JPH0153450B2 - - Google Patents
Info
- Publication number
- JPH0153450B2 JPH0153450B2 JP6493582A JP6493582A JPH0153450B2 JP H0153450 B2 JPH0153450 B2 JP H0153450B2 JP 6493582 A JP6493582 A JP 6493582A JP 6493582 A JP6493582 A JP 6493582A JP H0153450 B2 JPH0153450 B2 JP H0153450B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- water
- diazo
- photosensitive
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 229920002125 Sokalan® Polymers 0.000 claims description 16
- 239000004584 polyacrylic acid Substances 0.000 claims description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 9
- 229920006254 polymer film Polymers 0.000 claims description 6
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 239000000178 monomer Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000003860 storage Methods 0.000 description 9
- 239000007795 chemical reaction product Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- 229920006243 acrylic copolymer Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 5
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- -1 polyacetate Polymers 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- 229920003176 water-insoluble polymer Polymers 0.000 description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- HHQAGBQXOWLTLL-UHFFFAOYSA-N (2-hydroxy-3-phenoxypropyl) prop-2-enoate Chemical compound C=CC(=O)OCC(O)COC1=CC=CC=C1 HHQAGBQXOWLTLL-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 150000008049 diazo compounds Chemical class 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 2
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N thiocyanic acid Chemical compound SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZDWPBMJZDNXTPG-UHFFFAOYSA-N 2h-benzotriazol-4-amine Chemical compound NC1=CC=CC2=C1NN=N2 ZDWPBMJZDNXTPG-UHFFFAOYSA-N 0.000 description 1
- YOQINPWXHSJWDI-UHFFFAOYSA-N 2h-benzotriazole;2-[bis(2-hydroxyethyl)amino]ethanol Chemical compound C1=CC=CC2=NNN=C21.OCCN(CCO)CCO YOQINPWXHSJWDI-UHFFFAOYSA-N 0.000 description 1
- VMWLJSQYCLFVMF-UHFFFAOYSA-N 3-(2-hydroxy-3-methylphenoxy)propyl prop-2-enoate Chemical compound CC1=CC=CC(OCCCOC(=O)C=C)=C1O VMWLJSQYCLFVMF-UHFFFAOYSA-N 0.000 description 1
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 description 1
- QGHDLJAZIIFENW-UHFFFAOYSA-N 4-[1,1,1,3,3,3-hexafluoro-2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical group C1=C(CC=C)C(O)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(O)C(CC=C)=C1 QGHDLJAZIIFENW-UHFFFAOYSA-N 0.000 description 1
- ZRDSGWXWQNSQAN-UHFFFAOYSA-N 6-diazo-n-phenylcyclohexa-2,4-dien-1-amine Chemical compound [N-]=[N+]=C1C=CC=CC1NC1=CC=CC=C1 ZRDSGWXWQNSQAN-UHFFFAOYSA-N 0.000 description 1
- CAHQGWAXKLQREW-UHFFFAOYSA-N Benzal chloride Chemical class ClC(Cl)C1=CC=CC=C1 CAHQGWAXKLQREW-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 206010012442 Dermatitis contact Diseases 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 239000004115 Sodium Silicate Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000005923 long-lasting effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- XZSZONUJSGDIFI-UHFFFAOYSA-N n-(4-hydroxyphenyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NC1=CC=C(O)C=C1 XZSZONUJSGDIFI-UHFFFAOYSA-N 0.000 description 1
