JPH01319968A - Substrate holder - Google Patents
Substrate holderInfo
- Publication number
- JPH01319968A JPH01319968A JP63153184A JP15318488A JPH01319968A JP H01319968 A JPH01319968 A JP H01319968A JP 63153184 A JP63153184 A JP 63153184A JP 15318488 A JP15318488 A JP 15318488A JP H01319968 A JPH01319968 A JP H01319968A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- substrate support
- support bars
- section
- irregular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 89
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- 230000001788 irregular Effects 0.000 abstract 5
- 230000009191 jumping Effects 0.000 abstract 1
- 239000011295 pitch Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 10
- 230000005484 gravity Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、基板をあるカセット治具から別のカセット治
具へ移し替える際に用いる基板保持に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a substrate holding device used when transferring a substrate from one cassette jig to another.
従来の技術
近年、基板保持装置は、半導体工場の拡散炉工程におい
て、運搬用テフロンカセットと処理用石英ボートの間で
、シリコンウェハーを移し替、える際使用されている。2. Description of the Related Art In recent years, substrate holding devices have been used to transfer silicon wafers between a Teflon cassette for transportation and a quartz boat for processing in the diffusion furnace process of a semiconductor factory.
以下図面を参照しながら、従来の基板保持装置の一例に
ついて説明する。An example of a conventional substrate holding device will be described below with reference to the drawings.
第４図は従来の基板保持装置の斜視図である。FIG. 4 is a perspective view of a conventional substrate holding device.
同図において、１け基板（シリコンウェハ）テする。２
けウェハチャックロッド（基板支持棒）で円柱形の部品
である。２け基板チャック板（ウェハチャック板）で、
基板１を保持した時、隣勺合う基板１どうしが接触しな
いための溝部が設けられている。そして基板チャック板
２の開口部３に円柱形の基板支持棒（ウェハチャックロ
ッド）４を組み込むことによ夕、基板１を保持すること
ができる。In the figure, one substrate (silicon wafer) is shown. 2
The wafer chuck rod (substrate support rod) is a cylindrical part. With 2 substrate chuck plates (wafer chuck plates),
A groove is provided to prevent adjacent substrates 1 from coming into contact with each other when the substrates 1 are held. By incorporating a cylindrical substrate support rod (wafer chuck rod) 4 into the opening 3 of the substrate chuck plate 2, the substrate 1 can be held.
第５図は第４図の断面図であるが、その動作について以
下説明すも基板１Ｖｉ、向い合った１対の基板チャック
板２と、それに組み込まれた基板支持棒４によって保持
されている。重力方向の規制は基板支持棒４により、横
倒れ方向の規制は基板チャック板２の溝部によシ行われ
ている。FIG. 5 is a sectional view of FIG. 4, and its operation will be described below. The substrate 1Vi is held by a pair of opposing substrate chuck plates 2 and a substrate support rod 4 incorporated therein. Regulation in the direction of gravity is done by the substrate support rod 4, and regulation in the direction of lateral falling is done by the grooves in the substrate chuck plate 2.
次に基板１の保持を解除する方法について説明する。基
板支持棒４間の最短距離を基板１の直径以上に広げるよ
う基板チャック板２の間隔を広げる。これに、ｌ、シリ
コンウェハの重力方向に保持は解除される。従って、数
枚の基板１を同時に一括移し替えることが可能である。Next, a method for releasing the holding of the substrate 1 will be explained. The spacing between the substrate chuck plates 2 is widened so that the shortest distance between the substrate support rods 4 is greater than the diameter of the substrate 1. At this time, the holding in the direction of gravity of the silicon wafer is released. Therefore, it is possible to transfer several substrates 1 at once.
発明が解決しようとする課題
しかしながら上記のような構成では、基板チャック板２
の間に存在する数枚の基板１の保持、あるいけ保持解除
が、−括でしか行えないために、基板間隔の変更に対応
不可能という課題を有していた。Problems to be Solved by the Invention However, in the above configuration, the substrate chuck plate 2
Since the holding and/or release of the holding of the several boards 1 existing between them can only be done in batches, there is a problem in that it is impossible to cope with changes in the board spacing.
本発明け、上記課題に鑑み、基板チャック板の間に存在
する数枚の基板のうち、任意の基板を保持あるいけ保持
解除が行える基板保持装置を提供することを目的とする
。SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a substrate holding device that can hold or release any desired substrate among several substrates present between substrate chuck plates.
課題を解決するための手段
この目的を達成するため本発明の基板保持装置は、開口
部を有するとともに複数の溝部が設けられた１対の基板
チャック板と、前記基板チャック板の開口部に挿入され
る凹凸部を有する基板支持棒とを備えてなるものである
。Means for Solving the Problems To achieve this object, the substrate holding device of the present invention includes a pair of substrate chuck plates each having an opening and provided with a plurality of grooves, and a substrate holding device that is inserted into the opening of the substrate chuck plate. and a substrate support rod having a concavo-convex portion.
作 用
この構成によって、基板チャック板のａｔ１部に設けら
れた基板について、任意に保持、あるいけ保持解除が可
能となる。Function: With this configuration, it becomes possible to arbitrarily hold and release the substrate provided at the at1 portion of the substrate chuck plate.
実施例
以下本発明の一実施例における基板保持装置について図
面をお照しながら説明する。EXAMPLE Hereinafter, a substrate holding device according to an example of the present invention will be described with reference to the drawings.
