JPH01307204A - Label mark forming method for electronic component - Google Patents
Label mark forming method for electronic componentInfo
- Publication number
- JPH01307204A JPH01307204A JP63138067A JP13806788A JPH01307204A JP H01307204 A JPH01307204 A JP H01307204A JP 63138067 A JP63138067 A JP 63138067A JP 13806788 A JP13806788 A JP 13806788A JP H01307204 A JPH01307204 A JP H01307204A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electronic component
- mark
- laser light
- deposited film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 12
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 abstract description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 17
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000002344 surface layer Substances 0.000 description 4
- 238000010330 laser marking Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/262—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used recording or marking of inorganic surfaces or materials, e.g. glass, metal, or ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、電子部品の特性表示等の表示マーク形成方法
に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for forming display marks for displaying characteristics of electronic components, etc.
〈従来の技術〉
従来、電子部品の特性を表す記号、数字等のマークの表
示は、オフセット印刷によってインクを電子部品表面に
転写し、これを熱もしくは紫外線によって硬化させて定
着させる方法が行なわれていた。<Conventional technology> Conventionally, marks such as symbols and numbers representing the characteristics of electronic components have been displayed by transferring ink onto the surface of the electronic component using offset printing, and then curing and fixing the ink using heat or ultraviolet rays. was.
しかし、この方法は、（イ）表示マークの微少化に限界
があり近年の電子部品の小形化に対応しにくい、（ロ）
凹凸のある電子部品では印刷できない、（ハ）電子部品
の種類毎に印版を準備してこれを印刷装置にセットする
必要かある、といった問題があった。However, this method (a) has a limit to miniaturization of display marks and is difficult to respond to the miniaturization of electronic components in recent years; (b)
There have been problems such as the inability to print on electronic components that have unevenness, and (c) the need to prepare printing plates for each type of electronic component and set them in the printing device.
そこで最近は、ＣＯ，、ＹＡＧ等のレーザー光を照射す
ることによって表示マークを電子部品表面に刻むレーザ
ーマーキング法が用いられるようになってきた。これは
、第３図に示すように、マスク３０を介して電子部品３
２の表面の外装膜３４にレーザー光３６を照射し、外装
膜３４表面部分の一部を蒸発させて削り取り、表示マー
クを形成するものである。Therefore, recently, a laser marking method has been used in which display marks are carved on the surface of electronic components by irradiating CO, YAG, etc. laser light. As shown in FIG.
A laser beam 36 is irradiated onto the exterior film 34 on the surface of the exterior film 34 to evaporate and scrape off a portion of the surface of the exterior film 34, thereby forming an indication mark.
これにより、微細な表示マークを形成することが可能に
なり電子部品の小形化に対応できるようになった。また
、凹凸のある電子部品にも表示マークを形成できるよう
になった。そのうえ、レーザー光源と電子部品との間で
偏平なマスク３０を入れ換えるだけで、異なる種類の電
子部品に対応できるようになった。This has made it possible to form minute display marks, making it possible to respond to the miniaturization of electronic components. It has also become possible to form display marks on electronic components with uneven surfaces. Moreover, it is now possible to handle different types of electronic components by simply replacing the flat mask 30 between the laser light source and the electronic component.
〈発明が解決しようとする課題〉
しかし、この従来のレーザーマーキング法には、以下の
ような不都合があった。<Problems to be Solved by the Invention> However, this conventional laser marking method has the following disadvantages.
レーザー光により電子部品表面の外装膜３４を削り取る
だけなので、表示マークは色の変化がほとんどない。し
いていえば、外装膜３４の充填剤の色調が表面の乱反射
のため若干白くなったりする程度である。そのため、表
示マークの判読がしにくく、特に、電子部品表面の外装
膜の色が淡色系である場合、表示マークとその周囲との
色のコントラストが弱く、表示マークが判読できないこ
とがあった。Since the exterior film 34 on the surface of the electronic component is simply scraped off by the laser beam, there is almost no change in color of the display mark. In other words, the color tone of the filler in the exterior film 34 becomes slightly white due to the diffused reflection on the surface. Therefore, it is difficult to read the display mark, and in particular, when the color of the exterior film on the surface of the electronic component is light-colored, the color contrast between the display mark and its surroundings is weak, and the display mark may not be legible.