- QVEIBLDXZNGPHR-UHFFFAOYSA-N naphthalene-1,4-dione;diazide Chemical compound [N-]=[N+]=[N-].[N-]=[N+]=[N-].C1=CC=C2C(=O)C=CC(=O)C2=C1 QVEIBLDXZNGPHR-UHFFFAOYSA-N 0.000 description 1
- FGHSTPNOXKDLKU-UHFFFAOYSA-N nitric acid;hydrate Chemical compound O.O[N+]([O-])=O FGHSTPNOXKDLKU-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000012266 salt solution Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- FGDMJJQHQDFUCP-UHFFFAOYSA-M sodium;2-propan-2-ylnaphthalene-1-sulfonate Chemical compound [Na+].C1=CC=CC2=C(S([O-])(=O)=O)C(C(C)C)=CC=C21 FGDMJJQHQDFUCP-UHFFFAOYSA-M 0.000 description 1
- PNGLEYLFMHGIQO-UHFFFAOYSA-M sodium;3-(n-ethyl-3-methoxyanilino)-2-hydroxypropane-1-sulfonate;dihydrate Chemical compound O.O.[Na+].[O-]S(=O)(=O)CC(O)CN(CC)C1=CC=CC(OC)=C1 PNGLEYLFMHGIQO-UHFFFAOYSA-M 0.000 description 1
- 150000008054 sulfonate salts Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- OMQSJNWFFJOIMO-UHFFFAOYSA-J zirconium tetrafluoride Chemical compound F[Zr](F)(F)F OMQSJNWFFJOIMO-UHFFFAOYSA-J 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/016—Diazonium salts or compounds
- G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
- G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Description
本発明は、感光性平版印刷版に関するものであ
り、更に詳しくは保存安定性が良く、耐刷性及
び、現像性が改良されたジアゾ系感光性平版印刷
版に関するものである。
感光性平版印刷版(以下、PS版と称す)の感
光層には、一般にジアゾ系感光性組成物が多く使
用されている。ポジ型PS版のジアゾ系感光材に
はナフトキノンジアジト、ネガ型PS版のジアゾ
系感光材には、4−ジアゾジフエニルアミン及
び、4−ジアゾ−3−メトキシジフエニルアミン
とパラホルムアルデヒドとの縮合物(以下、ジア
ゾ樹脂と称す)が主に使用されている。このジア
ゾ樹脂は、高分子化合物と混合することにより、
ラツカー盛りなしでも耐刷力ある平版印刷版を作
ることができ、しかも容易に界面活性剤を含む水
系現像液で現像できるため、ネガ型PS版の感光
材として多量に使用されている。ジアゾ樹脂は、
光架橋反応する相手高分子化合物によつて、次の
ように分類されてネガ型PS版の感光層を形成し
ている。
(1) アルコール性水酸基をもつ水不溶性高分子化
合物と、水不溶性ジアゾ樹脂との組合せ。
アルコール性水酸基ともつ水不溶性高分子化
合物としては、エポキシ樹脂(特開昭47−
1167)、2−ヒドロキシアルキルメタクリレー
ト、アクリロニトリル、メタクリレート及び、
メタクリル酸からなる多元アクリル共重合体、
ポリビニルホルマール樹脂、ポリビニルブチラ
ール樹脂、ポリビニルクロルベンザール樹脂、
2−ヒドロキシ−3−フエノキシプロピルアク
リレート、メチルメタクリレート、ヒドロキシ
プロピルメタクリレート、アクリロニトリル及
びメタクリル酸とからなる多元アクリル共重合
体(特開昭52−7364、特公昭55−34929、特開
昭54−88403、特開昭55−142332)等が知られ
る。
(2) フエノール性水酸基をもつ水不溶性高分子化
合物と、水不溶性ジアゾ樹脂との組合せ。
フエノール性水酸基をもつ高分子化合物とし
ては、フエノール樹脂(特公昭47−1167)、N
(4−ヒドロキシフエニル)メタクリルアミド、
アクリロニトリル、メチルメタクリレート及び
メタクリル酸とからなる多元アクリル共重合体
(特開昭54−98614、特開昭56−107234)等が知
られる。
(3) その他の水不溶性高分子化合物と、水不溶性
ジアゾ樹脂との組合せ。
その他の水不溶性高分子化合物としては、ポ
リアミド、ポリスチレン、ポリエステル、ポリ
アセテート、ポリウレタン、ポリ酢酸ビニル
(特公昭47−1167、特公昭56−9697)、N−ビニ
ルピロリドン、アクリロニトリル、メチルメタ
クリレートからなる多元アクリル共重合体(特
開昭54−27802)、メタクリル酸メチル、アクリ
ロニトリル及びメタクリル酸からなる多元アク
リル共重合体(特開昭56−4144)等が知られて
いる。
前記(2)、(3)に属する組合せは、前記(1)に属する
組合せに比べ、ジアゾ化合物との光架橋密度が低
いため、耐溶剤性が弱く、又、耐溶剤性をもたそ
うとすると、界面活性剤を含む水系現像液による
現像性が悪くなり、良好なネガ型PS版を作るの
には問題が多い。
ネガ型PS版に用いられる水不溶性ジアゾ樹脂
は、ジアゾ樹脂とパラトルエンスルホン酸、ドデ
シルベンゼンスルホン酸、2−メトキシ−4−ヒ
ドロキシベンゾフエノン−5−スルホン酸等の有
機スルホン酸、あるいはその塩との反応生成物、
及びホウフツ化水素酸、チオシアン酸、ヘキサフ
ルオロリン酸等の無機酸、あるいはその塩との反
応生成物等が知られる(特公昭39−17602、特公
昭42−5364、米国特許第4093465号)。
これらのジアゾ系ネガ型PS版の感光性組成物
は、紙やクロム、アルミニウム等の親水化された
支持体に塗布されてPS版を作るが、特に耐刷性