第１図は、本発明の一実施例における基板保持装置の斜
視図であ夛、第２図、第３図は同断面図である。第１図
において、５は基板（シリコンウェハ）である。６ｆｉ
基板チヤツク板（ウェハチャック板）で、基板６を保持
した時隣り合うシリコンウェハどうしが接触しないため
の溝部が設けられている。８は基板チャック板６の開口
部７に挿入される基板支持棒で回転軸と平行の凹凸部の
列が６００ごとに３列設けられている。また基板支持棒
８け基板チャック板６の開口部７に挿入された状態で外
力によ勺回転可能である。FIG. 1 is a perspective view of a substrate holding device according to an embodiment of the present invention, and FIGS. 2 and 3 are sectional views thereof. In FIG. 1, 5 is a substrate (silicon wafer). 6fi
A substrate chuck plate (wafer chuck plate) is provided with grooves to prevent adjacent silicon wafers from coming into contact with each other when the substrate 6 is held. Reference numeral 8 denotes a substrate support rod inserted into the opening 7 of the substrate chuck plate 6, and three rows of concave and convex portions parallel to the rotation axis are provided every 600. In addition, the eight substrate support rods can be rotated by external force while inserted into the opening 7 of the substrate chuck plate 6.
以下、その動作について、第２図、第３図に基づき説明
する。まず、基板チャック板６のある箇所の溝部におけ
る基板６と基板支持棒８の凹凸部の関係が、第２図のよ
うな場合、すなわち、基板支持棒８のそれぞれの凸部と
凸部との間隔よフ基板６の直径の方が大きい場合は基板
６を保持する。The operation will be explained below based on FIGS. 2 and 3. First, if the relationship between the concave and convex portions of the substrate 6 and the substrate support rod 8 in the groove portion of the substrate chuck plate 6 is as shown in FIG. If the diameter of the substrate 6 is larger than the distance, the substrate 6 is held.
一方、チャックロッドをそれぞれ６０°回転させた場合
（第３図）、すなわち、基板支持棒８のそれぞれの凹部
と凹部との間隔を基板の直径より大 ・きくした場合基
板６は保持解除を行うものである。On the other hand, when the chuck rods are each rotated by 60 degrees (Fig. 3), that is, when the distance between each concave part of the substrate support rod 8 is made larger than the diameter of the substrate, the substrate 6 is released from holding. It is something.
基板チャック板６の全ての溝に対して、基板支持棒８が
この凹凸部を有することによ勺、ピッチとばし用の基板
チャックとなる。Since the substrate support rod 8 has these uneven portions in all the grooves of the substrate chuck plate 6, it becomes a substrate chuck for increasing pitch.
以上のように本実施例によれば、基板支持棒８が凹凸部
を有し、かつ、回転動作によりその凹凸列を切シ換える
ことにより任意のシリコンウェハの保持、あるいけ保持
解除を行うことができる。As described above, according to this embodiment, the substrate support rod 8 has a concave and convex portion, and by switching the concave and convex rows through rotational movement, it is possible to hold or release a desired silicon wafer. I can do it.
なお、本実施例では凹凸部を６０Ｑごとに６列設けたが
、６列でなくてもよいことはいうまでもない。In this embodiment, six rows of uneven portions are provided every 60Q, but it goes without saying that the number of rows does not have to be six.
発明の効果
以上のように本発明は、基板チャック板と基板支持棒と
からなる基板チャック部において、基板支持棒に凹凸部
を設けることＫよフ、その凹凸部パターンに一致した基
板を選択しチャックすることができ、また、この基板支
持棒を回転させることによシ、基板選択のパターンを変
えることができる。Effects of the Invention As described above, the present invention provides a substrate chuck unit consisting of a substrate chuck plate and a substrate support rod, in which the substrate support rod is provided with an uneven portion, and a substrate matching the pattern of the uneven portion is selected. By rotating this substrate support rod, the substrate selection pattern can be changed.
第１図は本発明の一実施例における基板保持装置の斜視
図、第２図、第３図は同断面図、第４図は従来の基板保
持装置の斜視図、第５図は同断面図である。
６・・・・・・基板、６・・・・・・基板チャック板、
７・・・・・・開口部、８・・・・・・基板支持棒。FIG. 1 is a perspective view of a substrate holding device according to an embodiment of the present invention, FIGS. 2 and 3 are sectional views thereof, FIG. 4 is a perspective view of a conventional substrate holding device, and FIG. 5 is a sectional view thereof. It is. 6... Board, 6... Board chuck plate,
7... Opening, 8... Board support rod.
Claims (2)
１対の基板チャック板と、前記基板チャック板の開口部
に挿入される凹凸部を有する基板支持棒とを備えてなる
基板保持装置。(1) A substrate holding device comprising a pair of substrate chuck plates having an opening and provided with a plurality of grooves, and a substrate support rod having an uneven portion inserted into the opening of the substrate chuck plate.
保持装置。(2) The substrate holding device according to claim 1, wherein the substrate support rod is rotatable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63153184A JPH01319968A (en) | 1988-06-21 | 1988-06-21 | Substrate holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63153184A JPH01319968A (en) | 1988-06-21 | 1988-06-21 | Substrate holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01319968A true JPH01319968A (en) | 1989-12-26 |
Family
ID=15556880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63153184A Pending JPH01319968A (en) | 1988-06-21 | 1988-06-21 | Substrate holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01319968A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6045031A (en) * | 1983-08-22 | 1985-03-11 | Tomuko:Kk | Automatic wafer transfer machine |
| JPS60258459A (en) * | 1984-06-04 | 1985-12-20 | Deisuko Saiyaa Japan:Kk | Transferring apparatus of wafer for vertical type heat-treating furnace |
-
1988
- 1988-06-21 JP JP63153184A patent/JPH01319968A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6045031A (en) * | 1983-08-22 | 1985-03-11 | Tomuko:Kk | Automatic wafer transfer machine |
| JPS60258459A (en) * | 1984-06-04 | 1985-12-20 | Deisuko Saiyaa Japan:Kk | Transferring apparatus of wafer for vertical type heat-treating furnace |
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