JPH0143435B2 - - Google Patents
Info
- Publication number
- JPH0143435B2 JPH0143435B2 JP55130110A JP13011080A JPH0143435B2 JP H0143435 B2 JPH0143435 B2 JP H0143435B2 JP 55130110 A JP55130110 A JP 55130110A JP 13011080 A JP13011080 A JP 13011080A JP H0143435 B2 JPH0143435 B2 JP H0143435B2
- Authority
- JP
- Japan
- Prior art keywords
- peeled
- lead wire
- coated
- section
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
Description
【発明の詳細な説明】
この発明は、被覆リード線の被覆を剥離し、こ
の剥離した部分に引続いてはんだめつきするとと
もに順次切断を施す被覆リード線の処理方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for processing a covered lead wire, in which the covering of the covered lead wire is peeled off, and the peeled portion is subsequently soldered and sequentially cut.
周知のとおり、電子機器の配線に用いるエナメ
ル線あるいはフオルマル線等の被覆リード線は、
その端末部分を、はんだ付けを容易にするため、
はんだめつきを施している。そして、これらの電
子機器に使用する被覆リード線は、防食、防錆の
ため被覆された後、巻回されて保存されている。 As is well known, coated lead wires such as enamelled wires or formal wires used for wiring electronic devices are
To make the terminal part easier to solder,
It is soldered. The coated lead wires used in these electronic devices are coated to prevent corrosion and rust, and then are wound and stored.
ところで、被覆リード線の表面に被覆された部
分は、絶縁性であるため、はんだ付けを施す部分
の被覆を剥離する必要がある。しかしながら、こ
の被覆部分の剥離する方法として、従来は苛性ソ
ーダのような剥離剤に当該部分を浸漬させて被覆
部分を剥離する化学手段か、サンドペーパ等の機
械的手段により剥離することが一般的であり、化
学的手段による前者の場合は、公害による環境破
壊を伴い、後者の場合は線体に傷を付けたりする
不都合があつた。 By the way, since the portion coated on the surface of the covered lead wire is insulating, it is necessary to peel off the coating from the portion to be soldered. However, the conventional methods for removing this coated portion have been to immerse the coated portion in a stripping agent such as caustic soda and peel the coated portion using chemical means or mechanical means such as sandpaper. In the former case, using chemical means, it was accompanied by environmental destruction due to pollution, and in the latter case, there were inconveniences such as damage to the wire.
この発明は上記の点にかんがみなされたもの
で、被覆リード線の被覆が熱溶解により容易に剥
離されることから、熱溶解により被覆を剥離した
後、この剥離部分にはんだめつきを施し、その
後、切断する処理方法を提供するものである。以
下、この発明を図面に基づいて説明する。 This invention was developed in consideration of the above points, and since the coating of the covered lead wire is easily peeled off by hot melting, after the coating is peeled off by hot melting, this peeled part is soldered, After that, a processing method for cutting is provided. The present invention will be explained below based on the drawings.
第１図はこの発明の一実施例を示す被覆リード
線の処理工程のブロツク図である。この図で、１
はエナメルあるいはフオルマルにより被覆され、
巻回されている被覆リード線、２は前記被覆リー
ド線１を軸架した筐体で、この筐体２から被覆リ
ード線１が搬送手段により導出し、ローラ（図示
せず）により保持され、搬送される。３は高周波
加熱により前記被覆リード線１の被覆を溶解する
加熱溶解部で、この加熱溶解部３は不活性ガス雰
囲気４で覆われている。搬送手段により導出され
た被覆リード線１は、加熱溶解部３で一時停止し
て所定時間加熱されるので、被覆が溶解して剥離
され剥離部を形成する。被覆リード線１はさらに
引続いて搬送され、酸洗部５、水洗部６、フラツ
クス処理部７を経て、上記剥離部がはんだめつき
部８ではんだめつきされ、このはんだめつきされ
た部分の中央で切断される。 FIG. 1 is a block diagram of a process for processing a covered lead wire according to an embodiment of the present invention. In this diagram, 1
is covered with enamel or formal,
The coated lead wire 2 being wound is a housing in which the coated lead wire 1 is mounted, and the coated lead wire 1 is led out from the housing 2 by a conveying means and held by a roller (not shown). transported. Reference numeral 3 denotes a heating melting section which melts the coating of the covered lead wire 1 by high frequency heating, and this heating melting section 3 is covered with an inert gas atmosphere 4. The coated lead wire 1 led out by the conveying means is temporarily stopped at the heating and melting section 3 and heated for a predetermined time, so that the coating is melted and peeled off to form a peeled section. The coated lead wire 1 is further conveyed successively, passes through a pickling section 5, a water washing section 6, and a flux processing section 7, and the peeled section is soldered at a solder plating section 8, and the soldered lead wire 1 is soldered. It will be cut in the middle of the cut section.