を上げるため陽極酸化されたアルミニウム板に塗
布すると、密着性が良すぎるため、塗布後数ケ月
経過したもの、あるいは高温高湿で保存されたも
のは、像露光現像した場合、未露光部が現像溶出
するが、インキ汚れを生じるという現象がみられ
る。
これらの問題を解決するため、ジアゾ系ネガ型
PS版用感光性組成物に、蓚酸(特公昭57−8460)
や亜燐酸(特開昭54−151023)、又は高分子の有
機酸(特開昭56−107238)等を混入して、経時に
よるネガ型PS版の現像後のインキ汚れをなくす
ことが知られているが、いまだ十分でない。
本発明者らは、上記問題を解決するため鋭意研
究した結果、陽極酸化されたアルミニウム板上
に、膜厚0.5μ以下のポリアクリル酸又はポリメタ
アクリル酸の高分子膜を形成させ、その上に水不
溶性のジアゾ樹脂、及び下記一般式〔〕で示さ
れる構造単位と、20重量%以下の下記一般式
〔〕で示される構造単位を含む酸価10〜100の重
合体からなる感光層を積層させることにより、経
時的安定性がよく、耐刷性及び現像性が改良され
たジアゾ系ネガ型PS版が得られることを見出し
た。
(上記各式中、R1は水素原子又はメチル基を示
し、R2は水素原子又はアルキル基を示し、nは
1〜10の整数を示す。)
本発明に使用される陽極酸化されたアルミニウ
ム板は、アルミニウム板を、ブラシ研磨や電解研
磨によつて砂目立てした後、硫酸、塩酸、リン
酸、硼酸あるいは混酸等の陽極酸化浴中で陽極酸
化され、更にケイ酸塩や、弗化ジルコニウム塩の
水溶液で封孔処理される。
本発明に使用されるポリアクリル酸又はポリメ
タクリル酸は、平均分子量が5000〜30000のもの
が好ましく、よく水に溶け、溶剤にほとんど溶け
ない。
特開昭56−107238によると、ジアゾ系ネガ型感
光性組成物の樹脂に対し、ポリアクリル酸を1〜
5重量%混入すると、PS版の保存安定性がよく
なることが記載されているが、ポリアクリル酸は
感光液を構成するメチルセロソルブ等の溶剤にほ
とんど不溶であるため、感光液の製造時の過工
程でポリアクリル酸が除去される。そのためPS
版の保存安定性にバラツキが生ずる。又、水不溶
性ジアゾ樹脂は、感光液の粘度が高い程分解しに
くい。そこでロールコーターを用いて感光液をア
ルミニウム板に枚葉塗布する場合、水不溶性ジア
ゾ樹脂の分解を考えて、感光液の樹脂濃度を10〜
15%以上に調整するのが品質安定なPS版を製造
するのに必要であり、それに応じてポリアクリル
酸を添加溶解することはできない。
ポリアクリル酸を感光液に混入して保存安定性
のよいPS版を製造するには、ポリアクリル酸の
溶解度を考えて、水やメタノールに易溶な高分子
化合物と、ジアゾ感光材を使用しなくてはならな
い。もしこの感光液組成で保存安定性あるネガ型
PS版を得たとしても耐刷性に問題がある。
本発明の下引き層に使用されるポリアクリル酸
又はポリメタクリル酸の高分子膜厚は、0.5μ以下
が好ましく、0.5μ以上になると感光層とアルミニ
ウム支持体との密着性が落ち、印刷時、画像部が
斑点状に欠落する恐れがある。これらの高分子膜
厚は、使用する水不溶性ジアゾ樹脂の種類によつ
て異なり、上述の範囲から適宜選択される。例え
ば、ジアゾ樹脂とヘキサフルオロリン酸塩との反
応生成物を用いた場合、高分子膜厚は0.1〜0.2μ
が好ましい。ジアゾ樹脂と2−メトキシ−4−ヒ
ドロキシベンゾフエノン−5−スルホン酸との反
応生成物を用いた場合、0.1μ以下が好ましい。
本発明の使用される重合体は、水不溶性ジアゾ
樹脂と効率良く光架橋反応し、陽極酸化されたア
ルミニウム板上に密着の良い耐水性及び、耐溶剤
性ある感光皮膜を形成する。又、非露光部は、界
面活性剤を含む弱アルカリ性水溶液で容易に現像
できる。
一般式〔〕で示される構造単位を形成する単
量体には、2−ヒドロキシ−3−フエノキシプロ
ピルアクリレート、2−ヒドロキシ−3−メチル
フエノキシプロピルアクリレート及び、対応する
メタクリレート等が知られる。又、一般式〔〕
で示される構造単位を形成する単量体には、2−
ヒドロキシエチル(メタ)アクリレート、ヒドロ
キシプロピル(メタ)アクリレート等が知られ
る。
一般式〔〕及び〔〕で示される構造単位を
形成する単量体は、平版印刷版として必要な耐水
性、インキ着肉性を上げるため、メチル(メタ)
アクリレート、スチレン、ベンジルアクリレー
ト、α−シアノメチルアクリレート、アクリロニ
トリル等の単量体が必要に応じて共重合され、更
に、界面活性剤を含む弱アルカリ水溶液で現像可
能にするために、アクリル酸、メタクリル酸、マ
レイン酸等の不飽和カルボン酸が共重合される。
一般式〔〕で示される構造単位を含む高分子
化合物は、ジアゾ樹脂と効率良く光架橋すると同
時に、陽極酸化されたアルミニウム板との密着性
が強く、又、耐磨耗性の良い感光層を形成する。
しかし、一般式〔〕で示される構造単位を形成
する単量体は、他のアクリル系単量体と共重合し
にくく、その重合溶液はゲル化し易いが、一般式
〔〕で示される構造単位を形成する単量体が介
在すると、容易に他の単量体と共重合体を作る。
一般式〔〕で示される構成単位の含有量は、
5〜30重量%で、30重量%以上では陽極酸化され
たアルミニウム板との密着性が強すぎるためか、
現像しにくくなり、5重量%以下では画像部の機
械的強度が不足する。
一般式〔〕で示される構成単位の含有量は、
20〜50重量%が好ましい。20重量%以下では、一
般式〔〕で示される構成単位を形成する単量体
との共重合がしにくく、50重量%以上では、ポリ
アクリル酸あるいは、ポリメタアクリル酸を下引
きした陽極酸化されたアルミニウム板との密着性
が低下するため、現像時、画像部の膨潤をおこし
てインク着肉性を低下させる。
上記重合体の酸価は、10〜100が好ましい。酸
価10以下では、界面活性剤を含む弱アルカリ性水
溶液による現像が遅くなり、かつ現像が終了して
もインキ汚れが生じ易い。酸価100以上では、画
像部の感脂性が著しく低下し、平版印刷版の感光
層に用いるには不適当である。又、重合体の分子
量は、5万〜15万の範囲が好ましい。
本発明に用いられる水不溶性ジアゾ樹脂は、前
に述べたようなジアゾ樹脂の有機スルホン酸塩、
及び無機酸塩との反応生成物が使用可能である。
特に、ジアゾ樹脂のヘキサフルオロ酸塩あるい
は、2−メトキシ−4−ヒドロキシベンゾフエノ
ン−5−スルホン酸塩との反応生成物が好まし
い。これらの水不溶性ジアゾ樹脂は、メチルセロ
ソルブ、ジメチルホルムアミド、二塩化エチレン
等の溶剤に溶解するため、感光液を構成する溶剤
はこれらの混合溶剤が使われる。ジアゾ系ネガ型
PS版の保存安定性をよくするために、従来感光
液に添加された蓚酸、亜燐酸、高分子の有機酸等
は、これらの溶剤にとけ難く、ロールコーター等
の高粘度の感光液を必要とする塗布方式では、塗
布表面にピンホールや塗布むらが多く、しかも保
存安定性において、製造ロツトのバラツキが発生
していた。
本発明では、その点完全に水にとけるポリアク
