JPH0132799Y2 - - Google Patents

Info

Publication number

JPH0132799Y2

JPH0132799Y2 JP3561485U JP3561485U JPH0132799Y2 JP H0132799 Y2 JPH0132799 Y2 JP H0132799Y2 JP 3561485 U JP3561485 U JP 3561485U JP 3561485 U JP3561485 U JP 3561485U JP H0132799 Y2 JPH0132799 Y2 JP H0132799Y2

Authority

JP

Japan

Prior art keywords

printed circuit

circuit board

partition

cover plate

shelf

Prior art date

1985-03-13

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

• Espacenet
• Global Dossier
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• 238000005192 partition Methods 0.000 claims description 30
• 239000004020 conductor Substances 0.000 claims description 2
• 229920001971 elastomer Polymers 0.000 description 7
• 239000005060 rubber Substances 0.000 description 7
• NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 3
• 239000000463 material Substances 0.000 description 3
• 239000002184 metal Substances 0.000 description 2
• 229910052751 metal Inorganic materials 0.000 description 2
• 229910001369 Brass Inorganic materials 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000010951 brass Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• 239000000843 powder Substances 0.000 description 1
• 229920003051 synthetic elastomer Polymers 0.000 description 1
• 239000005061 synthetic rubber Substances 0.000 description 1
• XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1