本発明は、上述の課題に鑑みてなされたものであって、
レーザーマーキング法による特性表示マークを鮮明にす
ることができる電子部品の表示マーク於成方法を提供す
ることを目的とする。The present invention has been made in view of the above-mentioned problems, and includes:
An object of the present invention is to provide a method for forming a display mark on an electronic component, which can make a characteristic display mark by a laser marking method clear.
〈問題点を解決するための手段〉
本発明は、上記の目的を達成するために、電子部品表面
の外装膜中に金属膜を埋設する工程と、前記外装膜表面
にレーザー光を照射して金属膜の一部を所定の形状に露
出させる工程とを含んで電子部品の製造方法を構成した
。<Means for Solving the Problems> In order to achieve the above object, the present invention includes a step of embedding a metal film in an exterior film on the surface of an electronic component, and irradiating the surface of the exterior film with a laser beam. A method for manufacturing an electronic component is configured including a step of exposing a part of a metal film in a predetermined shape.
く作用〉
上記方法によれば、レーザー光の照射によって電子部品
表面に金属膜の一部が露出され、この金属膜の露出部は
、その周囲の外装膜と色調が異なるので明確に識別され
るようになる。According to the above method, a part of the metal film is exposed on the surface of the electronic component by laser light irradiation, and the exposed part of the metal film has a different color tone from the surrounding exterior film, so it can be clearly identified. It becomes like this.
〈実施例〉
以下、本発明を図面に示す実施例に基づいて詳細に説明
する。第１図は本発明の製造方法を実施したチップ抵抗
器の一部切り欠き平面図、第２図（Ａ）、第２図（Ｂ）
、第２図（Ｃ）はその各工程を示す断面図である。<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings. FIG. 1 is a partially cutaway plan view of a chip resistor manufactured by the manufacturing method of the present invention, FIG. 2(A), FIG. 2(B)
, FIG. 2(C) is a sectional view showing each step.
この実施例に係るチップ抵抗器ｌの表面部は、両端の電
極２．２を除き、樹脂からなる外装膜５で覆われており
、この外装膜５の内部に金属膜であるアルミニウム蒸着
膜３が埋設されている。外装膜５には、アルミニウム蒸
着膜３より表側の外装＠５を所定の形状で除去してアル
ミニウム蒸着膜３を露出させることにより、特性を表示
する表示マーク７が形状されている。The surface of the chip resistor l according to this embodiment, except for the electrodes 2.2 at both ends, is covered with an exterior film 5 made of resin. is buried. The exterior film 5 is formed with an indicator mark 7 that indicates characteristics by removing the exterior @ 5 on the front side of the aluminum vapor deposition film 3 in a predetermined shape to expose the aluminum vapor deposition film 3.
次に、このチップ抵抗器における表示マークの形成方法
を第２図（Ａ ）、（Ｂ ）、（Ｃ）に基づいて説明す
る。Next, a method for forming display marks on this chip resistor will be explained based on FIGS. 2(A), (B), and (C).
まず、第２図（Ａ）に示すように、素体１１上に外装膜
５の内装部分５ａを形成し、この内装部分５ａ上に帯状
にアルミニウム蒸着膜３を形成する。First, as shown in FIG. 2(A), the interior portion 5a of the exterior film 5 is formed on the element body 11, and the aluminum vapor deposited film 3 is formed in a band shape on the interior portion 5a.
そのあと、第２図（Ｂ）に示すように、アルミニウム蒸
着膜３表面に外装膜５の表層部分５ｂを形成し、アルミ
ニウム蒸着＠３を覆う。このとき、表層部分５ｂの厚さ
は後述するレーザー光の照射によって完全に削り取られ
、かつアルミニウム蒸着膜３の色が表面側に現れないよ
うに、１０〜３０μ程度にするのが望ましい。Thereafter, as shown in FIG. 2(B), a surface layer portion 5b of the exterior film 5 is formed on the surface of the aluminum vapor deposited film 3 to cover the aluminum vapor deposited @3. At this time, the thickness of the surface layer portion 5b is desirably about 10 to 30 .mu.m so that it can be completely scraped off by laser beam irradiation, which will be described later, and the color of the aluminum vapor deposited film 3 does not appear on the surface side.