リル酸又は、ポリメタクリル酸の高分子膜を下引
き層とするため、多少のジアゾ樹脂の合成時の樹
脂化による現像時のインキ汚れも防ぐことができ
る。ジアゾ化合物の含有量は、重合体に対して5
〜20重量%が好ましい。更に必要に応じて、染
料、顔料、充てん剤を加えることによりPS版の
性能を上げることができる。
本発明のネガ型PS版の現像に際しては、特公
昭56−42860号、特公昭56−39464号に記載されて
いるアニオン界面活性剤、ベンジルアルコール、
及び水溶性亜硫酸塩を含む水溶液からなる現像液
を使用することはできるが、更に効率良く現像す
るために、特開昭55−138740に記載されているフ
エニルセロソルブとベンゾトリアゾールアミン付
加塩及び、界面活性剤を含む水溶液からなる現像
液の使用が好ましい。
以下実施例をあげて本発明を詳細に説明する
が、本発明はこれらに限定されるものでない。
実施例 1
窒素気流下で、ジオキサン150gにアゾビスイ
ソブチロニトリル0.3gを加えて、80〜85℃に加
熱する。その中に撹拌しながら2−ヒドロキシ−
3−フエノキシプロピルアクリレート15.5g、2
−ヒドロキシエチルメタクリレート41g、メチル
メタクリレート20.5g、α−シアノメチルアクリ
レート18g及び、メタクリル酸5gからなる混合
物を1時間かかつて滴下し、更に滴下終了後、80
〜85℃で2時間撹拌する。反応後冷却し、ジオキ
サンとメタノールの混液で希釈した後、大量の水
中に撹拌しながら注入して、共重合体を析出させ
る。この重合体をメチルセロソルブに再溶解し
て、再び水中に注入して精製し、真空乾燥して水
分を1%以下とする。この多元アクリル共重合体
の酸価は28.6であつた。
厚さ0.3mmのアルミニウム板をナイロンブラシ
で砂目立てした後、10%苛性ソーダ水に10秒浸漬
し水洗する。更に、10%硝酸水に5秒浸漬して、
デスマツト後水洗した。このアルミニウム板を20
%硫酸中で2A/dm2で3分間陽極酸化する。そ
の後5%ケイ酸ソーダ水で70℃30秒間処理し、水
洗乾燥後、ホエラーを用いて0.1%のポリアクリ
ル酸水溶液(分子量8000のポリアクリル酸使用)
を塗布し、60℃で5分間乾燥した。ポリアクリル
酸の膜厚は0.08μであつた。
このポリアクリル酸で処理した陽極酸化された
アルミニウム板に、下記組成を有する感光液をホ
エラーを用いて塗布し、85℃で3分間乾燥して、
ネガ型PS版(1)を得た。一方、比較としてポリア
クリル酸処理を除いた陽極酸化されたアルミニウ
ム板上に、上記方法と同様にして感光液を塗布
し、比較PS版(2)を得た。どちらも感光層の膜厚
は1.7μであつた。
感光液1
Rx.多元アクリル共重合体 5.0g
ジアゾ樹脂とヘキサフルオロリン酸塩の反応生
成物 0.5g
オイルブルー#603 0.25g
メチルセロソルブ 95.0g
ジメチルホルムアミド 10.0g
(ジアゾ樹脂は、ジアゾジフエニルアミンと、パ
ラホルムアルデヒドとの縮合物を使用)
得られたネガPS版(1)及び、比較PS版(2)を、
1kw超高圧水銀灯で2.2mW/cm2の強さで、1分
間露光し、次に示す現像液で25℃30秒間現像して
平版印刷版を得た。
現像液
Rx.フエニルセロソルブ 12g
ベンゾトリアゾールトリエタノールアミン付加
塩 3g
イソプロピルナフタレンスルホン酸ナトリウム
6g
水 250g
保存安定性を観察するために、温度40℃、温度
75%の雰囲気中に、本発明のネガPS版(1)及び比
較PS版(2)を保存し、製造直後のものを露光現像
したものと比較して、印刷時、コダツク ステツ
プ タブレツト(Kodak Step Tablet)No.2の
クリア段階の上昇変化と、非画像部の印刷インキ
の地汚れ現象を試験した。
The present invention relates to a photosensitive lithographic printing plate, and more particularly to a diazo-based photosensitive lithographic printing plate that has good storage stability, improved printing durability, and developability. Diazo-based photosensitive compositions are generally used in the photosensitive layer of photosensitive lithographic printing plates (hereinafter referred to as PS plates). The diazo-based photosensitive material for the positive-working PS plate contains naphthoquinone diazide, and the diazo-based photosensitive material for the negative-working PS plate contains 4-diazodiphenylamine, 4-diazo-3-methoxydiphenylamine, and paraformaldehyde. Condensates (hereinafter referred to as diazo resins) are mainly used. By mixing this diazo resin with a polymer compound,
It is possible to make a long-lasting lithographic printing plate without lacquering, and it can be easily developed with an aqueous developer containing a surfactant, so it is used in large quantities as a photosensitive material for negative PS plates. Diazo resin is
The photosensitive layer of a negative PS plate is classified into the following types depending on the partner polymer compound that undergoes a photocrosslinking reaction. (1) A combination of a water-insoluble polymer compound with alcoholic hydroxyl groups and a water-insoluble diazo resin. As a water-insoluble polymer compound having an alcoholic hydroxyl group, epoxy resin
