaging jaw, 74: gripping portion, 75: coupling groove,

Claims

In the ultrasonic soldering apparatus,
Dipping jig 70, the coil bobbin is supported;
The first servo motor 12, a central rotary shaft 11 connected on the drive shaft of the motor, bearing portions 17 rotatably supporting the rotary shaft 11 on both sides, and both sides of the rotary shaft 11; A rotating part 10 provided between a vertical surface part 13 to be vertically installed and a horizontal surface part 14 provided between the vertical surface part 13 and an insertion hole 15 into which the dipping jig 70 is inserted;
A vertical plate portion 22, an adsorption member 23 provided at an inner central portion of the vertical plate portion 22 so as to be movable up and down, a pneumatic cylinder 24 controlling the adsorption member 23, and a guide bar ( 25 and a jig having one end inserted into the rotating part 10 by forming a mounting part 21 having a fork shape having an insertion groove 21a formed at the bottom left and right bottoms of the vertical plate part 22. A jig gripping portion 20 through which both end gripping portions 74 of the 70 are inserted into and supported by the insertion groove 21a of the mounting portion 21, and the adsorption member 23 sucks the jig 70;
Two rows of slide bars 35 and screw bars 34 are formed between the base plates 31, and the slide bar 35 and the screw bars 34 are slidably movable in the first direction. A slider 33 is formed, and the first slider 33 is connected to the vertical plate part 22 of the jig holding part 20, and the screw bar 34 is connected to the second servo motor 32 thereon. A first axis transfer part 30 configured to move the jig grip part 20 up and down as a predetermined electrical control;
It consists of an ultrasonic vibrator 61, a booster 62 and a lead bath 63, and when the jig 70 adsorbed and held by the jig holding unit 20 reaches a predetermined position, the solder is made by ultrasonic vibration only to the terminals of the coil bobbin. Coil bobbin terminal dipping apparatus of the ultrasonic soldering apparatus comprising an ultrasonic dipping unit 60.

The method of claim 1,
The rotating unit 10,
The main body 162, the bullet insertion slot 161 coupled to the main body 162, and the coupling groove 75 of the jig 70 at a shot pressure between the bullet insertion slot 161 and the main body 162. ) By forming an elastic insert 161 and a plunger coupled to the elastic member 163 and the plunger 164 to be crimped and released, so that the jig 70 having a plurality of coil bobbins 80 supported is crushed and released. Coil bobbin terminal dipping device of ultrasonic soldering device.

The method of claim 1,
The second slide bar 45 and the second slider bar 44 formed by the second screw bar 44 are formed, and are connected to the first axis transfer part 30, and the second screw bar 44 is coaxial. It is connected to the pulley 46, the pulley 46 further comprises a second servo motor 42 and the second shaft transfer portion 40 to be forwarded and reversed conveyed by the belt 47 jig 70 Coil bobbin terminal dipping device of the ultrasonic soldering device, characterized in that the jig jig holding part 20 is mounted forward and backward in the second axial direction.

The method according to any one of claims 1 to 3,
Jig 70,
The upper surface 71, the coupling groove 75 formed on the lower surface, the holding portion 74 formed on both sides, and extending from the holding portion 74 to the front to form the locking jaw 732 and the locking groove 731 Coil bobbin terminal dipping apparatus of the ultrasonic soldering apparatus, characterized in that the mounting portion 73 and a plurality of protruding pins 72 formed on the front end between the mounting portion 73.