このようにして、アルミニウム蒸着膜３及び外装膜５で
覆われたチップ抵抗器１の中央部の上面に第２図（Ｃ）
に示すように、マスク！３を介してＣｏ、、ＹＡＧ等の
レーザー光１５を照射する。このとき、レーザー光１５
の照射強さは、表層の外層膜５だけが焼損し次層のアル
ミニウム蒸着膜３が焼損しない程度に調整する。このよ
うしてレーザー光１５が照射されると、照射された部分
の外装膜５の表層部分５ｂは蒸発するが、アルミニウム
蒸着膜３はレーザー光を反射するから、損傷せずに残り
表面に露出する。この露出アルミニウム蒸着膜３によっ
て特性表示マーク７が形成される。In this way, the upper surface of the central part of the chip resistor 1 covered with the aluminum vapor-deposited film 3 and the exterior film 5 is coated as shown in FIG. 2(C).
As shown, the mask! A laser beam 15 of Co, YAG, etc. is irradiated through the laser beam 3. At this time, the laser beam 15
The irradiation intensity is adjusted to such an extent that only the surface outer layer 5 is burnt out, but the next layer, the aluminum vapor deposited film 3, is not burned out. When the laser beam 15 is irradiated in this way, the surface layer 5b of the exterior film 5 in the irradiated area evaporates, but since the aluminum vapor deposited film 3 reflects the laser beam, it remains undamaged and exposed on the surface. do. Characteristic display marks 7 are formed by this exposed aluminum vapor deposited film 3.
アルミニウム蒸着膜３は、金属光沢を有し周囲の外装膜
５とは色調が異なっているので、表示マーク７は明確に
識別することができる。Since the aluminum vapor deposited film 3 has a metallic luster and is different in color from the surrounding exterior film 5, the display mark 7 can be clearly identified.
なお、上記実施例では金属膜として、アルミニウム蒸着
膜３を形成したが、これに限るわけではなく、たとえば
、チタンの蒸着膜でもよい また、スパッタ、メツキ等
で金属膜を形成してもよいし、シートを被着してもよい
。In the above embodiment, the aluminum vapor deposited film 3 was formed as the metal film, but the metal film is not limited to this. For example, a titanium vapor deposited film may be used.Also, the metal film may be formed by sputtering, plating, etc. , a sheet may be applied.
また、外装膜５の内装部分５ａと表層部分５ｂとは別の
材料で構成してもよい。さらに、本発明は、チップ抵抗
器に限らず、外装膜を有する各種電子部品に実施するこ
とができる。Further, the interior portion 5a and the surface layer portion 5b of the exterior membrane 5 may be made of different materials. Furthermore, the present invention is not limited to chip resistors, but can be applied to various electronic components having an exterior film.
〈発明の効果〉
以上のように、本発明によれば、電子部品の外装膜中に
埋設した金属膜の一部をレーザー光照射で表面に露出さ
せその露出部で表示マークも構成するので、表示マーク
は、周囲の外装膜と色調が異なり、外装膜が淡色であっ
てもはっきりと識別することができる。したがって、表
示マークは鮮明になり、表示の誤読、判読不能といった
不都合がなくなる。<Effects of the Invention> As described above, according to the present invention, a part of the metal film embedded in the exterior film of an electronic component is exposed to the surface by laser light irradiation, and the exposed part also forms the display mark. The display mark has a different color tone from the surrounding outer coating, and can be clearly identified even if the outer coating is light-colored. Therefore, the display mark becomes clear and the inconvenience of misreading or illegibility of the display is eliminated.
