JPH0147912B2 - - Google Patents
Info
- Publication number
- JPH0147912B2 JPH0147912B2 JP56175506A JP17550681A JPH0147912B2 JP H0147912 B2 JPH0147912 B2 JP H0147912B2 JP 56175506 A JP56175506 A JP 56175506A JP 17550681 A JP17550681 A JP 17550681A JP H0147912 B2 JPH0147912 B2 JP H0147912B2
- Authority
- JP
- Japan
- Prior art keywords
- printed
- resin paint
- circuit board
- conductor
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 56
- 239000011347 resin Substances 0.000 claims description 56
- 239000003973 paint Substances 0.000 claims description 45
- 239000004020 conductor Substances 0.000 claims description 44
- 238000000034 method Methods 0.000 claims description 14
- 238000007639 printing Methods 0.000 claims description 14
- 230000005012 migration Effects 0.000 claims description 13
- 238000013508 migration Methods 0.000 claims description 13
- 230000002401 inhibitory effect Effects 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 239000010970 precious metal Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims 1
- 229910000510 noble metal Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Description
【発明の詳細な説明】
本発明は１枚の絶縁基板の両面に所定形状の導
体回路を有し、これら導体回路網が上記絶縁基板
に設け透孔の導電性樹脂ペイントによるスルーホ
ール導体路でもつて電気的に接続された印刷配線
板の製造方法に関するものであり、その目的とす
るところは工程を削減して量産性を高めることが
できる印刷配線板の製造方法を提供することにあ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention has conductor circuits of a predetermined shape on both sides of a single insulating substrate, and these conductor circuit networks can also be formed by through-hole conductor paths formed by conductive resin paint on the holes provided in the insulating substrate. The present invention relates to a method of manufacturing an electrically connected printed wiring board, and its purpose is to provide a method of manufacturing a printed wiring board that can reduce the number of steps and improve mass productivity.
一般に、両面印刷配線板を得るためには両面に
所定形状の導体回路を設けたプリント基板に透孔
を設け、この透孔を介して両面の導体回路網を導
電性樹脂ペイントにて電気的に接続する、いわゆ
るスルーホール接続法が採用されている。一方、
両面印刷配線板はその片面の所定形状の導体回路
網に対して印刷によつて抵抗、コンデンサ等の回
路素子を設け、これらの回路素子を上述した所定
形状の導体回路網に対して導電性樹脂ペイントに
よる電極によつて電気的に接続したり、導電性樹
脂ペイントによる導体回路網をクロスオーバー配
線したりして高密度化を図つている。しかしなが
ら、上述した両面印刷配線板ではスルーホール接
続のための導電性樹脂ペイント、片面の導体回路
網に対する回路素子の電気的接続のための導電性
樹脂ペイント、片面の導体回路網に対するクロス
オーバー配線のための導電性樹脂ペイント等が基
板本体に直接設けられているため、高電位から低
電位側に貴金属が移行するマイグレイシヨンを引
き起して基板本体自体の絶縁抵抗を低下させた
り、所定の回路間を短絡させたりする問題があつ
た。そこで、上述したマイグレイシヨンを抑止す
るために貴金属移行抑止作用を有する樹脂ペイン
トを上記のそれぞれの導電性樹脂ペイントの層の
アンダーコートとして設けることが考えられる
が、上記樹脂ペイントを上記のそれぞれの導電性
樹脂ペイントの層のアンダーコートとして別途に
設けていたのでは非常に工数が増大するという問
題があつた。 Generally, in order to obtain a double-sided printed circuit board, a through hole is provided in a printed circuit board with conductor circuits of a predetermined shape on both sides, and the conductor circuit network on both sides is electrically connected through the through hole with conductive resin paint. A so-called through-hole connection method is used. on the other hand,
A double-sided printed wiring board has circuit elements such as resistors and capacitors printed on a conductor network of a predetermined shape on one side, and these circuit elements are coated with conductive resin on the conductor network of a predetermined shape as described above. High density is achieved by electrically connecting with electrodes made of paint, or by cross-over wiring a conductor circuit network made of conductive resin paint. However, in the above-mentioned double-sided printed wiring board, conductive resin paint is used for through-hole connections, conductive resin paint is used to electrically connect circuit elements to the conductor network on one side, and crossover wiring is applied to the conductor network on one side. Because conductive resin paint, etc., is provided directly on the board body, it causes migration of noble metals from high potential to low potential, reducing the insulation resistance of the board body itself, and There was a problem with short-circuiting between circuits. Therefore, in order to suppress the above-mentioned migration, it is possible to provide a resin paint having a noble metal migration inhibiting effect as an undercoat for each of the above conductive resin paint layers. If it was provided separately as an undercoat for the layer of conductive resin paint, there was a problem in that the number of man-hours would increase significantly.
