JPH0136990B2 - - Google Patents

Info

Publication number
JPH0136990B2
JPH0136990B2 JP20892683A JP20892683A JPH0136990B2 JP H0136990 B2 JPH0136990 B2 JP H0136990B2 JP 20892683 A JP20892683 A JP 20892683A JP 20892683 A JP20892683 A JP 20892683A JP H0136990 B2 JPH0136990 B2 JP H0136990B2
Authority
JP
Japan
Prior art keywords
single crystal
cutting
cleavage
wafer
cutting tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP20892683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60102786A (ja
Inventor
Ichiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58208926A priority Critical patent/JPS60102786A/ja
Publication of JPS60102786A publication Critical patent/JPS60102786A/ja
Publication of JPH0136990B2 publication Critical patent/JPH0136990B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Semiconductor Lasers (AREA)
  • Dicing (AREA)
JP58208926A 1983-11-09 1983-11-09 棒状単結晶体製造方法 Granted JPS60102786A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58208926A JPS60102786A (ja) 1983-11-09 1983-11-09 棒状単結晶体製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58208926A JPS60102786A (ja) 1983-11-09 1983-11-09 棒状単結晶体製造方法

Publications (2)

Publication Number Publication Date
JPS60102786A JPS60102786A (ja) 1985-06-06
JPH0136990B2 true JPH0136990B2 (enrdf_load_stackoverflow) 1989-08-03

Family

ID=16564411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58208926A Granted JPS60102786A (ja) 1983-11-09 1983-11-09 棒状単結晶体製造方法

Country Status (1)

Country Link
JP (1) JPS60102786A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2524896Y2 (ja) * 1987-02-17 1997-02-05 日本電気株式会社 円形化合物半導体基板
KR101990013B1 (ko) * 2019-01-16 2019-06-17 김멋진 절단용 블레이드 및 이를 이용한 절단장치

Also Published As

Publication number Publication date
JPS60102786A (ja) 1985-06-06

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