第１図ないし第２図（Ａ ）、（Ｂ ）、（Ｃ）は本発
明の一実施例に係り、第１図は一部切り欠き平面図、第
２図（Ａ ）、（Ｂ ）、（Ｃ）はその各工程における
断面図である。第３図は従来例の断面図である。
１・・電子部品（チップ抵抗器）
３・・・金属膜（アルミニウム蒸着膜）５ ・外装膜
１５・・・レーザー光
出願人 株式会社 村田製作所1 to 2 (A), (B), and (C) relate to one embodiment of the present invention, in which FIG. 1 is a partially cutaway plan view, and FIG. 2 (A), (B), (C) is a sectional view at each step. FIG. 3 is a sectional view of a conventional example. 1...Electronic component (chip resistor) 3...Metal film (aluminum vapor deposited film) 5 -Exterior film 15...Laser light applicant Murata Manufacturing Co., Ltd.
Claims (1)
と、 前記外装膜表面にレーザー光を照射して金属膜の一部を
所定の形状に露出させる工程とを含むことを特徴とする
電子部品の表示マーク形成方法。(1) A method comprising: embedding a metal film in an exterior film on the surface of an electronic component; and exposing a part of the metal film in a predetermined shape by irradiating the surface of the exterior film with a laser beam. A method for forming display marks on electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63138067A JPH01307204A (en) | 1988-06-03 | 1988-06-03 | Label mark forming method for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63138067A JPH01307204A (en) | 1988-06-03 | 1988-06-03 | Label mark forming method for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01307204A true JPH01307204A (en) | 1989-12-12 |
Family
ID=15213200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63138067A Pending JPH01307204A (en) | 1988-06-03 | 1988-06-03 | Label mark forming method for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01307204A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0548428U (en) * | 1991-11-28 | 1993-06-25 | 株式会社大真空 | Crystal oscillator |
| JPH0817951A (en) * | 1994-06-27 | 1996-01-19 | Nec Corp | Semiconductor device |
| JP2003197402A (en) * | 2001-12-26 | 2003-07-11 | Kyocera Corp | Thin-film electronic component and method of manufacturing the same |
-
1988
- 1988-06-03 JP JP63138067A patent/JPH01307204A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0548428U (en) * | 1991-11-28 | 1993-06-25 | 株式会社大真空 | Crystal oscillator |
| JPH0817951A (en) * | 1994-06-27 | 1996-01-19 | Nec Corp | Semiconductor device |
| JP2003197402A (en) * | 2001-12-26 | 2003-07-11 | Kyocera Corp | Thin-film electronic component and method of manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4754128A (en) | Optical cards and processes for preparing the same | |
| JP2810950B2 (en) | How to assign a pattern to a read-only optical disk | |
| JPH05224606A (en) | Safety element and manufacture thereof | |
| JPS5950423A (en) | Spectacles lens having sign and/or mark and manufacture thereof | |
| JP3620078B2 (en) | Lottery ticket and its manufacturing method | |
| JPH01307204A (en) | Label mark forming method for electronic component | |
| JPS60157895A (en) | Protected and covered identification card | |
| JPH01214864A (en) | Printing screen and its production | |
| US4115003A (en) | Graphic aid and method and system of making reproductions therefrom | |
| JPH01145505A (en) | Thickness measurement for resist film | |
| JPS61283101A (en) | Impartment of display to electronic component | |
| CA2206364A1 (en) | Process for the manufacture of a master disk for the production of optical disk pressing matrices bearing a marking, particularly of the anti-pirate type, a master disk, a pressing matrix and the optical disk obtained | |
| JPS61107514A (en) | Manufacture of thin film magnetic head | |
| JPH01214480A (en) | Laser marking method | |
| JP3025921U (en) | Printed matter | |
| KR200387611Y1 (en) | The sticking paper for the album | |
| JPS60232503A (en) | Method for vapor-depositing retroreflecting material with silk screen mask | |
| JP2000262648A (en) | Golf ball | |
| JPS60254729A (en) | Correction of mask pattern on mask substrate | |
| JPH0466992A (en) | Manufacture of lighting displaying body | |
| JPH062606B2 (en) | Method of manufacturing mirror with display unit | |
| JPS625885A (en) | Coating material for marking and marking method | |
| JPH03208363A (en) | Correction of mark and marking | |
| JPH03156960A (en) | Semiconductor device | |
| JPH01117736U (en) |