本発明はこのような従来の欠点を解消するもの
であり、プリント基板の片面の導体回路に対する
回路素子の接続用導体路およびクロスオーバー配
線のための導体回路網のアンダーコートとしての
貴金属移行抑止作用を有する樹脂ペイントを印刷
技術によつて形成し、そのアンダーコートの印刷
工程においてスルーホール接続のための導体路の
アンダーコートとしての貴金属移行抑止作用を有
する樹脂ペイントを同時に印刷するようにしたも
のである。 The present invention eliminates such conventional drawbacks, and has the effect of inhibiting migration of precious metals as an undercoat of a conductor path for connecting circuit elements to a conductor circuit on one side of a printed circuit board and a conductor circuit network for crossover wiring. A resin paint is formed using printing technology, and in the undercoat printing process, a resin paint that has the effect of inhibiting noble metal migration is simultaneously printed as an undercoat for conductor paths for through-hole connections. be.
以下、本発明の実施例について説明する。 Examples of the present invention will be described below.
実施例
まず、第１図に示すように両面に所定形状の導
体回路網としての導体層１，２をそれぞれ有し、
その所定箇所に透孔３を有する紙基板フエノール
樹脂積層板よりなるプリント基板４を用意した。
次に、第２図に示すように上記プリント基板４の
一方の導体回路網としての導体層１を有する面に
メタルマスク５を配置し、その導体層１の所定箇
所およびその導体層１のない部分ならびに透孔３
に対して貴金属の移行抑止作用を有する樹脂ペイ
ント６をスクリーン印刷の手法で印刷した。この
時、上記メタルマスク５としては上記プリント基
板４の一方の導体層１でなる導体回路網をネガパ
ターンとするならばこのポジパターンに相当する
所定形状に対応したマスク孔７および上記導体層
１でなる導体回路網上にクロスオーバー配線する
予定部分に対応したマスク孔８、ならびに上記プ
リント基板４の透孔３に対応した段付きのマスク
孔９を設けたものを用いた。また、上記樹脂ペイ
ント６はメチルエチルケトンにより粘度110±
10CPSの範囲に調整した。そして、このスクリー
ン印刷によつて第２図に示すように上記プリント
基板４の一方の導体層１でなる導体回路網の未形
成部分およびクロスオーバー配線の予定部分に所
定形状に貴金属移行抑止作用を有する樹脂層６を
印刷すると同時に、上記プリント基板４の透孔３
に上記貴金属の移行抑止作用を有する樹脂層６の
立体的な印刷を行なつた。この印刷の後に上記プ
リント基板４を電気炉中に入れて150℃，30分の
条件で上記貴金属の移行抑止作用を有する樹脂ペ
イント６の印刷層を硬化させた。次に、上記プリ
ント基板４の一方の導体層１でなる導体回路網の
未形成部分に設けた樹脂層６上に抵抗体、誘電体
等の回路素子（図示せず）を印刷したのちに硬化
させた。その後、第３図に示すように上記プリン
ト基板４の樹脂層６を設けた面にメタルマスク１
０を配置してスクリーン印刷の手法で導電性樹脂
ペイント１１を印刷した。この時、上記メタルマ
スク１０としては上記プリント基板４の樹脂層６
上に設けた回路素子を上記プリント基板４の一方
の導体層１でなる導体回路網に対して電気的に接
続するための接続用導体路に対応したマスク孔１
２および上記樹脂層６上にクロスオーバー配線の
ための導体路に対応したマスク孔１３、ならびに
上記樹脂層６を設けた上記プリント基板４の透孔
に対応した段付きのマスク孔１４を設けたものを
用いた。また、導電性樹脂ペイント１１としては
国デユポン社製の銀粉―樹脂系5504をカルビトー
ル溶剤によつて粘度100±10CPSの範囲に調整し
て用いた。そして、このスクリーン印刷によつて
第３図に示すように上記プリント基板４の樹脂層
６上に設けた所定の回路素子の接続用導体路およ
びクロスオーバー配線用の導体路としての導電性
樹脂ペイント層１１を印刷すると同時に上記樹脂
層６を有する上記プリント基板４の透孔３にはと
め状にスルーホール導体路としての導電性樹脂ペ
イント層１１の立体的な印刷を行なつた。この印
刷の後に上記プリント基板４を電気炉中に入れて
150℃、60分の条件で上記導電性樹脂ペイント層
１１を硬化させた。このようにして両面に所定形
状の導体回路網を有し、その一方の導体回路網に
対して所定の印刷回路素子が接続されると共にク
ロスオーバー配線され、これらの所定回路に対し
て他方の導体回路網がスルーホール導体路によつ
て電気的に接続された両面印刷配線板を得た。Embodiment First, as shown in FIG.
