JPH0139649B2 - - Google Patents
Info
- Publication number
- JPH0139649B2 JPH0139649B2 JP59069490A JP6949084A JPH0139649B2 JP H0139649 B2 JPH0139649 B2 JP H0139649B2 JP 59069490 A JP59069490 A JP 59069490A JP 6949084 A JP6949084 A JP 6949084A JP H0139649 B2 JPH0139649 B2 JP H0139649B2
- Authority
- JP
- Japan
- Prior art keywords
- level
- etching
- period
- signal
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6949084A JPS60213028A (ja) | 1984-04-06 | 1984-04-06 | 終点検出方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6949084A JPS60213028A (ja) | 1984-04-06 | 1984-04-06 | 終点検出方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60213028A JPS60213028A (ja) | 1985-10-25 |
JPH0139649B2 true JPH0139649B2 (enrdf_load_stackoverflow) | 1989-08-22 |
Family
ID=13404197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6949084A Granted JPS60213028A (ja) | 1984-04-06 | 1984-04-06 | 終点検出方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60213028A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107919273A (zh) * | 2017-11-20 | 2018-04-17 | 上海陛通半导体能源科技股份有限公司 | 一种刻蚀终点确定方法、晶圆刻蚀方法以及刻蚀系统 |
-
1984
- 1984-04-06 JP JP6949084A patent/JPS60213028A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS60213028A (ja) | 1985-10-25 |
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