1167), 2-hydroxyalkyl methacrylate, acrylonitrile, methacrylate and
Multi-component acrylic copolymer consisting of methacrylic acid,
Polyvinyl formal resin, polyvinyl butyral resin, polyvinyl chlorobenzal resin,
Multi-component acrylic copolymer consisting of 2-hydroxy-3-phenoxypropyl acrylate, methyl methacrylate, hydroxypropyl methacrylate, acrylonitrile and methacrylic acid (JP-A-52-7364, JP-A-55-34929, JP-A-54- 88403, Japanese Unexamined Patent Publication No. 55-142332), etc. are known. (2) A combination of a water-insoluble polymer compound with a phenolic hydroxyl group and a water-insoluble diazo resin. Examples of polymeric compounds having phenolic hydroxyl groups include phenolic resin (Japanese Patent Publication No. 47-1167), N
(4-hydroxyphenyl)methacrylamide,
Multi-component acrylic copolymers consisting of acrylonitrile, methyl methacrylate and methacrylic acid (JP-A-54-98614, JP-A-56-107234) are known. (3) Combinations of other water-insoluble polymer compounds and water-insoluble diazo resins. Other water-insoluble polymer compounds include polyamide, polystyrene, polyester, polyacetate, polyurethane, polyvinyl acetate (Japanese Patent Publication No. 47-1167, Japanese Patent Publication No. 56-9697), N-vinylpyrrolidone, acrylonitrile, and methyl methacrylate. Acrylic copolymers (Japanese Patent Laid-Open No. 54-27802), multi-component acrylic copolymers consisting of methyl methacrylate, acrylonitrile and methacrylic acid (Japanese Patent Laid-Open No. 56-4144), and the like are known. Combinations that belong to (2) and (3) above have a lower photocrosslinking density with the diazo compound than combinations that belong to (1) above, so they have weaker solvent resistance. As a result, the developability with an aqueous developer containing a surfactant deteriorates, and there are many problems in producing a good negative PS plate. The water-insoluble diazo resin used for negative PS plates is a combination of diazo resin and organic sulfonic acids such as para-toluenesulfonic acid, dodecylbenzenesulfonic acid, 2-methoxy-4-hydroxybenzophenone-5-sulfonic acid, or salts thereof. reaction product with
Also known are reaction products with inorganic acids such as hydroborofluoric acid, thiocyanic acid, and hexafluorophosphoric acid, or their salts (Japanese Patent Publication No. 39-17602, Japanese Patent Publication No. 42-5364, US Pat. No. 4,093,465). The photosensitive composition of these diazo-based negative PS plates is applied to a hydrophilized support such as paper, chromium, or aluminum to make a PS plate. When applied to a plate, the adhesion is too good, so if it has been applied for several months or has been stored at high temperature and high humidity, when it is exposed and developed, the unexposed areas will be eluted and the ink will stain. This phenomenon can be seen. In order to solve these problems, diazo negative type
Oxalic acid (Special Publication No. 1984-8460) is used in photosensitive compositions for PS plates.