A printed circuit board 4 made of a paper substrate phenolic resin laminate having through holes 3 at predetermined locations was prepared.
Next, as shown in FIG. 2, a metal mask 5 is placed on one side of the printed circuit board 4 having the conductor layer 1 as a conductor circuit network, and a metal mask 5 is placed on the surface of the printed circuit board 4 at a predetermined location on the conductor layer 1 and where the conductor layer 1 is not present. part and through hole 3
Resin paint 6, which has the effect of inhibiting migration of precious metals, was printed using a screen printing method. At this time, the metal mask 5 includes a mask hole 7 corresponding to a predetermined shape corresponding to a positive pattern if the conductor circuit network formed by one conductor layer 1 of the printed circuit board 4 is a negative pattern, and the conductor layer 1 A mask hole 8 corresponding to a portion where crossover wiring is planned to be performed on the conductor circuit network and stepped mask holes 9 corresponding to the through holes 3 of the printed circuit board 4 were used. In addition, the resin paint 6 has a viscosity of 110± due to methyl ethyl ketone.
Adjusted to 10CPS range. By this screen printing, as shown in FIG. 2, a precious metal migration inhibiting effect is applied to the unformed portion of the conductor network formed by one conductor layer 1 of the printed circuit board 4 and the planned portion of the crossover wiring in a predetermined shape. At the same time as printing the resin layer 6, the through holes 3 of the printed circuit board 4 are printed.
The resin layer 6 having the above-mentioned noble metal migration inhibiting effect was three-dimensionally printed. After this printing, the printed circuit board 4 was placed in an electric furnace and the printed layer of the resin paint 6 having the effect of inhibiting migration of noble metals was cured at 150° C. for 30 minutes. Next, circuit elements (not shown) such as resistors and dielectrics are printed on the resin layer 6 provided on the unformed part of the conductor circuit network formed by one of the conductor layers 1 of the printed circuit board 4, and then hardened. I let it happen. Thereafter, as shown in FIG. 3, a metal mask 1 is placed on the surface of the printed circuit board 4 on which the resin layer 6 is provided.
The conductive resin paint 11 was printed using screen printing method. At this time, the resin layer 6 of the printed circuit board 4 serves as the metal mask 10.
A mask hole 1 corresponding to a connecting conductor path for electrically connecting a circuit element provided above to a conductor circuit network formed by one conductor layer 1 of the printed circuit board 4;
2 and the resin layer 6 are provided with a mask hole 13 corresponding to a conductor path for crossover wiring, and a stepped mask hole 14 corresponding to the through hole of the printed circuit board 4 on which the resin layer 6 is provided. I used something. Further, as the conductive resin paint 11, silver powder-resin type 5504 manufactured by DuPont was used after adjusting the viscosity to a range of 100±10 CPS with a carbitol solvent. By this screen printing, as shown in FIG. 3, conductive resin paint is applied as a conductor path for connecting predetermined circuit elements and a conductor path for crossover wiring, which is provided on the resin layer 6 of the printed circuit board 4. At the same time as printing the layer 11, a conductive resin paint layer 11 was three-dimensionally printed as a through-hole conductor path in the through hole 3 of the printed circuit board 4 having the resin layer 6 in a stopper shape. After this printing, the printed circuit board 4 is placed in an electric furnace.
The conductive resin paint layer 11 was cured at 150° C. for 60 minutes. In this way, both sides have a conductor network of a predetermined shape, a predetermined printed circuit element is connected to one of the conductor circuit networks, and cross-over wiring is performed, and the other conductor is connected to the predetermined circuit. A double-sided printed wiring board was obtained in which the circuit network was electrically connected by through-hole conductor paths.
