JPH0147013B2 - - Google Patents

Info

Publication number
JPH0147013B2
JPH0147013B2 JP5113480A JP5113480A JPH0147013B2 JP H0147013 B2 JPH0147013 B2 JP H0147013B2 JP 5113480 A JP5113480 A JP 5113480A JP 5113480 A JP5113480 A JP 5113480A JP H0147013 B2 JPH0147013 B2 JP H0147013B2
Authority
JP
Japan
Prior art keywords
resistor
condenser
evaporator
cooling medium
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5113480A
Other languages
English (en)
Japanese (ja)
Other versions
JPS56147456A (en
Inventor
Haruo Tetsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5113480A priority Critical patent/JPS56147456A/ja
Publication of JPS56147456A publication Critical patent/JPS56147456A/ja
Publication of JPH0147013B2 publication Critical patent/JPH0147013B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP5113480A 1980-04-16 1980-04-16 Semiconductor device Granted JPS56147456A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5113480A JPS56147456A (en) 1980-04-16 1980-04-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5113480A JPS56147456A (en) 1980-04-16 1980-04-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS56147456A JPS56147456A (en) 1981-11-16
JPH0147013B2 true JPH0147013B2 (en)) 1989-10-12

Family

ID=12878338

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5113480A Granted JPS56147456A (en) 1980-04-16 1980-04-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56147456A (en))

Also Published As

Publication number Publication date
JPS56147456A (en) 1981-11-16

Similar Documents

Publication Publication Date Title
US4502286A (en) Constant pressure type boiling cooling system
US3761599A (en) Means for reducing eddy current heating of a tank in electric apparatus
US4036291A (en) Cooling device for electric device
US3035419A (en) Cooling device
US2958021A (en) Cooling arrangement for transistor
US3852805A (en) Heat-pipe cooled power semiconductor device assembly having integral semiconductor device evaporating surface unit
JPH0563954B2 (en))
US3852803A (en) Heat sink cooled power semiconductor device assembly having liquid metal interface
US4260014A (en) Ebullient cooled power devices
US4899211A (en) Semiconductor cooling mechanisms
US4862321A (en) Cooling system for heating body
US3168137A (en) Heat exchanger
JPH0147013B2 (en))
JPS5749787A (en) Boiling cooler
US3141621A (en) Luminaire with lamp temperature control
JP3456713B2 (ja) 半導体素子冷却ユニット
JPH03283454A (ja) 半導体冷却装置
JPS6130292Y2 (en))
JPH0364950A (ja) 電気絶縁ヒートパイプ
JPS5941307B2 (ja) 半導体素子用沸騰冷却装置
JPH04196154A (ja) 半導体冷却装置
JPS59195810A (ja) 沸とう冷却式変圧器
JPS6131622B2 (en))
JPS6011422Y2 (ja) 蒸発冷却機器
JP2002357393A (ja) 液冷型半導体モジュール