It is known that ink stains on negative PS plates after development can be eliminated over time by mixing phosphorous acid (Japanese Unexamined Patent Publication No. 54-151023), or high-molecular organic acids (Japanese Unexamined Patent Publication No. 56-107238). However, it is still not enough. As a result of intensive research to solve the above problem, the present inventors formed a polymer film of polyacrylic acid or polymethacrylic acid with a film thickness of 0.5μ or less on an anodized aluminum plate, and A photosensitive layer consisting of a water-insoluble diazo resin and a polymer having an acid value of 10 to 100 containing a structural unit represented by the following general formula [] and 20% by weight or less of a structural unit represented by the following general formula []. It has been found that by laminating, a diazo-based negative PS plate with good stability over time and improved printing durability and developability can be obtained. (In each of the above formulas, R 1 represents a hydrogen atom or a methyl group, R 2 represents a hydrogen atom or an alkyl group, and n represents an integer of 1 to 10.) Anodized aluminum used in the present invention After graining the aluminum plate by brush polishing or electrolytic polishing, the plate is anodized in an anodizing bath of sulfuric acid, hydrochloric acid, phosphoric acid, boric acid, or a mixed acid, and is further coated with silicate or zirconium fluoride. The pores are sealed with an aqueous salt solution. The polyacrylic acid or polymethacrylic acid used in the present invention preferably has an average molecular weight of 5,000 to 30,000, is well soluble in water, and almost insoluble in solvents. According to JP-A No. 56-107238, polyacrylic acid is added to the resin of a diazo negative photosensitive composition from 1 to 10%.
It has been reported that the storage stability of PS plates improves when 5% by weight is mixed in. However, since polyacrylic acid is almost insoluble in the solvents such as methyl cellosolve that make up the photosensitive solution, it is difficult to Polyacrylic acid is removed during the process. Therefore P.S.
Variations occur in the storage stability of the plates. Further, the water-insoluble diazo resin is less likely to decompose as the viscosity of the photosensitive liquid increases. Therefore, when applying a photosensitive solution to an aluminum plate sheet by sheet using a roll coater, the resin concentration of the photosensitive solution should be adjusted to 10 to
Adjustment to 15% or more is necessary to produce a PS plate with stable quality, and polyacrylic acid cannot be added and dissolved accordingly. In order to manufacture a PS plate with good storage stability by mixing polyacrylic acid into a photosensitive solution, a polymer compound that is easily soluble in water and methanol and a diazo photosensitive material are used, taking into account the solubility of polyacrylic acid. Must-have. If this photosensitive liquid composition is a storage-stable negative type,
Even if you get the PS version, there are problems with printing durability. The thickness of the polymer film of polyacrylic acid or polymethacrylic acid used in the undercoat layer of the present invention is preferably 0.5μ or less, and if it is 0.5μ or more, the adhesion between the photosensitive layer and the aluminum support will deteriorate during printing. , the image area may be missing in spots. The thickness of these polymer films varies depending on the type of water-insoluble diazo resin used, and is appropriately selected from the above-mentioned range. For example, when using a reaction product of diazo resin and hexafluorophosphate, the polymer film thickness is 0.1 to 0.2μ.
is preferred. When a reaction product of diazo resin and 2-methoxy-4-hydroxybenzophenone-5-sulfonic acid is used, the thickness is preferably 0.1 μ or less. The polymer used in the present invention undergoes an efficient photo-crosslinking reaction with the water-insoluble diazo resin to form a photosensitive film with good adhesion and water resistance and solvent resistance on an anodized aluminum plate. Further, the unexposed area can be easily developed with a weakly alkaline aqueous solution containing a surfactant. Known monomers forming the structural unit represented by the general formula [] include 2-hydroxy-3-phenoxypropyl acrylate, 2-hydroxy-3-methylphenoxypropyl acrylate, and corresponding methacrylates. It will be done. Also, general formula []
The monomers forming the structural unit represented by 2-
Hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, etc. are known. The monomers forming the structural units represented by the general formulas [] and [] are methyl (meth) in order to increase the water resistance and ink receptivity required for planographic printing plates.