以上のように本発明によれば、両面に所定形状
の導体回路網が設けられると共にその所定箇所に
透孔が設けられたプリント基板を有し、このプリ
ント基板の一方の導体回路網を有する面に貴金属
の移行抑止作用を有する樹脂ペイントを所定形状
に印刷すると同時に上記プリント基板の透孔に上
記樹脂ペイントの他面にわたる印刷を行ない、上
記樹脂ペイントの印刷層を乾燥したのちに上記プ
リント基板の一方の導体回路網を有する面に設け
た樹脂ペイントの印刷層上に導電性樹脂ペイント
を所定形状に印刷すると同時に上記樹脂ペイント
の印刷層が設けられた上記プリント基板の透孔に
上記導電性樹脂ペイントの立体的な印刷を行な
い、しかる後に上記導電性樹脂ペイントの印刷層
を硬化させるようにしたので、上記貴金属の移行
抑止作用を有する樹脂ペイントのプリント基板の
一方の導体回路網の未形成部分およびクロスオー
バー配線予定箇所への印刷工程においてスルーホ
ール接続のためのアンダーコートを、そして、上
記樹脂ペイントの印刷層上への所定の印刷回路素
子の接続用導体路としての導電性樹脂ペイントの
印刷工程においてスルーホール接続のための導体
路を形成することができ、両面印刷配線板の製造
工程を削減して生産性を高めることができる、し
かも、スルーホール導体路および所定の印刷回路
素子の接続用導体路としての導電性樹脂ペイント
の印刷層は貴金属の移行抑止作用を有する樹脂ペ
イントの印刷層をアンダーコートとして形成され
るため、貴金属のマイグレイシヨンを効果的に抑
止することができる。そして、上記樹脂ペイント
を印刷法で塗布しているので、そのパターンが正
確であり、樹脂ペイントを噴流法や浸漬法などで
付着させる場合のようなパターン修正といつた工
程を必要とせず、工業的にきわめて容易に実施で
きるという利点も有するものである。 As described above, according to the present invention, a printed circuit board is provided with conductor circuit networks of a predetermined shape on both sides and through holes are provided at predetermined locations, and one side of the printed circuit board has the conductor circuit network. At the same time, the other side of the resin paint is printed on the through hole of the printed circuit board in a predetermined shape, and after the printed layer of the resin paint is dried, the printed circuit board is A conductive resin paint is printed in a predetermined shape on a printed layer of resin paint provided on one surface having a conductive circuit network, and at the same time, the conductive resin is applied to a through hole of the printed circuit board on which the printed layer of the resin paint is provided. Since the paint is three-dimensionally printed and the printed layer of the conductive resin paint is then cured, the conductive circuit network on one side of the printed circuit board of the resin paint that has the effect of inhibiting migration of the noble metal is not formed. and an undercoat for through-hole connection in the printing process for the planned crossover wiring location, and printing of conductive resin paint as a conductor path for connecting a predetermined printed circuit element on the printed layer of resin paint. Conductor paths for through-hole connections can be formed in the process, reducing the manufacturing process of double-sided printed wiring boards and increasing productivity. Since the printed layer of conductive resin paint serving as the conductive path is formed with a printed layer of resin paint having an effect of inhibiting noble metal migration as an undercoat, the migration of noble metal can be effectively inhibited. Furthermore, since the resin paint is applied using a printing method, the pattern is accurate, and there is no need for pattern correction or other processes when resin paint is applied using a jet method or a dipping method. It also has the advantage of being extremely easy to implement.
図面は本発明の印刷配線板の製造方法の一実施
例を示し、第１図は出発材としての両面プリント
基板の断面図、第２図は樹脂ペイントの印刷工程
の説明図、第３図は導電性樹脂ペイントの印刷工
程の説明図である。
１，２……導体層、３……透孔、４……プリン
ト基板、５，１０……メタルマスク、６……樹脂
ペイント、７，８，１２，１３…マスク孔、９，
１４……段付きマスク孔、１１……導電性樹脂ペ
イント。
The drawings show an embodiment of the method for manufacturing a printed wiring board of the present invention, in which Fig. 1 is a sectional view of a double-sided printed circuit board as a starting material, Fig. 2 is an explanatory diagram of the printing process of resin paint, and Fig. 3 is a cross-sectional view of a double-sided printed circuit board as a starting material. It is an explanatory view of a printing process of conductive resin paint. 1, 2... Conductor layer, 3... Through hole, 4... Printed circuit board, 5, 10... Metal mask, 6... Resin paint, 7, 8, 12, 13... Mask hole, 9,
14...Stepped mask hole, 11...Conductive resin paint.