第２図は第１図の加熱溶解によりリード線１の
被覆の剥離部１ａと被覆が剥離されないで残つて
いる部分１ｂを示すもので、この剥離部１ａには
んだめつきされ、その中央で切断される。 Figure 2 shows the peeled part 1a of the coating of the lead wire 1 due to heating and melting in Figure 1, and the remaining part 1b where the coating is not peeled off. disconnected.
以上説明したようにこの発明は、被覆リード線
の所定部分を不活性ガス雰囲気中で高周波加熱に
より被覆リード線の被覆を溶解して所定の間隔で
剥離部を形成した後、搬送手段により引続いて剥
離部分にはんだめつきを施し、その後、剥離部の
中央で順次切断するようにしたので、機械的手段
による剥離のように被覆リード線を損傷すること
がなく、かつ、両端が処理された均一な品質の被
覆リード線が自動的に得られる利点を有する。 As explained above, the present invention melts the coating of a predetermined portion of a coated lead wire by high-frequency heating in an inert gas atmosphere to form peeled portions at predetermined intervals, and then continues the process using a conveying means. Since the peeled part is soldered using a method of soldering, and then the lead wires are sequentially cut at the center of the peeled part, the covered lead wire is not damaged as would be the case when peeling is done by mechanical means, and both ends are treated. This method has the advantage that coated lead wires of uniform quality can be automatically obtained.
さらに、この発明は、高周波加熱により被覆を
溶解除去するので、除去された被覆の端面が心線
になめらかに密着するので、端末処理を必要とせ
ずに直ちに次の工程であるめつき処理に入ること
ができ、全体としてきわめて生産性を向上できる
効果がある。 Furthermore, in this invention, since the coating is melted and removed by high-frequency heating, the end face of the removed coating adheres smoothly to the core wire, so the next step, plating process, can be started immediately without the need for terminal treatment. This has the effect of significantly improving productivity as a whole.
第１図はこの発明の一実施例を示す被覆リード
線の処理工程を示すブロツク図、第２図は第１図
の処理方法で被覆リード線の剥離部を示す図であ
る。
図中、１はリード線、１ａは剥離部、１ｂは剥
離されない部分、２は筐体、３は加熱溶解部、４
は不活性ガス雰囲気、５は酸洗部、６は水洗部、
７はフラツクス処理部、８ははんだめつき部であ
る。
FIG. 1 is a block diagram showing a processing step for a covered lead wire according to an embodiment of the present invention, and FIG. 2 is a diagram showing a peeled portion of the covered lead wire in the processing method shown in FIG. In the figure, 1 is a lead wire, 1a is a peeled part, 1b is a part that is not peeled off, 2 is a housing, 3 is a heating melting part, 4
is an inert gas atmosphere, 5 is a pickling section, 6 is a water washing section,
7 is a flux processing section, and 8 is a solder plating section.
Claims (1)
ード線の所定個所を不活性ガス雰囲気中で高周波
加熱により溶解して所定間隔で順次剥離部を形成
した後、前記搬送中において引続いて前記各剥離
部にはんだめつきを施した後、それぞれの剥離部
の中央で順次切断して両端にはんだめつきが施さ
れた剥離部を有する所定長の被覆リード線を連続
して得ることを特徴とする被覆リード線の処理方
法。1. After melting predetermined portions of a long coated lead wire held and conveyed by the conveying means by high-frequency heating in an inert gas atmosphere to form peeled portions at predetermined intervals, successively apply each of the above during the conveyance. After applying solder to the peeled parts, each peeled part is sequentially cut at the center to continuously obtain a predetermined length of covered lead wire having peeled parts with solder applied at both ends. Characteristic treatment method for coated lead wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55130110A JPS5755080A (en) | 1980-09-20 | 1980-09-20 | Method of treating coated lead wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55130110A JPS5755080A (en) | 1980-09-20 | 1980-09-20 | Method of treating coated lead wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5755080A JPS5755080A (en) | 1982-04-01 |
| JPH0143435B2 true JPH0143435B2 (en) | 1989-09-20 |
Family
ID=15026181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55130110A Granted JPS5755080A (en) | 1980-09-20 | 1980-09-20 | Method of treating coated lead wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5755080A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11691833B2 (en) | 2020-06-12 | 2023-07-04 | Ricoh Company, Ltd. | Sheet conveying device, image reading device incorporating the sheet conveying device, and image forming apparatus incorporating the sheet conveying device |
-
1980
- 1980-09-20 JP JP55130110A patent/JPS5755080A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11691833B2 (en) | 2020-06-12 | 2023-07-04 | Ricoh Company, Ltd. | Sheet conveying device, image reading device incorporating the sheet conveying device, and image forming apparatus incorporating the sheet conveying device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5755080A (en) | 1982-04-01 |
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