Monomers such as acrylate, styrene, benzyl acrylate, α-cyanomethyl acrylate, and acrylonitrile are copolymerized as necessary, and acrylic acid, methacrylic Acid, unsaturated carboxylic acid such as maleic acid is copolymerized. The polymer compound containing the structural unit represented by the general formula [] can efficiently photocrosslink with the diazo resin, have strong adhesion to the anodized aluminum plate, and form a photosensitive layer with good abrasion resistance. Form.
However, the monomer forming the structural unit represented by the general formula [] is difficult to copolymerize with other acrylic monomers, and the polymerization solution tends to gel, but the structural unit represented by the general formula [] When a monomer that forms is present, it easily forms a copolymer with other monomers. The content of the structural unit represented by the general formula [] is
5 to 30% by weight, and if it exceeds 30% by weight, the adhesion to the anodized aluminum plate is too strong.
It becomes difficult to develop, and if it is less than 5% by weight, the mechanical strength of the image area will be insufficient. The content of the structural unit represented by the general formula [] is
20-50% by weight is preferred. If it is less than 20% by weight, it will be difficult to copolymerize with the monomer forming the structural unit represented by the general formula [], and if it is more than 50% by weight, it will be difficult to copolymerize with the monomer forming the structural unit represented by the general formula []. Since the adhesion with the coated aluminum plate decreases, the image area swells during development and the ink receptivity decreases. The acid value of the above polymer is preferably 10 to 100. If the acid value is less than 10, development with a slightly alkaline aqueous solution containing a surfactant will be slow, and even after development is completed, ink stains will easily occur. If the acid value is 100 or more, the oil sensitivity of the image area will be significantly reduced, making it unsuitable for use in the photosensitive layer of a lithographic printing plate. Further, the molecular weight of the polymer is preferably in the range of 50,000 to 150,000. The water-insoluble diazo resin used in the present invention includes organic sulfonate salts of diazo resins as described above,
and reaction products with inorganic acid salts can be used.
In particular, a reaction product of a diazo resin with a hexafluoro acid salt or a 2-methoxy-4-hydroxybenzophenone-5-sulfonate is preferred. Since these water-insoluble diazo resins are soluble in solvents such as methyl cellosolve, dimethylformamide, and ethylene dichloride, a mixed solvent of these is used as the solvent constituting the photosensitive liquid. Diazo negative type
In order to improve the storage stability of PS plates, oxalic acid, phosphorous acid, polymeric organic acids, etc., which were conventionally added to photosensitive solutions, are difficult to dissolve in these solvents, and a high viscosity photosensitive solution such as a roll coater is required. With this coating method, there were many pinholes and uneven coating on the coating surface, and there were also variations in storage stability between production lots. In this invention, since a polymer film of polyacrylic acid or polymethacrylic acid, which is completely soluble in water, is used as the undercoat layer, it is possible to prevent ink stains during development due to the resinization of some diazo resin during synthesis. Can be done. The content of the diazo compound is 5% relative to the polymer.
~20% by weight is preferred. Furthermore, if necessary, the performance of the PS plate can be improved by adding dyes, pigments, and fillers. When developing the negative PS plate of the present invention, anionic surfactants, benzyl alcohol,
Although it is possible to use a developer consisting of an aqueous solution containing a water-soluble sulfite and a water-soluble sulfite, for more efficient development, phenyl cellosolve and benzotriazoleamine addition salt described in JP-A-55-138740 and Preference is given to using a developer consisting of an aqueous solution containing a surfactant. The present invention will be explained in detail below with reference to Examples, but the present invention is not limited thereto. Example 1 Under a nitrogen stream, 0.3 g of azobisisobutyronitrile is added to 150 g of dioxane and heated to 80-85°C. 2-Hydroxy-
3-phenoxypropyl acrylate 15.5g, 2
- A mixture consisting of 41 g of hydroxyethyl methacrylate, 20.5 g of methyl methacrylate, 18 g of α-cyanomethyl acrylate, and 5 g of methacrylic acid was added dropwise for an hour or so, and after the addition was completed, 80 g of methacrylic acid was added.
Stir at ~85°C for 2 hours. After the reaction, the mixture is cooled, diluted with a mixture of dioxane and methanol, and then poured into a large amount of water with stirring to precipitate the copolymer. This polymer is redissolved in methyl cellosolve, purified by pouring it into water again, and vacuum dried to reduce the water content to 1% or less. The acid value of this multi-component acrylic copolymer was 28.6. After graining a 0.3 mm thick aluminum plate with a nylon brush, immerse it in 10% caustic soda water for 10 seconds and rinse with water. Furthermore, immerse it in 10% nitric acid water for 5 seconds,
After desmatting, I washed it with water. 20 pieces of this aluminum plate
% sulfuric acid at 2 A/dm 2 for 3 minutes. After that, it was treated with 5% sodium silicate water at 70℃ for 30 seconds, washed with water, dried, and then processed using a Whaler with a 0.1% polyacrylic acid aqueous solution (using polyacrylic acid with a molecular weight of 8000).
was applied and dried at 60°C for 5 minutes. The polyacrylic acid film thickness was 0.08μ. A photosensitive solution having the following composition was applied to this anodized aluminum plate treated with polyacrylic acid using a Whaler, and dried at 85°C for 3 minutes.
