JPH0142907Y2 - - Google Patents
Info
- Publication number
- JPH0142907Y2 JPH0142907Y2 JP1984168481U JP16848184U JPH0142907Y2 JP H0142907 Y2 JPH0142907 Y2 JP H0142907Y2 JP 1984168481 U JP1984168481 U JP 1984168481U JP 16848184 U JP16848184 U JP 16848184U JP H0142907 Y2 JPH0142907 Y2 JP H0142907Y2
- Authority
- JP
- Japan
- Prior art keywords
- layered
- conductor
- insulating substrate
- fuse element
- slit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 43
- 239000000758 substrate Substances 0.000 claims description 17
- 230000008018 melting Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Fuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984168481U JPH0142907Y2 (no) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1984168481U JPH0142907Y2 (no) | 1984-11-05 | 1984-11-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6182375U JPS6182375U (no) | 1986-05-31 |
JPH0142907Y2 true JPH0142907Y2 (no) | 1989-12-14 |
Family
ID=30726250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1984168481U Expired JPH0142907Y2 (no) | 1984-11-05 | 1984-11-05 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0142907Y2 (no) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5738877U (no) * | 1980-08-09 | 1982-03-02 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58186570U (ja) * | 1982-06-04 | 1983-12-12 | ロ−ム株式会社 | 回路基板用リ−ド端子取付装置 |
-
1984
- 1984-11-05 JP JP1984168481U patent/JPH0142907Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5738877U (no) * | 1980-08-09 | 1982-03-02 |
Also Published As
Publication number | Publication date |
---|---|
JPS6182375U (no) | 1986-05-31 |
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