Claims (1)
共にその所定箇所に透孔が設けられたプリント基
板を有し、このプリント基板の一方の導体回路網
を有する面に貴金属の移行抑止作用を有する樹脂
を所定形状に印刷すると同時に、上記プリント基
板の透孔に、上記樹脂ペイントの他面にまたがる
印刷をスクリーン印刷の手法を用いて行ない、上
記樹脂ペイントの印刷層の乾燥の後に、上記プリ
ント基板の一方の導体回路網を有する面に設けた
樹脂ペイントの印刷層上に導電性樹脂ペイントを
所定形状に印刷すると同時に、上記樹脂ペイント
の印刷層を有する上記プリント基板の透孔に上記
樹脂ペイントの立体的な印刷を行ない、しかる後
に上記導電性樹脂ペイントの印刷層を硬化させる
ことを特徴とする印刷配線板の製造方法。1. A resin having a printed circuit board with a conductor network of a predetermined shape on both sides and through-holes provided at predetermined locations, and which has the effect of inhibiting migration of precious metals on one side of the printed circuit board with the conductor network. At the same time as printing in a predetermined shape, printing is performed on the other side of the resin paint in the through holes of the printed circuit board using a screen printing method, and after drying the printed layer of the resin paint, the printed circuit board is printed. At the same time, conductive resin paint is printed in a predetermined shape on the printed layer of resin paint provided on the surface having the conductive circuit network, and at the same time, the three-dimensional resin paint is applied to the through hole of the printed circuit board having the printed layer of the resin paint. 1. A method for manufacturing a printed wiring board, which comprises performing printing, and then curing the printed layer of the conductive resin paint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17550681A JPS5875882A (en) | 1981-10-30 | 1981-10-30 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17550681A JPS5875882A (en) | 1981-10-30 | 1981-10-30 | Method of producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5875882A JPS5875882A (en) | 1983-05-07 |
| JPH0147912B2 true JPH0147912B2 (en) | 1989-10-17 |
Family
ID=15997230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17550681A Granted JPS5875882A (en) | 1981-10-30 | 1981-10-30 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5875882A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516385A (en) * | 1978-07-22 | 1980-02-05 | Moriyama Sangyo Kk | Fluorescent lamp illuminator |
-
1981
- 1981-10-30 JP JP17550681A patent/JPS5875882A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5516385A (en) * | 1978-07-22 | 1980-02-05 | Moriyama Sangyo Kk | Fluorescent lamp illuminator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5875882A (en) | 1983-05-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6631551B1 (en) | Method of forming integral passive electrical components on organic circuit board substrates | |
| JPH023317B2 (en) | ||
| JPH0147912B2 (en) | ||
| JPS63141388A (en) | Manufacture of thick film circuit board | |
| JPH0265194A (en) | Manufacture of printed wiring board with thick film element | |
| US20050062587A1 (en) | Method and structure of a substrate with built-in via hole resistors | |
| JPH09181453A (en) | Multilayer wiring board and its manufacturing method | |
| JPS63261796A (en) | Manufacture of multilayer hybrid ic substrate | |
| JPH066031A (en) | Manufacturing method of printed wiring board | |
| JPH0224395B2 (en) | ||
| JPS5841799B2 (en) | printed wiring board | |
| JPS63265488A (en) | Printed circuit board | |
| JPH0552077B2 (en) | ||
| JPS5877287A (en) | Method of producing printed circuit board | |
| JPH0410753B2 (en) | ||
| JPH02166792A (en) | Multilayer through hole and forming method therefor | |
| JP2603863B2 (en) | Printed wiring board | |
| JPH066028A (en) | Manufacturing method of printed wiring board | |
| WO1979000860A1 (en) | Ceramic condenser and method of manufacturing the same | |
| JPH0380358B2 (en) | ||
| JPS6154657A (en) | Hybrid integrated circuit | |
| JPH01175293A (en) | Printed resistor board and manufacture thereof | |
| JPH0210792A (en) | Printed board | |
| JPS60187047A (en) | Manufacture of thick film circuit board | |
| JPS5877291A (en) | Method of producing printed circuit board |