A negative PS version (1) was obtained. On the other hand, for comparison, a comparative PS plate (2) was obtained by applying a photosensitive liquid on an anodized aluminum plate that had not been treated with polyacrylic acid in the same manner as described above. In both cases, the thickness of the photosensitive layer was 1.7 μm. Photosensitive liquid 1 Rx. Multi-component acrylic copolymer 5.0g Reaction product of diazo resin and hexafluorophosphate 0.5g Oil Blue #603 0.25g Methyl cellosolve 95.0g Dimethylformamide 10.0g (Diazo resin is a combination of diazo diphenylamine and , using a condensate with paraformaldehyde) The obtained negative PS plate (1) and comparative PS plate (2) were
It was exposed to light for 1 minute using a 1 kW ultra-high pressure mercury lamp at an intensity of 2.2 mW/cm 2 , and developed with the following developer at 25° C. for 30 seconds to obtain a lithographic printing plate. Developer Rx. Phenyl cellosolve 12g Benzotriazole triethanolamine addition salt 3g Sodium isopropylnaphthalene sulfonate
6g water 250g To observe storage stability, temperature 40℃, temperature
The negative PS plate (1) of the present invention and the comparative PS plate (2) were stored in a 75% atmosphere, and compared with those exposed and developed immediately after manufacture, Kodak Step Tablets (Kodak Step Tablet) No. 2 was tested for increasing change in clear stage and scumming phenomenon of printing ink in non-image areas.
【表】
表1から明らかなように、本発明によるネガ型
PS版(1)は、保存安定性に優れていることが判る。
又、ネガ型PS版(1)は、10万部以上の印刷物を刷
了することができた。
実施例 2
実施例1で使用した水不溶性ジアゾ樹脂を、ジ
アゾ樹脂の2−メトキシ−4−ヒドロキシベンゾ
フエノン−5−スルホン酸との反応生成物に変え
ても、保存安定性及び、耐刷性が実施例1と同じ
く優れていることが判つた。[Table] As is clear from Table 1, negative type according to the present invention
It can be seen that the PS version (1) has excellent storage stability.
In addition, we were able to print over 100,000 copies of the negative PS version (1). Example 2 Even if the water-insoluble diazo resin used in Example 1 was replaced with a reaction product of diazo resin with 2-methoxy-4-hydroxybenzophenone-5-sulfonic acid, the storage stability and printing durability were improved. It was found that the properties were as excellent as in Example 1.
Claims (1)
0.5μ以下のポリアクリル酸又はポリメタクリル酸
の高分子膜を形成させ、その上に、水不溶性のジ
アゾ樹脂及び下記一般式〔〕 で示される構造単位と、50重量%以下の下記一般
式〔〕 (上記式及び中、R1は水素原子又はメチル
基を示し、R2は水素原子又はアルキル基を示し、
nは1〜10の整数を示す)で表わされる構造単位
とを含む酸価10〜100の重合体からなる感光層を
積層させた感光性平版印刷版。[Claims] 1. On an anodized aluminum plate, the film thickness is
A polymer film of polyacrylic acid or polymethacrylic acid of 0.5μ or less is formed, and a water-insoluble diazo resin and the following general formula [] The structural unit represented by and 50% by weight or less of the following general formula [] (In the above formula and inside, R 1 represents a hydrogen atom or a methyl group, R 2 represents a hydrogen atom or an alkyl group,
A photosensitive lithographic printing plate comprising a photosensitive layer made of a polymer having an acid value of 10 to 100 and containing a structural unit represented by (n is an integer of 1 to 10).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6493582A JPS58181039A (en) | 1982-04-19 | 1982-04-19 | Photosensitive lithographic printing plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6493582A JPS58181039A (en) | 1982-04-19 | 1982-04-19 | Photosensitive lithographic printing plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58181039A JPS58181039A (en) | 1983-10-22 |
JPH0153450B2 true JPH0153450B2 (en) | 1989-11-14 |
Family
ID=13272379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6493582A Granted JPS58181039A (en) | 1982-04-19 | 1982-04-19 | Photosensitive lithographic printing plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58181039A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3808951A1 (en) * | 1988-03-17 | 1989-10-05 | Basf Ag | PHOTOPOLYMERIZABLE PRINTING PLATE SUITABLE FOR PRODUCING PRINTING FORMS |
DE3808952A1 (en) * | 1988-03-17 | 1989-10-05 | Basf Ag | LIGHT-SENSITIVE, PHOTOPOLYMERIZABLE PRINTING PLATE |
-
1982
- 1982-04-19 JP JP6493582A patent/JPS58181039A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58181039A (en) | 1983-10-22 |
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